LTE Layer 2 Development
Mirafra Technology
LTE Layer 2 Development
Mirafra Technology
Turnkey ASIC design and semiconductor engineering
- Protocol stack background LTE, with relevant experience in MAC/RLC/PDCP. Open for L1 candidates as well.
- Strong programming, embedded debugging skills.
All your information will be kept confidential according to EEO guidelines.
Turnkey ASIC design and semiconductor engineering
Mirafra Technologies delivers end-to-end turnkey ASIC design and semiconductor engineering services to help global tech companies move from concept to silicon to system. It covers the full lifecycle: architecture, design, verification, physical implementation, package/board design, embedded software, post-silicon validation, test and product engineering, and system solutions. With 2,200+ engineers and delivery centers worldwide, Mirafra has completed 650+ tape-outs for over 50 semiconductor customers, from startups to established firms. Its edge comes from a one-stop engineering partner model that combines deep domain expertise with scalable AI, cloud, data engineering, and software capabilities to speed time-to-market and reduce engineering complexity.
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