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Micron Technology

Makes memory and storage chips for AI and PCs

Design Engineer New Grad - HBM

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeRichardson, TX, USANo salary listedIn-person

About the Job

Requirements

  • A Bachelor's or Master's degree in Electrical Engineering or a related field.
  • Extensive knowledge of CMOS circuit design and semiconductor device physics.
  • Experience with schematic entry, Verilog, FastSPICE, and HSPICE simulations.
  • A strong understanding of timing, area, power, and complexity trade-offs in DRAM or mixed-signal design.
  • Experience using AI-enabled or AI-assisted tools to support simulation, modeling, data analysis, or engineering productivity improvements.

Responsibilities

  • Contribute to new product opportunities by supporting overall circuit design, layout, and optimization for memory and logic or analog circuits.
  • Perform parasitic modeling and support design validation, including reticle experiments and required tape-out revisions.
  • Oversee and manage the layout process, including floor-planning, placement, and routing.
  • Perform verification using modeling and simulation with industry-standard simulators.
  • Collaborate across teams to drive standardization and shared design success.
  • Partner with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering to support accurate manufacturability.
  • Proactively incorporate guidance from standards, computer-aided design, modeling, and verification teams to improve design quality.

Desired Qualifications

  • Exposure to statistical or Monte Carlo simulation techniques and mixed-signal verification workflows.
  • Experience with memory interfaces, HBM architectures, or mixed-signal IP integration through coursework or internships.
  • Prior register-transfer level (RTL) design flow experience in DRAM or foundry processes.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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