Volantis Semiconductor

Designs photonic AI compute hardware

Wafer Architect

Hardware Systems IntegrationConfirmed live in the last 24 hours

Full-timeNo salary listed

About the Job

Requirements

Deep understanding and hands-on experience in the design process of AI chips, such as GPUs, TPUs, XPUs, or custom ASICs.
Understanding of memory subsystems and their interactions in multi-die systems.
Understanding of large language model inference workloads, especially at a software level, and their implications for hardware systems at the system, package, network, and die levels.

Responsibilities

Own the logical architecture for the A-0 and A-1 wafer products.
Work with the XPU/Compute chip architect and the memory architect to synthesize the final wafer-level architecture.

Desired Qualifications

Experience with multi-die designs.
Experience with multi-chip module and chiplet-based architectures and architectural partitioning across them.
Experience partitioning workloads across multiple chips and chip packages.

What We’re Looking For:

We’re looking for an architect to own the logical architecture for the A-0 and A-1 wafer products. You will work with the XPU/Compute chip architect and the memory architect to synthesize the final wafer-level architecture.

Ideal Background:

An ideal candidate will have:

Deep understanding and hands-on experience in the design process of AI chips, such as GPUs, TPUs, XPUs, custom ASICs, etc
Understanding of memory sub-systems and interactions in multi-die systems
Understanding of LLM inference workloads, especially at a software level and its implications for hardware (system, package, network, die-level) systems

Strongly Preferred:

Experience with multi-die designs
Experience with MCM and chiplet based architectures and architectural partitioning across them
Experience in partitioning workloads across multiple chips and chip packages

About the Company

Volantis Semiconductor

Designs photonic AI compute hardware

Volantis Semiconductor designs photonic computing hardware for AI workloads, centered on the Volantis Photonic Motherboard. Its technology directly modulates low-cost VCSELs and densely parallel optical waveguides directly on the chip to replace electrical interconnects, enabling a chip-scale package with massive bandwidth and energy efficiency. This approach differs from traditional silicon photonics by wafer-scale integration and laser-based optics, focusing on scalable interconnect bandwidth and compute efficiency rather than simply adding more silicon cores. The company aims to deliver faster, cheaper AI compute with reduced energy use, with pre-orders expected in early 2026 as it engages early customers.

Company size: 11-50
Company stage: Series A
Total funding: $97M
Headquarters: San Mateo, CA
Founded: 2022

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