Texas Instruments

Makes analog and embedded chips in its own plants

Packaging Engineer Intern

Board & Electronics DesignConfirmed live in the last 24 hours

Internship · Winter 2026No salary listedIn-person

About the Job

Requirements

Currently pursuing a Master's degree in Mechanical Engineering, Materials Science, Chemical Engineering, Optical Science, Electrical Engineering, or a related field.
A cumulative GPA of 3.0/4.0 or higher.

Responsibilities

Interface across various work areas and organizations to support the design, development, and analysis of semiconductor packaging technologies for analog and embedded processing products.
Participate in cross-functional teams to develop internal and external solutions for semiconductor packaging technologies, including wirebond, flip chip, modules, system-in-package, and other advanced packages at different stages of readiness.
Work on packaging advancements involving material, mechanical, thermal, and electrical characterization.

Desired Qualifications

Coursework or research in semiconductor packaging or fabrication.
Experience with AutoCAD design and finite element method modeling.
Strong fundamentals in heat transfer, thermodynamics, and stress analysis.
Experience with semiconductor MEMS or 3D integration design and fabrication.
Project experience in CVD, PVD, thin-film deposition, electroplating, plasma etch, machine-learning-based package design, wafer bumping, or optical packaging.
Experience with plating, adhesion, and surface-treatment processes.
Hands-on experience with semiconductor fabrication and characterization tools, including VI Scopes, X-ray inspection, materials characterization, and failure-analysis techniques.
Strong written and verbal communication skills.
Demonstrated analytical and problem-solving skills.
Ability to work in teams and collaborate effectively with people in different functions.
Strong time-management skills that enable on-time project delivery.
Ability to build strong, influential relationships.
Ability to work effectively in a fast-paced and rapidly changing environment.
Ability to take initiative and drive results.

Change the world. Love your job.

Interface across various work areas and organizations to help with the design, development, and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products. Assignments may include participation in cross-functional teams to develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness. Cultivate packaging advancements with work in material, mechanical, thermal, and electrical characterization. TI's innovative packaging technologies are designed to solve customers' problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power.

Put your talent to work with us as a Packaging Engineering Intern !

Minimum Requirements:

Currently pursuing a Masters degree in Mechanical Engineering, Materials Science, Chemical Engineering, Optical Science, Electrical Engineering or related.
Cumulative 3.0/4.0 GPA or higher

Preferred Qualifications:

Coursework or research in semiconductor packaging/fabrication
Experience with AutoCAD design and FEM modeling
Strong fundamentals in heat transfer, thermodynamics, and stress analysis
Experience with Semiconductor MEMS/3D integration design and fabrication
Project experience in the areas of: CVD, PVD, thin film deposition, electroplating, plasma etch, ML based package design, wafer bumping, or optical packaging
Experience with plating, adhesion, surface treatment process
Hands experience with semiconductor fabrication and characterization tools including VI Scopes, X-ray Inspection, materials characterization, and FA techniques
Strong written and verbal communication skills
Demonstrated analytical and problem solving skills
Ability to work in teams and collaborate effectively with people in different functions
Strong time management skills that enable on-time project delivery
Ability to build strong, influential relationships
Ability to work effectively in a fast-paced and rapidly changing environment
Ability to take the initiative and drive for results

About the Company

Texas Instruments

Makes analog and embedded chips in its own plants

Texas Instruments designs and makes analog and embedded processing chips, the basic parts inside cars, factory equipment, data centers, and consumer electronics, and it sells one of the broadest chip catalogs in the industry. In 1958, its engineer Jack Kilby built the first integrated circuit, the building block of modern electronics, and later won a Nobel Prize for it. Its analog chips regulate power and convert signals such as sound and heat into data, while its microcontrollers act as small built-in computers, and TI earns money selling both to device makers. It also makes the graphing calculators many students use in math class. Texas Instruments was founded in 1930 and is based in Dallas, Texas.

Company size: 10,001+
Company stage: IPO
Headquarters: Dallas, TX
Founded: 1930

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