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Hewlett Packard Enterprise

Builds servers, networking and private cloud

Senior Principal Thermal Engineer

Thermal & Fluids EngineeringConfirmed live in the last 24 hours
Full-time

About the Job

Requirements

  • A bachelor's or master's degree in Mechanical Engineering, Thermal Sciences, or a closely related engineering discipline; an advanced degree is preferred.
  • Typically 15 or more years of relevant engineering experience for the Senior Principal level, including extensive hands-on experience leading electronics thermal design and liquid-cooling development for complex products.
  • Demonstrated technical impact on significant products, programs, or strategic architecture, including successful delivery across multiple new product introduction cycles.
  • Deep expertise in single-phase liquid cooling and strong knowledge of immersion, dielectric fluids, refrigerant-based or two-phase technologies, and air-liquid hybrid architectures.
  • Expert understanding of heat transfer, fluid mechanics, thermal resistance, boiling and dry-out limits, flow distribution, pressure drop, pump and heat-exchanger performance, and system controls.
  • Strong knowledge of cold-plate and manifold design, materials, joining and sealing methods, leak and proof-pressure testing, cleanliness, corrosion, coolant chemistry, reliability, and field service considerations.
  • Advanced capability with computational fluid dynamics and thermal-network tools and proficiency with computer-aided design tools such as SolidWorks or equivalent; ability to define modeling, calibration, correlation, and validation methods used across an organization.
  • Experience designing for cost, manufacturability, reliability, safety, serviceability, energy efficiency, and sustainability.
  • Business acumen and program leadership, including prioritization, risk management, resource planning, supplier engagement, and negotiation.
  • Written, verbal, and presentation skills to explain nuanced concepts and influence audiences from working teams to business-unit and executive leadership.

Responsibilities

  • Establish and define organization-wide thermal architectures, design methodologies, specifications, and validation practices for liquid-cooled hardware across multiple platforms and organizations; contribute to long-range technology roadmaps.
  • Serve as the go-to technical leader for direct liquid cooling, including cold plates, manifolds, quick disconnects, hoses and piping, pumps, heat exchangers, coolant distribution units, facility-water interfaces, immersion systems, hybrid cooling, and emerging two-phase solutions.
  • Lead system-level thermal architecture, analysis, and design from concept and feasibility through qualification, new product introduction, manufacturing ramp, and sustaining engineering for high-power application-specific integrated circuits, optics, power components, and densely packed electronic modules.
  • Perform and direct thermal-fluid computational fluid dynamics modeling using FloTHERM, FloEFD, Macroflow, or equivalent tools; correlate models with test data and translate results into clear design decisions and margin improvements.
  • Define fluid, thermal, mechanical, reliability, serviceability, manufacturability, safety, and regulatory requirements, including flow and pressure budgets, pressure drop, temperature uniformity, material and coolant compatibility, corrosion control, leak prevention and detection, contamination control, and failure-response strategies.
  • Develop and oversee validation plans and empirical testing for component, subsystem, chassis, rack, and facility interfaces; guide engineers and technicians in instrumentation, test execution, data analysis, and root-cause investigations.
  • Review designs and project activities for compliance with technology, quality, reliability, and development standards; drive valuable recommendations and innovations into platform architectures.
  • Evaluate and select technologies, suppliers, outsourced development partners, and manufacturing processes; oversee technical deliverables and resolve complex cross-organizational issues.
  • Partner with mechanical, electrical, printed circuit board, silicon, optics, firmware, systems, reliability, manufacturing, operations, service, sourcing, and data-center infrastructure teams to optimize total system performance and lifecycle cost.
  • Develop schedules, critical deliverables, resource plans, risk assessments, and support requirements for major programs; communicate progress, trade-offs, escalations, and issue analysis to senior and executive stakeholders.
  • Influence business leadership, customers, partners, suppliers, and industry standards groups through domain expertise, business acumen, and clear technical communication.
  • Drive invention, intellectual property, reusable design practices, and knowledge sharing; mentor less-experienced engineers and contribute to the HPE technical community.

Desired Qualifications

  • Evidence of innovation through patents, publications, standards contributions, or deployment of differentiated cooling technologies.

About the Company

Hewlett Packard Enterprise

Builds servers, networking and private cloud

Hewlett Packard Enterprise sells servers, storage, networking and hybrid cloud software to large companies, governments and service providers. Its GreenLake platform lets customers run on-premises hardware as a metered cloud service, and its Cray supercomputers run national lab and AI training workloads. The networking business, built on Aruba and Juniper Networks, supplies campus, data-center and routing equipment. Revenue comes from hardware sales, multiyear support contracts, financing and subscriptions. The company traces its roots to Hewlett-Packard, founded in 1939, became a separate public company in 2015 and is headquartered in Houston, Texas.

Company size
10,001+
Company stage
IPO
Headquarters
Houston, TX
Founded
1939

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