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AMD

Designs chips for computers and AI systems

Staff Server Platform Hardware Architecture

Board & Electronics DesignConfirmed live in the last 24 hours
Full-timeBengaluru, Karnataka, IndiaNo salary listedIn-person

About the Job

Requirements

  • Deep expertise in high-speed interface design, including PCIe (Gen 4/5 minimum), DDR4/DDR5, USB 3.x, and SERDES-based interfaces.
  • Strong hands-on experience with signal integrity analysis, including pre- and post-layout simulation, eye diagram analysis, impedance modeling, and crosstalk analysis.
  • Strong hands-on experience with power integrity analysis, including PDN design, decoupling strategy, VRM placement, and DC/AC analysis.
  • Proficiency in schematic capture tools such as Cadence Allegro/OrCAD, Mentor PADS, or equivalent industry tools.
  • Practical experience guiding PCB layout engineers on routing rules, layer stack-up, via structures, differential pair routing, length matching, and return path management.
  • Experience with board bring-up and hardware debug using an oscilloscope, logic analyzer, VNA, TDR, BERT, and protocol analyzers.
  • Familiarity with EMI/EMC design practices and compliance requirements, including FCC and CE.
  • Understanding of thermal design considerations for high-power components.
  • Knowledge of manufacturing processes, including DFM, IPC standards, Gerber review, assembly, and test.
  • 15+ years of hands-on experience in PCB hardware design, with a strong focus on high-speed digital systems.
  • Demonstrated experience designing complex, multi-layer PCBs (16+ layers) for high-performance computing, server, networking, or semiconductor test and evaluation platforms.
  • Proven track record of delivering hardware designs from concept through mass production or customer deployment.

Responsibilities

  • Lead end-to-end design of high-speed, high-complexity PCBs, including schematic capture, component selection, layout guidance, and design verification.
  • Design and review high-speed interfaces including PCIe Gen 4/5/6, DDR4/5/LPDDR5, USB 3.x, MIPI, SERDES-based interfaces, Ethernet (1G/10G/25G/100G), and emerging standards.
  • Develop and own design specifications, interface requirement documents, and schematics for complex multi-layer boards (20+ layers).
  • Define and enforce PCB stack-up, impedance control, and routing rules for high-speed signal integrity compliance.
  • Drive board bring-up, debug, and validation activities, independently diagnosing and resolving complex hardware issues.
  • Perform or guide pre-layout and post-layout signal integrity and power integrity simulations using industry-standard tools.
  • Work with PCB layout engineers to ensure design intent is implemented correctly, performing detailed layout reviews and providing specific guidance.
  • Participate in early-stage architecture definition and feasibility assessment for new platform programs.
  • Evaluate new silicon devices, connectors, memory technologies, and interface standards for applicability to upcoming designs.
  • Define reference design guidelines and best practices for high-speed board design within the team.
  • Identify and propose design improvements that reduce cost, improve reliability, extend product life, or enhance testability.
  • Stay current with industry trends, emerging standards, and evolving EDA tool capabilities.
  • Serve as the technical authority and subject matter expert for high-speed board design within the team.
  • Provide technical guidance, design reviews, and mentorship to junior and mid-level hardware engineers.
  • Lead internal and cross-functional design reviews to ensure design quality, manufacturability, and compliance with system requirements.
  • Collaborate with signal integrity, firmware, mechanical, and test teams.
  • Represent the hardware design team in technical discussions with silicon vendors, EDA tool vendors, PCB fabricators, and assembly partners.
  • Define and maintain design standards, checklists, and review processes for high-speed board design.
  • Champion design for manufacturability, design for testability, and design for reliability practices.
  • Drive continuous improvement in design methodology, tool flows, and review processes.
  • Support sustaining engineering activities, including ECO management, alternate component qualification, and product improvements.

Desired Qualifications

  • Experience with FPGA-based boards, including Xilinx/AMD or Intel FPGA integration.
  • Exposure to high-speed optical or SerDes interfaces at 112G or beyond.
  • Experience with OCP/DC-SCM, OpenBMC, IPMI, or data center platform standards.
  • Familiarity with RTL or firmware development for hardware validation or embedded systems.
  • Experience with mechanical design tools and ECAD-MCAD co-design.
  • Exposure to AI/ML-based EDA tools or automation of design review and verification processes.
  • Experience in JTAG infrastructure design and boundary scan methodology.
  • A bachelor's degree or higher in Electrical Engineering, Electronics Engineering, or a closely related field.
  • A master's degree in Electrical Engineering or a related discipline.

About the Company

AMD

Designs chips for computers and AI systems

AMD designs processors, graphics chips and AI accelerators for computer makers, cloud operators and businesses that build electronic devices. Its Ryzen processors power personal computers, while EPYC processors handle work in data centers and Radeon chips render graphics. Instinct accelerators run AI models, paired with software that developers use to train models and put them into production. AMD sells chips and related computing systems through equipment makers, distributors and retail channels, and contracts with outside foundries to fabricate its semiconductor designs. It was founded in 1969 and has its headquarters in Santa Clara, California.

Company size
10,001+
Company stage
IPO
Headquarters
Santa Clara, CA
Founded
1969

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