A

AMD

Designs chips for computers and AI systems

Physical Design Lead with Static Timing Analysis

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeHyderabad, Telangana, IndiaNo salary listedIn-person

About the Job

Requirements

  • Strong self-driving ability and ability to work collaboratively with other business units, the central methodology team, and vendors to solve critical issues.
  • At least 8 years of experience in design signoff closure.
  • Strong place-and-route background, with problem-solving ability in improving power, performance, and area and debugging.
  • Technical depth in clock-tree synthesis, routing, and static timing analysis.
  • Knowledge of electromigration and IR-drop-driven power grids.
  • Experience driving place-and-route and static timing analysis signoff correlation and convergence.
  • Strong Synopsys Design Constraints coding and debugging skills.
  • Experience driving new requirements and methodology to support system-on-chip timing closure.
  • Ability to identify gaps and support flows.
  • Scripting experience with Tcl, Perl, Python, and Makefile.
  • Experience driving teams toward common requirements and flows.
  • Experience deploying and implementing machine-learning techniques and algorithms in physical design.
  • Experience with low-power physical-design implementation flows, from RTL design through synthesis, place and route, timing closure, and physical verification.
  • Experience with tools from Synopsys, Cadence, and Mentor.
  • Bachelor's or Master's degree in Computer Engineering or Electrical Engineering.

Responsibilities

  • Own subsystem partitions' place-and-route execution and closure.
  • Drive new improvements in closure.
  • Analyze data and provide feedback to the design team.
  • Work with place-and-route team members to converge on closure from synthesis through routing.
  • Sign off closure for static timing analysis, electromigration and IR drop, and physical verification.
  • Collaborate with business units, computer-aided design, and central methodology teams to drive requirements.
  • Automate and improve design signoff requirements and dashboarding.
  • Organize and present complex technical information clearly and concisely.
  • Interact with internal power, performance, and area teams.
  • Identify best practices across AMD and the industry to update and improve flows and project settings.
  • Increase the competitiveness of each stage in AMD's design flow.
  • Work with multi-level functional teams across geographies.
  • Own and lead subsystem physical-design closure across 10 partitions, including high-frequency CPU, high-bandwidth memory, DDR, and SerDes interfaces; execute RTL-to-GDS with multiple team members and coordinate with methodology and computer-aided-design teams to achieve first-pass silicon success.

Desired Qualifications

  • Experience with AMD Block TileBuilder and lower technology nodes (5, 3, or 2 nanometers) is a plus.

About the Company

AMD

Designs chips for computers and AI systems

AMD designs processors, graphics chips and AI accelerators for computer makers, cloud operators and businesses that build electronic devices. Its Ryzen processors power personal computers, while EPYC processors handle work in data centers and Radeon chips render graphics. Instinct accelerators run AI models, paired with software that developers use to train models and put them into production. AMD sells chips and related computing systems through equipment makers, distributors and retail channels, and contracts with outside foundries to fabricate its semiconductor designs. It was founded in 1969 and has its headquarters in Santa Clara, California.

Company size
10,001+
Company stage
IPO
Headquarters
Santa Clara, CA
Founded
1969

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