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Lyte AI

Robotics perception platform with silicon-level fusion

Technical Program Engineer/Manager

Program ManagementConfirmed live in the last 24 hours
Full-timeVietnam

About the Job

Requirements

  • A Bachelor's or Master's degree in Science, Engineering, Semiconductor Manufacturing, Operations, or a related field.
  • Strong verbal and written English communication skills that are clear, efficient, and precise.
  • At least 1 year of industry experience, including semiconductor manufacturing, OSAT management, technical program management, or operations.
  • Understanding of semiconductor assembly, packaging, test flow, qualification, and manufacturing execution, or the ability to learn these quickly.
  • Ability to drive cross-functional execution without direct authority.
  • Strong communication, stakeholder management, and executive reporting skills.
  • Experience with schedule management, risk tracking, and issue escalation frameworks.
  • Understanding of engineering data statistics.
  • Data analysis skills, including at least using Excel.

Responsibilities

  • Lead the monitoring and execution of device and module package assembly and test activities as program lead.
  • Coordinate with internal teams—including Product Engineering, Process Engineering, Quality, Operations, Supply Chain, NPI, and Manufacturing—and OSAT teams to deliver program milestones.
  • Identify resource gaps in equipment, engineering support, staffing, materials, qualification capacity, and test readiness, and proactively request additional resources to meet timeline and quality objectives.
  • Establish escalation paths and secure management alignment when schedule, quality, or capacity risks are identified.
  • Lead program reviews and communicate status, risks, dependencies, and mitigation plans to executive stakeholders.
  • Track manufacturing KPIs, including cycle time, yield, throughput, line utilization, and on-time delivery.
  • Drive resolution of technical and operational blockers by coordinating root cause analysis and corrective actions.
  • Support new product introduction, qualification builds, ramp readiness, and sustaining production.
  • Ensure OSAT execution aligns with the product roadmap, customer commitments, and operational targets.
  • Build working relationships with OSAT management and influence prioritization of shared resources.
  • Understand the technical aspects of each project and facilitate communication with internal owners.
  • Assess program requirements and forecast resource demand across engineering, manufacturing, and test operations.
  • Develop business cases and justifications for requesting incremental OSAT support.
  • Negotiate execution priorities and secure staffing commitments during critical development and production phases.
  • Coordinate rapid response teams for yield excursions, qualification delays, and production disruptions.
  • Travel occasionally to OSAT partner sites for business meetings, milestone reviews, or issue resolution, as needed.

Desired Qualifications

  • A higher degree with more experience.
  • Previous experience in similar work.
  • Experience with device packaging and micro-mechanical system assembly.
  • Familiarity with yield analysis, statistical process control (SPC), design of experiments (DOE), and manufacturing quality systems.
  • Understanding of or experience with printed circuit board assembly (PCBA) or surface-mount technology (SMT) lines.
  • Experience with optical device or system assembly.
  • Project Management Professional (PMP) or program management certification.

About the Company

Lyte AI

Robotics perception platform with silicon-level fusion

Lyte AI builds an end-to-end perception stack for robots, from custom sensing silicon to software. Its LyteVision platform combines camera data, inertial measurements, and a 4D distance-velocity sensor into a single synchronized data stream at the silicon level. This reduces latency and calibration drift that can occur when stitching together separate sensors. The system is designed for industrial uses such as inspection, logistics, and manufacturing robots, and also aims to power broader Physical AI platforms. The company differentiates itself through its fully integrated, silicon-level sensor fusion and a pedigree of engineers who helped create depth sensing for devices like Face ID and Kinect, backed by substantial funding to scale silicon production and deployments. Its goal is to provide reliable, low-latency robot perception to enable scalable automation across industrial settings.

Company size
51-200
Company stage
Series C
Total funding
$272M
Headquarters
Mountain View, CA
Founded
2021

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