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Micron Technology

Makes memory and storage chips for AI and PCs

High Bandwidth Memory IO Design Architecture Engineer - Architecture

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeRichardson, TX, USANo salary listedIn-person

About the Job

Requirements

  • Prior industrial experience in high-speed clocking design at 32 Gbps or higher.
  • Experience with high-speed input/output circuit design, including both analog and digital design and simulation.
  • Experience with circuit verification and optimization, including layout verification and parasitic extraction.
  • Familiarity with one or more off-chip protocols such as UCIe, HBM, DDR, PCIe, or MIPI.
  • Understanding of state-of-the-art device characteristics and hands-on design experience.
  • Strong problem-solving and analytical skills.
  • Strong documentation skills.
  • Strong communication skills, including the ability to clearly convey sophisticated technical concepts verbally and in writing.
  • A Master of Science or Doctor of Philosophy degree in Electrical Engineering.
  • At least 10 years of relevant engineering or design engineering experience with high-speed input/output, phase-locked loops, transmitters, receivers, equalization, or clock trees.

Responsibilities

  • Develop high-speed input/output design architecture for High Bandwidth Memory products.
  • Define and standardize the input/output design quality process from architecture through silicon.
  • Work with Product Engineering to correlate silicon measurements with simulation performance for circuit-level design analysis.
  • Contribute to cross-group communication and standardization efforts.
  • Solicit input from Standards, computer-aided design, modeling, and verification groups to ensure design quality.
  • Drive innovation into future memory generations.
  • Use artificial intelligence-assisted analytics to accelerate root-cause identification from complex multivariable silicon data.

Desired Qualifications

  • Prior circuit-debug experience through Product Engineering or an equivalent function.
  • Knowledge of advanced packaging environments, including CoWoS, HBM stacks, and die-to-die packaging.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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