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Kandou AI

Provides chip-to-chip AI connectivity solutions

Firmware Engineer Bare Metal

Embedded EngineeringConfirmed live in the last 24 hours
Full-timeNo salary listed

About the Job

Requirements

  • Strong experience designing, coding, and debugging real-time applications in C and/or C++ in an embedded environment.
  • Experience using or implementing a real-time scheduler or real-time operating system.
  • Knowledge of 32-bit processor architecture.
  • Experience interfacing with hardware and peripherals, including SPI, I2C/SMBus, and JTAG.
  • Ability to debug at application and hardware levels.
  • Appreciation of software validation and verification techniques.
  • Ability to develop under Linux and Windows.
  • Experience using modern software development workflows, including CI, GitLab, make, and CMake.
  • Experience working in a team.
  • Experience in embedded C/C++.
  • Experience coding for a low-level microprocessor or microcontroller.
  • Experience optimizing low-level code to meet real-time performance targets.
  • Experience programming in interpreted object-oriented high-level languages such as Python.
  • Experience working and programming on multiple platforms, including Unix, Linux, Windows, and macOS.

Responsibilities

  • Develop, test, and maintain embedded firmware for silicon products.
  • Implement and run a software test suite to ensure code robustness.
  • Migrate, consolidate, and develop existing silicon debug software.
  • Design and support software for the silicon design infrastructure.

Desired Qualifications

  • Development experience in a modern high-level scripting language such as Python or Lua.
  • Experience interfacing with flash memory, including in-field update techniques.
  • Appreciation of cryptographic algorithms and disciplines.
  • Knowledge of SerDes technology.
  • Hardware interfacing and electronics knowledge.
  • Network programming experience.

About the Company

Kandou AI

Provides chip-to-chip AI connectivity solutions

Kandou AI designs and sells semiconductor connectivity hardware for AI workloads. It provides a memory fabric and CXL controllers that link processors to memory, enabling scalable, energy-efficient AI inference and training clusters built from affordable hardware. Using Copper MIMO interconnect, it reduces energy per bit and supports features like offloading AI training collectives, switchless memory for in-memory databases, and field-repairable co-packaged optics for better cooling. By targeting the data-movement bottleneck between processors and memory and offering chiplet-based fabrics and IP licensing, Kandou AI aims to make scalable AI infrastructure more accessible to hyperscalers, data centers, and system integrators.

Company size
201-500
Company stage
Late Stage VC
Total funding
$504.7M
Headquarters
Lausanne, Switzerland
Founded
2011

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