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Micron Technology

Makes memory and storage chips for AI and PCs

NAND Designer / Layout

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeTokyo, JapanNo salary listedIn-person

About the Job

Requirements

  • A Bachelor's or Master's degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or a related field, with at least 2 years of experience.
  • Relevant hands-on experience in custom or analog circuit design, mixed-signal design, memory peripheral circuit design, or Product Engineering, with strong transistor-level circuit and silicon-debug exposure.
  • Strong understanding of CMOS device operation, transistor-level circuit design, leakage mechanisms, parasitics, PVT sensitivity, timing, loading, noise margin, power, and reliability principles.
  • Hands-on proficiency with circuit build entry, waveform debugging, and post-layout verification.
  • Proficiency in XA or equivalent fast transistor-level simulation, Verilog, and mixed-signal validation methodologies.
  • Proficiency in Python and scripting for simulation automation, regression analysis, result extraction, waveform processing, and engineering efficiency.
  • Ability to identify workflows that can be improved through AI, develop or adapt AI-enabled engineering solutions, and apply appropriate technical review, data protection, and engineering judgment.
  • Strong problem-solving skills, attention to detail, and interpersonal skills for multifunctional, global collaboration.

Responsibilities

  • Develop, integrate, and optimize custom test circuit architectures for NAND flash memory designs, including transistor-level digital, analog, mixed-signal, monitoring, control, and memory-array interface circuits.
  • Interpret product specifications and test requirements and define circuit functionality, interfaces, operating limits, controllability, observability, and validation criteria.
  • Create, review, and optimize schematics, device sizing, bias structures, sensing and monitoring paths, and multiplexers relevant to test circuits.
  • Analyze circuit testability and robustness to ensure compliance with quality, coverage, manufacturability, power, area, and reliability requirements.
  • Validate custom test circuits using XA simulations, Verilog simulations, and mixed-signal validation environments.
  • Collaborate with layout teams on matching, parasitic sensitivity, shielding, routing, guard rings, device placement, and layout-dependent effects; review post-layout results and drive closure.
  • Evaluate circuit risks including leakage, contention, floating nodes, device overstress, power sequencing, current density, EM/IR, and long-duration stress conditions.
  • Create and debug test sequences and test modes required to control, observe, characterize, and validate custom test circuits at wafer and package levels.
  • Work with Product Engineering during first-silicon bring-up, debugging and characterization, failure isolation, simulation-to-silicon correlation, and ramp to high-volume production.
  • Use laboratory measurements and silicon data to identify root causes and recommend circuit, test-mode, characterization, or screening improvements.
  • Apply AI-assisted and agentic engineering workflows to accelerate circuit review, simulation triage, waveform analysis, root-cause investigation, automation, documentation, and knowledge retrieval while maintaining engineering rigor and sign-off discipline.
  • Develop Python- or scripting-based automation and AI-enabled solutions that improve design quality, reduce turnaround time, and increase engineering productivity.
  • Document test-circuit methodologies, specifications, design decisions, validation results, silicon correlation, and technical recommendations.

Desired Qualifications

  • A solid understanding of NAND flash memory architecture, test modes, peripheral circuits, internal signal access, and wafer/package test considerations.
  • Laboratory skills using an oscilloscope, logic or signal analyzer, source-measure equipment, and function generator, plus hands-on silicon testing at wafer and package levels.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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