Staff NPI Package Design Engineer

Job Overview

This is a challenging design/layout position in a high volume, dynamic and fast paced environment, and will have a direct impact on business with external customers by helping create innovation that rocks. Products include top of the line Amps, Codecs and DSPs to name a few. The package design types are a wide variety from WLCSP to wirebond to flip chip. This is a chance to be part of a package design team supporting challenging customer expectations and a growing business.

Responsibilities

· Design package layouts, stack-ups, drawings, models, simulations, and design documentation to verify compliance with requirements and design standards

· Work tightly with Global Design (UK and US) I.C. and board teams to drive package designs that meet Cirrus performance, reliability, and manufacturability requirements

· Interface with cross functional teams (Design, Layout) to define package requirements from electrical, thermal, and mechanical point of view

· Utilize AutoCAD, GDS tools, Siemens Fast3D and Cadence SiP Layout tool to complete physical design, electrical simulation, and manufacturing validation solution for package design, including die bump array/BGA integration refinement using die information

· Drive continuous improvement processes to assure accuracy between the interface of the package to the die and PCB

· Collaborate with cross functional teams (Customer, Designers, OSATs) to establish and maintain design rules for WLCSP, wire bond, and other packages

· Understand DFM checking and modification to improve assembly yield and prevent manufacturing issues

· Grow and promote automation processes throughout the package design flow

· Close collaboration with customers to resolve various design issues between the piece part and PCB

Required Skills and Qualifications

· B.S. or higher degree in Mechanical or Electrical Engineering

· 5-10 years’ experience designing for manufacturability

· Experienced Cadence SiP layout user

· Strong AutoCAD user

· Knowledge of packaging technologies, materials, package substrate design, and assembly rules

· Understanding of electrical simulation results on a package design

Preferred Skills and Qualifications

· Conversant with PCB and Die mechanical layout tools (e.g. Siemens Xpedition, Allegro PCB, Cadence Virtuoso)

· Broad reading in the area of interest and the desire to continue that reading with access to the high-quality company library resources, material properties knowledge

· Must be broadly curious and knowledgeable, and willing to pursue mastery of new technical concepts through self-learning or training opportunities available through company resources

· Electrical simulation skills

· Experience using Siemens Fast 3D

· Experience using Siemens Calibre DR