Full-Time

LTE Layer 2 Development

Mirafra Technology

Mirafra Technology

1,001-5,000 employees

Turnkey ASIC design and semiconductor engineering

No salary listed

Hyderabad, Telangana, India

In Person

Category
Software Engineering (1)

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Requirements
  • Protocol stack background in LTE with relevant experience in MAC, RLC, or PDCP.
  • Strong programming skills.
  • Embedded debugging skills.
  • Candidates with Layer 1 experience are also considered.
Mirafra Technology

Mirafra Technology

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Website

Mirafra Technologies delivers end-to-end ASIC and semiconductor engineering services from concept to silicon to system. It covers the full lifecycle—architecture, design, verification, physical implementation, packaging, embedded software, post-silicon validation, testing, and system solutions—with 2,200+ engineers and global delivery centers. The company positions itself as a one-stop partner, combining deep domain expertise with scalable software, AI, cloud, and data capabilities to support 50+ customers from startups to large tech firms. Its goal is to help customers speed time-to-market, reduce engineering complexity, and deliver next-generation semiconductor and intelligent system solutions with confidence.

Company Size

1,001-5,000

Company Stage

N/A

Total Funding

N/A

Headquarters

Bengaluru, India

Founded

2004

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Simplify Jobs

Simplify's Take

What believers are saying

  • Mirafra showcased Ramanujan at IESA Vision Summit 2026, strengthening credibility with chip customers.
  • August 2026 openings span 10 roles, signaling continued demand and pipeline growth.
  • Mirafra's 2026 embedded and analog hiring expands beyond core physical design services.

What critics are saying

  • Mirafra depends on semiconductor services budgets; client pullbacks hit revenue immediately.
  • Current hiring drives show chronic specialist churn, especially in Bangalore and Pune.
  • Without product revenue, Mirafra remains a services firm exposed to commodity pricing pressure.

What makes Mirafra Technology unique

  • Mirafra taped out Ramanujan, a 22-nm SoC, on TSMC in January 2026.
  • Mirafra offers end-to-end silicon delivery, from architecture through bring-up and lab validation.
  • Mirafra spans Bengaluru, Hyderabad, Noida, Austin, Munich, and Kuala Lumpur offices.

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