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ASM International

Semiconductor deposition equipment and ALD tech

Manager – Field Process

Engineering LeadershipConfirmed live in the last 24 hours
Full-timeTaichung City, TaiwanNo salary listedIn-person

About the Job

Requirements

  • A degree background in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related field.
  • 15+ years of semiconductor-field experience with a bachelor’s degree, or 12+ years with a master’s degree or doctorate, especially in Thin Film, PECVD, LPCVD, or ALD module process development.
  • Strong project management and analytical skills.
  • Proven success building collaborative partnerships with customers and internal organizations.
  • Effective oral and written communication skills in English.
  • Strong leadership qualities to influence throughout the organization and with the BU and Service Team.
  • A goal- and customer-oriented approach.
  • A positive and energetic attitude, strong work ethic, and initiative.

Responsibilities

  • Lead the process team in penetrating key customer new products and applications.
  • Maintain and sustain the application position with the customer’s HVM team.
  • Improve module processes and equipment fundamentals.
  • Define overall NPI program schedules, align stakeholders, and drive execution plans and program deliverables to completion while meeting critical milestones on the customer’s roadmap.
  • Proactively identify talent and continuously develop team members using a deliberate roadmap.
  • Develop metrics to measure NPI program performance and drive improvement through successive product introductions.
  • Build strong cross-functional and matrixed relationships and collaborate with Product Marketing, Product Development, Service Engineering, and others to ensure a positive customer experience.

Desired Qualifications

  • Tool vendor experience.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Almere, Netherlands
Founded
1968

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