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Soitec

Engineered substrates for silicon-on-insulator wafers

Manufacturing Engineer MTBE

Manufacturing EngineeringUpdated on Nov 10
Full-timeBernin, FranceNo salary listed

About the Job

Requirements

  • A five-year degree in Industrial Engineering is required.
  • Ideally, have 3–5 years of production experience involving continuous-improvement project management and mastery of Lean tools.
  • Have strong interpersonal skills and leadership ability to deploy high-stakes projects.
  • Be curious and able to approach problems with perspective.

Responsibilities

  • Optimize production performance within the assigned manufacturing area while accounting for its constraints.
  • Challenge requests from support teams and arbitrate decisions to help meet production objectives.
  • Deploy continuous-improvement projects under a Lean Manufacturing plan to optimize productivity and working conditions.
  • Lead or coach Kaizen workshops with area supervisors or Lean representatives from other areas to identify non-value-added activities, their causes, and solutions.
  • Use Value Stream Mapping, value-added/non-value-added analysis, A3 reports, DMAIC, and 5S to manage short-, medium-, and long-term projects in coordination with maintenance, process, and production teams.
  • Facilitate working groups, roadmaps, and team meetings to develop and maintain industrial performance.
  • Support implemented changes across the entire area so they are adopted by all stakeholders.

Desired Qualifications

  • Ideally, have 3–5 years of production experience involving continuous-improvement project management and mastery of Lean tools.

About the Company

Soitec

Engineered substrates for silicon-on-insulator wafers

Soitec designs and manufactures high-performance semiconductor materials, specializing in engineered substrates used to make chips for smartphones, data centers, and automotive applications. Its main products are silicon-on-insulator (SOI) wafers, which enable better performance and lower power consumption compared with traditional silicon wafers. Soitec’s Smart Cut technology bonds and transfers ultra-thin silicon layers onto insulating substrates to produce high-quality wafers with high yield. The company differentiates itself through its leadership in engineered substrates and its proprietary manufacturing process, supplying wafers to leading chipmakers under long-term agreements. Soitec’s goal is to provide advanced substrates that help customers build more powerful and energy-efficient electronic devices across industries.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Bernin, France
Founded
1992

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