Microelectronics R&D Intern - Engineering & Technology Innovation

At Boeing, we are all innovators on a mission to connect, protect,exploreand inspire. From the seabed to outer space,you’lllearn and grow, contributing to work that shapes the world. Find your future with us.

Join our exclusiveGraduate Researcher Program (GRP)in Engineering & Technology Innovation (E&TI) during the Summerof 2027andyou can build something better for yourself, for our customers and for the world. E&TI isBoeing's global research and development team developing and implementing innovative technologies that make the impossible possible and enabling the future of aerospace. We are engineers and technicians, skilledscientistsand bold innovators. Join us and put your passion, determination, and skill to work building the future! #TheFutureIsBuiltHere #ChangeTheWorld

What isGraduateResearcherProgram?

The GRP (GraduateResearcherProgram) is aunique10-12 weekinternship programdesignedspecificallyfor students pursuing their PhD.GRP is a hybrid experience of real-world industry work experience combined with development programming that exposes students to Boeing, its products,servicesand its people. GRP focuses on deeply connecting students to their teamand Boeingthrough work experience across multiple summerswith thegoalofultimatelyofferinga full-time position at the conclusion of academic studiesif a mutual fit is achieved.  

HowGRPWorks:

GRP host teamspostintern requisitionsaligned with Boeing’s strategic needs, aiming to matchtheir needswith top PhD talent. Once candidates apply and are selected, they receive an offer to spend the following summer working with their host team. The program is designed to give interns meaningful, hands-on experience at Boeing, allowing them to apply their academicexpertisewhile contributing to real-world industry challenges and opportunities.

In addition toindustryworkexposure, students attend GRP programming tofurtherbroadentheir experience andknowledgeofBoeing. GRP programmingcomponentsinclude:mentorship in your field of study,weeklyFeatured Speaker Talks, a week-long in-personGRP Summit,participation in anInnovation Challenge,and other opportunities tointeract and build a professional networkwithother GRP students, Boeing team members,andBoeingleadership.

Please note: The work you do at Boeing can berelatedto your area ofstudy, butcannotcontributeor be used inyour PhD thesis.  

Who we are looking for:

We are seeking students who will havecompleted theirfirst year of studyin their PhD program by July 2027andare passionate about the aerospace industry and Boeing. GRP students excel at quicklyadapting to their roles, analyzing complex problems, and developing innovative solutions. They thrive in collaborative team environments andpossessexcellent communication skills.Above all, theyare driven to contribute to the success of their team, fellow GRP students, and Boeing.

2027GRP Position:

Within E&TI, Boeing’s Microelectronics Technology organization performs microelectronics technology development, design, and test for aerospace systems. We develop digital, analog, and RF Systems on Chip (SoCs) for radar, navigation, electronic warfare, communications, processing, and other electronic systems.  

We are seeking a Microelectronics R&D GRP intern with experience advancing the state of the art for microelectronics development.

Key Responsibilities will include:

• Conducting research and development inadvanced microelectronics, focusing on design, verification,modeling,test,or analysisofdigital, analog, mixed-signal,orRF circuits, sub-systems, and SoCsforhigh‑performanceaerospace applications

• Applyingexpertisetoemergingmicroelectronics challenges inAI, radar, EW, navigation, and secure communication systems

• Working collaboratively with senior Boeing engineers, researchers, and mentors to transition research concepts intoviabletechnologies for Boeing programs

• Documenting findings, presentingresults to technical leaders, and contributingto internal R&D knowledge bases

This position is expected to be 100% onsite.  The selected candidate will be required to work onsite at one of the listed location options.

This position requires the ability to obtain U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship.

Job Related Information /BasicQualifications:

• Completed the first year of PhD studies by July 2027

• Ability to work full-time for 10-12 weeks during Summer 2027

• Pursuinga PhD inElectrical Engineering, Computer Engineering, Microelectronics, Applied Physics, or a related discipline

• Coursework or research experience in one or more of the following:  Digital logic design and verification, System-on-Chip architecture and integration, Semiconductor device physics, CMOS/BiCMOSfabrication and technology, Analog/mixed-signal circuit design, RF/millimeter-wave circuitdesign,

• Strong analytical,problem‑solving, and communication skills     

Preferred Qualifications:

• Experience with industry-standard EDA tools (Cadence, Synopsys, Siemens EDA)

• Experience with microelectronics in extreme environments, to include high radiation environments, extreme temperatures,and long life/high reliability

• Experience conducting independent research, publishing results, or presenting at conferences

Drug Free Workplace:

Boeing is a Drug Free Workplace (DFW) where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies.

Shift:

This role is primarily first shift; however, there may be additional shift requirements to support program objectives.

Relocation:

This position offers relocation based on candidate eligibility.

At Boeing, we strive to deliver a Total Rewards package that will attract, engage and retain the top talent. Elements of the Total Rewards package include competitive base pay and variable compensation opportunities.

The Boeing Company also provides eligible employees with an opportunity to enroll in a variety of benefit programs, generally including health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and a number of programs that provide for both paid and unpaid time away from work.

The specific programs and options available to any given employee may vary depending on eligibility factors such as geographic location, date of hire, and the applicability of collective bargaining agreements.

Pay is based upon candidate experience and qualifications, as well as market and business considerations.

Summary Pay Range: $90,000