R

Rambus

Licenses high-speed chip-to-chip connectivity IP

Lead MTS Physical Design

Silicon & ASIC DesignPosted on Nov 5
Full-timeBengaluru, Karnataka, IndiaIn-person

About the Job

Requirements

  • A minimum Bachelor's degree in Electrical Engineering, Electronics and Communication Engineering, or an electronics-related field from a reputed institute is required.
  • At least 10 years of experience is required, including at least 8 years related to chip-level or block-level physical design.
  • Detailed knowledge of electronic design automation tools and flows is required.
  • Experience with Cadence foundation flows and RTL-to-GDS flow is desired.
  • Experience with Tcl/Tk and Perl is a plus.

Responsibilities

  • Own end-to-end physical implementation for major intellectual property blocks and/or full-chip designs.
  • Develop and optimize floorplans, including macro placement, input/output ring planning, power grid design, and congestion, area, and timing analysis.
  • Execute place-and-route, clock tree synthesis, and timing closure using industry-standard tools such as Cadence Innovus.
  • Perform detailed static timing analysis and drive sign-off across process, voltage, and temperature corners and operating modes.
  • Identify and resolve physical verification issues, including design rule check, layout versus schematic, and electrical rule check issues, in partnership with process, computer-aided design, and foundry teams to ensure manufacturability.
  • Automate design flows, including hierarchical place-and-route, input/output ring automation, and power-grid automation, and contribute to continuous flow enhancements.
  • Collaborate with register-transfer-level, design-for-test, verification, package, and library teams to meet performance, power, and area targets and project milestones.
  • Mentor and coach junior engineers by sharing physical design best practices and advancing team capability.
  • Document methodologies and contribute to best practices that support continuous improvement.

About the Company

Rambus

Licenses high-speed chip-to-chip connectivity IP

Rambus designs, develops, and licenses high-speed chip-to-chip connectivity technology. Its IP powers data center servers, AI accelerators, and automotive systems, and is licensed to other semiconductor companies rather than manufactured and sold directly. The products are high-speed interfaces and security features embedded in chips, enabling fast, reliable communication between components. Rambus differentiates itself through a licensing-based model focused on advanced IP for memory, security, and high-speed interfaces across data centers, AI, and automotive markets, rather than relying on a traditional product lineup. The company’s goal is to enable high-performance chip communication at scale by monetizing its intellectual property through licensing and expanding into growing markets like data centers, AI, and automotive.

Company size
1,001-5,000
Company stage
IPO
Headquarters
San Jose, CA
Founded
1990

Recently Posted Jobs

Explore more opportunities at Rambus

See more jobs