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Broadcom

Designs chips and software for data centers

Wafer Fab Process Engineer

Process EngineeringConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • A bachelor's or master's degree in Engineering (Electrical, Chemical, Materials, or related) is required.
  • At least 5 years of semiconductor wafer fab process experience in thin film (metal/passivation) or thermal (oxidation, diffusion, implantation) is required.
  • Strong knowledge of Statistical Process Control (SPC), Design of Experiments (DOE), Failure Mode and Effects Analysis (FMEA), and statistical data analysis tools is required.
  • Demonstrated leadership in cross-functional technical projects is required.
  • Strong analytical, problem-solving, and communication skills are required.

Responsibilities

  • Lead process development, optimization, and transfer to manufacturing to achieve yield, quality, cost, and reliability targets.
  • Own and drive advanced process modules, including thin film deposition for metal/passivation, wafer thinning, and thermal processes such as oxidation, diffusion, and implantation.
  • Lead yield improvement and defect reduction initiatives using statistical and Design of Experiments methodologies.
  • Drive new process integration and process transfer to high-volume manufacturing.
  • Perform root cause analysis and implement robust corrective and preventive actions.
  • Define process control plans and Statistical Process Control strategies, and execute OCAP.
  • Collaborate cross-functionally with equipment, integration, quality, and research and development teams.
  • Mentor junior engineers and technicians.
  • Interface with suppliers on process and material improvements.

Desired Qualifications

  • A PhD in Engineering (Electrical, Chemical, Materials, or related) is preferred.
  • Six Sigma certification (Green Belt or Black Belt) is preferred.
  • Experience supporting 4-inch to 6-inch wafer scaling or an equivalent manufacturing transition is preferred.

About the Company

Broadcom

Designs chips and software for data centers

Broadcom designs chips and sells infrastructure software for the companies that run large data centers, telecom networks and corporate IT. Its custom AI processors, built with cloud companies, and its Ethernet switch chips move and process data inside the computer clusters that train AI models. The chip business also makes parts for broadband, wireless, storage and industrial equipment, sold to device makers and cloud operators, while VMware software lets businesses run private clouds and is sold by subscription. Broadcom took its current form in 2016, when Avago Technologies, formed in 2005 from Agilent's chip unit, bought Broadcom Corporation, and it is based in Palo Alto, California.

Company size
10,001+
Company stage
IPO
Headquarters
Palo Alto, CA
Founded
2005

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