O

onsemi

Semiconductors for intelligent power and sensing

Lead Reliability Engineer - Advanced Packaging

Quality EngineeringConfirmed live in the last 24 hours
Full-timeNo salary listed

About the Job

Requirements

  • A bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, or a related technical field is required; a master's degree or PhD is preferred.
  • At least 8 years of relevant experience in semiconductor, power-electronics, packaging, or product reliability, including leadership of complex qualification or reliability programs.
  • Demonstrated experience with die- and package-level reliability, advanced packaging, power modules, and associated failure mechanisms.
  • Strong knowledge of reliability test methods, acceleration principles, qualification planning, and applicable industry standards such as JEDEC, AEC-Q, and AQG 324.
  • Experience translating customer use conditions or system mission profiles into reliability requirements and validation plans.
  • Working knowledge of statistical analysis and reliability methods using JMP, ReliaSoft, Minitab, Python, or equivalent tools.
  • Experience leading cross-functional problem solving, failure analysis, root-cause investigations, corrective actions, and technical risk assessments.
  • Ability to communicate complex technical topics, qualification status, and risk trade-offs to customers and executive stakeholders in writing and verbally.
  • Ability to manage multiple priorities and deliver results in a fast-paced development environment.
  • Ability to travel within the United States and internationally as required.

Responsibilities

  • Own the reliability strategy for complex power-module and advanced-packaging platforms, including die, interconnect, package, materials, and assembly-process qualification for high-power applications.
  • Translate customer use conditions, system mission profiles, and application requirements into measurable reliability targets, acceleration models, stress conditions, and qualification plans.
  • Apply physics-of-failure and design-for-reliability methods to identify critical failure mechanisms, define reliability margins, and influence design and material selections early in development.
  • Develop and deploy reliability test and characterization methods, including appropriate electrical, thermal, mechanical, environmental, and power-cycling stresses.
  • Own reliability test planning and execution, including sample strategy, test conditions, acceptance criteria, schedules, logistics, data quality, and risk-based prioritization.
  • Use statistical methods to analyze reliability data, establish confidence in conclusions, and support lifetime or degradation modeling where applicable.
  • Partner with cross-functional teams to develop characterization routines and qualification strategies for New Technology Development and New Product Development (NPD).
  • Lead investigation and technical closure of reliability failures through structured failure analysis, root-cause determination, corrective actions, and validation of effectiveness.
  • Maintain qualification status, risk registers, decision points, and escalation paths; communicate technical conclusions and residual risks to customers and executive stakeholders.
  • Serve as a key quality and reliability interface with customers during product development, qualification, and issue resolution.
  • Provide technical leadership and mentoring to engineers and cross-functional teams on reliability methods, standards, and problem solving.
  • Manage multiple concurrent qualification and characterization programs while meeting project commitments and maintaining technical rigor.

Desired Qualifications

  • Experience with high-power semiconductor devices and modules, including Si, IGBT, SiC, or GaN technologies.
  • Experience with thermal-mechanical reliability, interconnect reliability, power cycling, temperature cycling, humidity-bias testing, and lifetime modeling.
  • Experience supporting automotive or industrial customers and working within structured product-development and change-control processes.
  • Experience developing new test methods or test vehicles where existing industry-standard methods are insufficient.

About the Company

onsemi

Semiconductors for intelligent power and sensing

onsemi designs and manufactures semiconductors with a focus on intelligent power and sensing technologies for automotive and industrial markets. Its products include power management ICs and sensors that regulate energy, monitor conditions, and provide control signals for EVs, ADAS, factory automation, robotics, and energy infrastructure. The company differentiates itself by its specialized emphasis on intelligent power and sensing across both sectors and through its direct OEM relationships and global distributor network. Its goal is to improve energy efficiency and enable smarter, more capable systems for electrification, autonomy, and sustainable energy solutions.

Company size
10,001+
Company stage
IPO
Headquarters
Scottsdale, AZ
Founded
1999

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