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Micron Technology

Makes memory and storage chips for AI and PCs

HBM Design Engineer Intern - HBM

Silicon & ASIC DesignConfirmed live in the last 24 hours
InternshipRichardson, TX, USANo salary listedIn-person

About the Job

Requirements

  • Currently pursuing a Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field.
  • Completed coursework in Digital Logic Design, CMOS Circuits, Computer Architecture, VLSI Design, Semiconductor Devices, or related subjects.
  • Working knowledge of combinational and sequential logic design concepts and familiarity with Verilog, SystemVerilog, or VHDL.
  • Basic programming experience in Python, Perl, Tcl, C/C++, or similar languages.
  • Demonstrated analytical, debugging, problem-solving, communication, and teamwork skills.

Responsibilities

  • Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard EDA tools.
  • Support RTL development, circuit implementation, timing analysis, power analysis, and functional verification activities.
  • Develop scripting, automation, and AI-assisted workflows to improve design productivity, debug efficiency, and design-flow quality.
  • Participate in design reviews, technical discussions, and debugging activities, leveraging AI-enabled analysis to accelerate root-cause identification and engineering decision-making.
  • Document technical work, experimental results, build methodologies, and AI-assisted insights to support collaboration and continuous improvement.

Desired Qualifications

  • Knowledge of memory architectures such as DRAM, SRAM, DDR, LPDDR, or HBM.
  • Experience with RTL design, simulation, synthesis, timing analysis, or verification methodologies through coursework, research, or internship projects.
  • Familiarity with Linux/Unix environments, scripting, and semiconductor design tools such as VCS, Xcelium, Questa, PrimeTime, Innovus, Virtuoso, or similar EDA platforms.
  • Understanding of functional coverage concepts and modern semiconductor development flows from specification through silicon validation.
  • Previous academic, research, or internship experience in VLSI, ASIC, FPGA, memory design, or semiconductor engineering, including exposure to AI-assisted or AI-enabled engineering workflows.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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