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Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Senior Manager of Sustaining Product Engineering

Engineering LeadershipConfirmed live in the last 24 hours
Full-timeTaipei City, TaiwanNo salary listedIn-person

About the Job

Requirements

  • Bachelor’s degree in Electrical Engineering or a related field is required.
  • At least 10 years of semiconductor experience in Product Engineering, Test Engineering, or Manufacturing, including at least 5 years leading teams in high-volume production.
  • Experience managing multi-site or multi-region teams and working cross-functionally without direct authority.
  • Ability to use data analytics, including statistical process control, yield and parametric analysis, trend analysis, and correlation analysis, to identify issues and drive measurable improvements and corrective-action closure.
  • Strong working knowledge of automatic test equipment and production test methodologies, yield analysis, failure analysis, and root-cause methods.
  • Understanding of wafer fabrication, assembly and packaging, and test flows.
  • Experience working with outsourced semiconductor assembly and test providers, external manufacturers, and automatic test equipment or equipment suppliers.

Responsibilities

  • Lead sustaining product engineers in resolving production issues across wafer, module assembly, and test, including yield excursions, test escapes, and reliability concerns.
  • Drive root-cause analysis and closed-loop corrective actions using 8D and 5-Why methods.
  • Partner with Quality and Operations on customer returns and field reliability issues.
  • Monitor product key performance indicators, including yield, defects per million, test cost, and cycle time, and drive corrective actions.
  • Establish and own product health dashboards and key performance indicators across wafer, assembly, and test, with clear thresholds and owners.
  • Use statistical process control, parametric trends, and cross-process correlation from wafer sort through module final test and returns to detect excursions and drift before they affect customers or supply.
  • Prioritize high-impact issues by quantified yield, cost, and risk, and drive each to owned, time-bound corrective actions.
  • Run data-driven reviews with Operations, Quality, Test, and partners, ensuring action tracking and closure.
  • Challenge conclusions using data, including partner-reported data, and require evidence of root cause and corrective-action effectiveness.
  • Drive automation of data collection and analysis and use modern analytics tools across product lines.
  • Coach engineers to apply analytics and communicate data-based findings clearly to leadership.
  • Drive yield improvement through data analytics, statistical process control, parametric monitoring, and defect reduction across wafer, assembly, and test.
  • Use test data and correlation to distinguish test-related from process- or assembly-related yield loss.
  • Reduce costs through test-time reduction, multisite optimization, and scrap reduction.
  • Own product-side execution of production test for wafer sort and module final test, including test coverage, guardbands, limits, and escape prevention.
  • Partner with Test Engineering on test conversions across automatic test equipment platforms, ensuring correlation, stability, and scalability in manufacturing.
  • Support hardware and software transitions involving testers, handlers, load boards, and test programs, and qualify test cells at outsourced semiconductor assembly and test providers and internal sites.
  • Drive test-cost optimization with automation and statistical process control.
  • Serve as the technical interface to foundry, assembly, and test partners for sustaining issues, process excursions, performance reviews, and corrective actions.
  • Support qualification and release of additional production lines, sites, and tools, ensuring readiness for high-volume production.
  • Partner with Operations on demand and capacity balancing and risk mitigation.
  • Work with Reliability on module qualification and monitoring, including power cycling, thermal cycling, and high-temperature reverse bias.
  • Own product change notifications, engineering change orders, and manufacturing transfers, including assembly material and process changes, while minimizing production disruption.
  • Support end-of-life and last-time-buy activities.
  • Build, mentor, and develop a high-performing sustaining product engineering team across sites and regions.
  • Drive standardization, best-known methods, and lessons-learned sharing across product lines and factories.
  • Support the Director on headcount, budget, and roadmap planning.

Desired Qualifications

  • A master's degree is preferred.
  • Experience with power modules or power packaging, including IGBT, SiC, or GaN modules, power stages, or PMICs.
  • Hands-on knowledge of module assembly processes and failure modes.
  • Experience with foundry interfaces and wafer parametric data.
  • Proficiency with data analysis tools and platforms such as JMP, Spotfire, Python, SQL, Power BI, or Tableau, and experience building dashboards or automated monitoring.
  • Experience with test conversions and automatic test equipment platform strategy.
  • Experience with product change notification and engineering change order processes, statistical process control and data analytics systems, and automation.
  • Familiarity with automotive, industrial, or data center power reliability requirements.

About the Company

Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Renesas manufactures and sells MCUs, SoCs, and analog/power semiconductor devices to OEMs, focusing on automotive, industrial, infrastructure, and IoT markets. Its chips are building blocks that run embedded software and manage power and signals, and its Winning Combinations offer pre-tested system architectures to speed up design. It differentiates itself by growing through acquisitions to offer a broad, integrated portfolio and by moving toward a unified digital design platform to reduce integration work. Its goal is to become a leading supplier of these components and provide a single platform for electronics design that speeds time-to-market.

Company size
10,001+
Company stage
IPO
Headquarters
Tokyo, Japan
Founded
2002

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