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Kandou AI

Provides chip-to-chip AI connectivity solutions

SerDes Architecture and Modeling Engineer

Telecommunications EngineeringConfirmed live in the last 24 hours
Full-timeNo salary listed

About the Job

Requirements

  • Good knowledge of control theory and digital algorithms.
  • Demonstrated skill in implementing signal-processing algorithms.
  • Understanding of digital communication link building blocks and factors affecting link performance; familiarity with SerDes link components and clock recovery circuits is a plus.
  • Proficiency in at least one of C++, MATLAB, or Python with NumPy.
  • Familiarity with the Git version-control system and software-engineering fundamentals, including unit testing and profiling.
  • Familiarity with analog circuit simulators such as SPICE or Spectre.
  • Familiarity with signal-integrity principles.
  • Bachelor of Engineering in Electronics and Electrical Engineering, Communication Systems, or Computer Science (or equivalent or higher), with a strong background in signal processing and good understanding of circuit theory.

Responsibilities

  • Implement, document, and maintain software for system-level modeling of serial communication links using MATLAB, Python, and C++.
  • Work with system architects to budget the link and define block-level specifications for the transceiver.
  • Work with analog, digital, and verification teams to support the design and verification process.

Desired Qualifications

  • Five or more years of experience in the semiconductor, telecommunications, or mathematical/scientific software industry.
  • Experience with system-level simulation of digital communication systems; experience with SerDes links is a plus.
  • Experience working with geographically dispersed teams.
  • Familiarity with SerDes link components and clock recovery circuits.

About the Company

Kandou AI

Provides chip-to-chip AI connectivity solutions

Kandou AI designs and sells semiconductor connectivity hardware for AI workloads. It provides a memory fabric and CXL controllers that link processors to memory, enabling scalable, energy-efficient AI inference and training clusters built from affordable hardware. Using Copper MIMO interconnect, it reduces energy per bit and supports features like offloading AI training collectives, switchless memory for in-memory databases, and field-repairable co-packaged optics for better cooling. By targeting the data-movement bottleneck between processors and memory and offering chiplet-based fabrics and IP licensing, Kandou AI aims to make scalable AI infrastructure more accessible to hyperscalers, data centers, and system integrators.

Company size
201-500
Company stage
Late Stage VC
Total funding
$504.7M
Headquarters
Lausanne, Switzerland
Founded
2011

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