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Micron Technology

Makes memory and storage chips for AI and PCs

Director, Package Development & Engineering Advance Packaging - Advance Technology NPI

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • A Bachelor's degree or higher in Engineering, Materials Science, Chemical Engineering, or a related technical field.
  • At least 10 years of experience in semiconductor manufacturing, with a strong background in process engineering, New Product Introduction, or technology development.
  • At least 5 years in a people leadership role as a Manager or Director, with demonstrated success managing multi-functional engineering teams.
  • Deep understanding of backend and assembly semiconductor processes and New Product Introduction phase gate frameworks.
  • A proven track record of delivering New Product Introduction milestones on time in a fast-paced, 24/7 manufacturing environment.
  • Strong analytical skills and proficiency with data analysis tools such as JMP, Python, or equivalent.

Responsibilities

  • Set strategic direction and lead the Package Development & Engineering New Product Introduction team through all phases of New Product Introduction, ensuring systematic, repeatable, and on-schedule qualification into High Volume Manufacturing.
  • Own accountability for New Product Introduction execution plans, deliverables, and milestone achievement across assigned products and technology nodes.
  • Define and drive organizational Defense Line readiness for New Product Introduction deployment, ensuring quality control plans, OCAP/SPC charts, and Failure Mode and Effects Analysis frameworks are in place before product release.
  • Partner with APTD, PDE, PSE, Global Quality, TSE, Site Manufacturing, and Central Planning to align New Product Introduction strategy, identify risks early, and drive resolution.
  • Serve as the key liaison between PDE and Global AT site teams to align on process transfers, tool readiness, and qualification schedules.
  • Lead cross-functional reviews, Phase Gate Review meetings, and executive-level program updates with clear, data-driven recommendations.
  • Engage external partners and business units as needed to support customer sample delivery and qualification requirements.
  • Oversee execution of New Product Introduction lots, data collection, process characterization, and yield ramp activities.
  • Drive root cause analysis and corrective and preventive action for New Product Introduction-related excursions and quality issues.
  • Ensure Metro Real-time Defect Analysis readiness, ADC setup and validation, sampling strategy, and inspection methodologies are established ahead of each phase gate.
  • Oversee Process Objective Specification, Variability Monitoring Program, and Defectivity Monitor Program deployment and execution.
  • Lead, develop, and coach a team of engineers and managers across multiple disciplines within the PDE Advance Technology New Product Introduction organization.
  • Set clear goals, manage performance, and foster a high-performance, inclusive culture aligned with company values.
  • Drive succession planning, talent pipeline development, and capability-building programs for the team.
  • Manage organizational structure, staffing levels, and resource allocation to meet business demands.
  • Conduct regular one-on-one meetings, team meetings, and performance reviews to ensure accountability and continuous development.
  • Establish and monitor New Product Introduction key performance indicators, including Mechanical Line Yield, Process Cpk, Lot Disposition turnaround time, Phase Gate exit rates, and Defect Pareto closure.
  • Drive Continuous Improvement Programs to achieve yield targets, reduce scrap, and improve process capability across New Product Introduction runs.
  • Champion best-known method documentation and cross-site knowledge sharing.
  • Ensure safety, regulatory, and ethical compliance across team activities in accordance with company policies.
  • Integrate AI-assisted tools and data analytics into New Product Introduction workflows to improve decision-making speed, yield prediction, and operational efficiency.
  • Identify and scale AI-enabled enhancements within the PDE Advance Packaging New Product Introduction scope.

Desired Qualifications

  • Experience with advanced packaging technologies such as HBM, 3D stacking, or wafer-on-wafer.
  • Experience working across global, cross-functional teams spanning multiple geographies.
  • Ability to influence and present to senior executives and cross-functional leaders.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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