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Micron Technology

Makes memory and storage chips for AI and PCs

Dry Etch Process Engineer

Process EngineeringConfirmed live in the last 24 hours
Full-timeAlbany, NY, USA

About the Job

Requirements

  • A master's or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Mechanical Engineering, or a related engineering or technical field relevant to plasma processing and semiconductor manufacturing; alternatively, a bachelor's degree with at least 3 years of semiconductor processing experience emphasizing dry etch or plasma etch.
  • Experience in semiconductor process development or sustaining engineering, including design-of-experiments planning and execution and statistical data analysis.
  • Working knowledge of plasma etch fundamentals, chamber hardware, and process characterization, including profile, critical-dimension control, selectivity, uniformity, and defectivity.
  • Ability to collaborate across multifunctional technical teams and communicate results clearly.
  • AI proficiency or experience with AI-enabled ways of working.

Responsibilities

  • Develop, qualify, and sustain dry etch plasma unit processes for advanced memory technologies, including dielectric, conductor, and hardmask etch.
  • Optimize critical process metrics, including critical-dimension control, etch profile and anisotropy, selectivity, microloading, uniformity, and line-edge and line-width roughness.
  • Drive defect reduction and yield improvement using inline and offline metrology, design of experiments, statistical process control, and statistical data analysis.
  • Perform root-cause analysis and implement corrective actions for process excursions, tool health issues, and integration-related failures.
  • Partner with equipment vendors on chamber matching, hardware and recipe development, new capability evaluations, and cost-of-ownership improvements.
  • Document process baselines, change controls, and learning; communicate results and support technology transition to large-scale production.

Desired Qualifications

  • Hands-on experience with advanced dry etch platforms, such as inductively coupled plasma or reactive ion etching, and chamber matching across equipment fleets.
  • Familiarity with pattern-transfer challenges, including aspect-ratio-dependent etching, microloading, footing, and notching, and integration with lithography and hardmask stacks.
  • Experience with defect characterization techniques and tool health monitoring methodologies.
  • Experience working with semiconductor equipment vendors, joint development programs, or research and development environments.
  • Familiarity with technology transfer to high-volume manufacturing and sustaining support in a fabrication facility.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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