L

Lyte AI

Robotics perception platform with silicon-level fusion

Test and Reliability Leader

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeIn-person

About the Job

Requirements

  • A Master's or Ph.D. degree in Mechanical Engineering, Physics, or a related field, with at least 3 years of relevant experience.
  • Experience with optical module and/or LiDAR assembly.
  • Experience or knowledge of optical sensors, optical device packaging processes, or optical module assembly processes.
  • Experience with assembly process integration, process-flow design, and continuous process improvement.
  • Expertise in mechanical drawings using SolidWorks, mechanical simulation, and thermal simulation.
  • Project management capability or experience.
  • Experience working with foundries, OSATs, assembly houses, PCBA fabrication, and contract manufacturers in process development and yield improvement.
  • Ability to work independently, take ownership of projects, and collaborate in cross-functional teams.
  • Ability to learn quickly.
  • Good work ethic.
  • Ability to protect confidential company information and intellectual property.

Responsibilities

  • Lead optical engine and system module assembly, including automation and tooling design to increase units per hour and yield and reduce cost, using customized hardware and software development based on statistical process control and improving process capability indices.
  • Support device packaging research and development and new product introduction with mechanical design, drawings, and thermal modeling.
  • Support device-testing automation and data-analysis automation, including scripts or software development and implementation.
  • Work with research and development to understand device specifications, particularly mechanical control outlines and assembly requirements, and negotiate among incoming device requirements, mechanical design, and assembly processes based on design improvements and experimental data from designed experiments.
  • Work with outsourced semiconductor assembly and test providers to support new product introduction and volume-production contract manufacturing, including drafting technical statements of work.
  • Act as the technical project manager for owned projects.
  • Provide design for manufacturing, design for reliability, and design for test inputs to hardware research and development teams for device packaging and assembly.
  • Maintain documentation and initiate engineering change notices and product change notices when needed.
  • Develop and track packaging and assembly component specifications and inventory.
  • Audit and regularly visit contract manufacturers and suppliers, then provide reports.
  • Write technical reports and present results to internal and external stakeholders.
  • Build and grow the worldwide operations process team.

Desired Qualifications

  • Knowledge of or work experience with printed circuit board assembly.
  • Previous experience packaging microelectronic and optical devices.
  • Understanding of silicon photonics.
  • Experience with failure mode and effects analysis, failure analysis, and 8D reports.
  • Supplier quality management experience.
  • Knowledge of LiDAR and related technologies.
  • Previous experience writing technical statements of work.
  • Familiarity with engineering change notices, product change notices, and documentation.

About the Company

Lyte AI

Robotics perception platform with silicon-level fusion

Lyte AI builds an end-to-end perception stack for robots, from custom sensing silicon to software. Its LyteVision platform combines camera data, inertial measurements, and a 4D distance-velocity sensor into a single synchronized data stream at the silicon level. This reduces latency and calibration drift that can occur when stitching together separate sensors. The system is designed for industrial uses such as inspection, logistics, and manufacturing robots, and also aims to power broader Physical AI platforms. The company differentiates itself through its fully integrated, silicon-level sensor fusion and a pedigree of engineers who helped create depth sensing for devices like Face ID and Kinect, backed by substantial funding to scale silicon production and deployments. Its goal is to provide reliable, low-latency robot perception to enable scalable automation across industrial settings.

Company size
51-200
Company stage
Series C
Total funding
$272M
Headquarters
Mountain View, CA
Founded
2021

Recently Posted Jobs

Explore more opportunities at Lyte AI

See more jobs