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Teledyne

Manufactures sensors, imaging systems, and avionics

Director: Technology Strategy and Architecture

Board & Electronics Design +1Confirmed live in the last 24 hours
Full-timeMilpitas, CA, USA$221.9k - $295.8kIn-person

About the Job

Requirements

  • A Bachelor’s or Master’s degree in Electrical Engineering or Computer Engineering is required; a Master’s or PhD is preferred.
  • At least 15 years of engineering leadership experience.
  • At least 10 years of system- or board-level design experience developing and leading high-end, high-speed complex platforms, including current bus topologies, CPU, and memory interfaces.
  • At least 5 years of experience managing cross-platform engineering teams.
  • Excellent knowledge of high-speed design methodologies and simulation at 20 Gbps or higher, including PCIe, USB, SAS/SATA, video, and/or Ethernet bus technologies.
  • Excellent knowledge of FPGA and/or chip design methodologies and RF/microwave design techniques and implementation.
  • Excellent knowledge of high-speed circuit design, implementation, and measurements.
  • Demonstrated success delivering hardware and software products.
  • Experience developing multi-year technology roadmaps.
  • Experience developing and implementing development processes.
  • Ability to influence across global engineering organizations.
  • Good knowledge of manufacturing processes and taking a product from development into manufacturing.
  • Working knowledge of EMC/EMI control methods and implementation at the PCB/component level.
  • Working experience with schematic entry tools and test/measurement equipment, including high-speed real-time oscilloscopes, network/spectrum analyzers, and logic analyzers.
  • Strong system development experience with a holistic approach.
  • Ability to share knowledge, learn from others, and support other groups within an organization.

Responsibilities

  • Develop and maintain PSG’s three-to-five-year technology roadmap; identify emerging technologies, market trends, and potential disruptions; evaluate build, buy, and partner opportunities; drive innovation initiatives aligned with strategic business objectives; and guide technology investment decisions and portfolio prioritization, including custom silicon development and lifecycle-transition management.
  • Conduct and participate in high-speed circuit simulations and circuit design reviews, and take responsibility for system design and functionality.
  • Define architectural principles across hardware, firmware, and system platforms; develop, lead, and own system architecture for major product initiatives; ensure technology reuse and common platform strategies across product families; establish architecture, governance, processes, and technical standards; and balance innovation with maintainability and product lifecycle requirements.
  • Partner with Product Management to translate market requirements into technology roadmaps, align product development plans with long-term architectural direction, drive platform strategies that enable faster product development and lower research and development costs, and evaluate technology tradeoffs related to performance, cost, risk, and schedule.
  • Serve as a senior advisor to engineering leaders, foster technical excellence and engineering rigor, and lead resolution of critical technical challenges across programs.
  • Work with Engineering, Operations, Quality, Manufacturing, and Supply Chain teams; support customer engagements involving strategic technical discussions; participate in executive reviews, strategic planning, and merger and acquisition technical evaluations when required; represent PSG in industry forums, standards bodies, and key customer interactions; and maintain ownership of standards documents and restricted technical repositories.
  • Monitor industry trends in high-speed interconnects such as USB/USB4, PCIe Gen6/Gen7 and beyond, Ethernet, UALink and networking, AI infrastructure, storage technologies, and test and measurement platforms; drive technology incubation projects and identify opportunities for platform differentiation.
  • Perform some hands-on development, including high-speed interface design, PCB layout, simulations, component selection, and support for manufacturing and customer support activities.
  • Develop high-end systems using high-speed simulation, layout guidance, RF and electrical measurements, and collaboration with Mechanical Engineering on enclosure design and associated subassemblies.

About the Company

Teledyne

Manufactures sensors, imaging systems, and avionics

Teledyne Technologies designs and makes sensors, cameras, and electronics used in aerospace, environmental monitoring, medical imaging, and defense. Its products include digital imaging sensors, high-reliability cameras, instrumentation, aerospace and defense electronics, and engineered systems that provide integrated sensing solutions for demanding environments. The company grows by acquiring specialized high-tech firms, building a diversified portfolio that serves markets with high barriers to entry. Its goal is to expand capabilities and market reach through targeted acquisitions while delivering reliable sensing and imaging technology for critical industries.

Company size
11-50
Company stage
IPO
Headquarters
Thousand Oaks, CA
Founded
1960

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