Tesla

Makes electric cars, robotaxis and grid batteries

Device Engineer - SI

Hardware EngineeringUpdated on Nov 13

Full-timePalo Alto, CA, USANo salary listedIn-person

About the Job

Requirements

A degree in Electrical Engineering, Applied Physics, Materials Science, or a related field, or equivalent practical experience.
At least 8 years of experience in silicon device engineering, product engineering, yield engineering, or process integration at a semiconductor company, integrated device manufacturer, foundry, or fabless product organization.
A strong foundation in complementary metal-oxide-semiconductor device physics, including short-channel effects, variability, leakage, reliability mechanisms, and process-device interactions.
Hands-on experience taking products from first silicon to high-volume production, including automated test equipment program correlation, binning, outlier detection, and yield entitlement analysis.
Proficiency with semiconductor data analysis tools such as JMP and Python or R, yield management systems, and large parametric and defect datasets.
Working knowledge of backend/test and packaging, including wirebond, flip-chip, wafer-level chip-scale packaging, and advanced packaging, and how package stress couples into device reliability.
Demonstrated ability to lead cross-company technical programs with foundries and outsourced semiconductor assembly and test providers, and to write technical specifications, qualification documents, and executive summaries.
Ability to set product engineering strategy across multiple tape-outs or product lines, resolve systemic yield and reliability issues, and raise the technical standard of the team.

Responsibilities

Own device and product engineering for assigned silicon products, including electrical specifications, binning strategy, guard bands, datasheet and parametric limits, and production test correlation for wafer sort, final test, and system-level test.
Drive new product introduction from tape-out through process and package qualification, yield ramp, and release to high-volume manufacturing.
Analyze wafer fabrication, assembly, and test data to identify yield limiters; lead design of experiments and process/device experiments with foundry partners to improve parametric yield, defect-density impact, and cost per good die.
Define and execute reliability qualification plans covering high-temperature operating life, human-body and charged-device-model electrostatic discharge, latch-up, electromigration and stress migration, time-dependent dielectric breakdown, negative- and positive-bias temperature instability, hot-carrier injection, and package stress; model lifetime and set use conditions aligned to automotive and Tesla mission profiles.
Partner with Design and Design for Test on design for yield and reliability, corner validation, silicon debug, and failure isolation using scan, memory built-in self-test, analog diagnostics, photon emission, and focused-ion-beam edits as needed.
Own the technical interface with foundries and outsourced semiconductor assembly and test providers, including process change reviews, excursion management, statistical process control limits, baseline recipes, and continuous-improvement roadmaps.
Characterize device behavior across process, voltage, and temperature corners; refine SPICE/model-hardware correlation and provide device-target feedback to process and design teams.
Lead root-cause investigations for fabrication, package, and field failures; convert failure-analysis findings into permanent corrective actions in process, test coverage, or design.
Establish product engineering dashboards, excursion playbooks, and release criteria; mentor Device, Product, and Test engineers on rigorous data-driven methods.
Advise architecture and technology selection, including node, process variant, and packaging such as advanced packaging and system-in-package, based on performance, power, reliability, and supply risk.

Desired Qualifications

A Master of Science or Ph.D. is strongly preferred for Senior Staff, especially with a device physics focus.
Experience with automotive or high-reliability qualification frameworks, including AEC-Q100, collaboration with safety teams on ISO 26262, and JEDEC JESD47/JESD22 families.
Ten or more years of experience in silicon device engineering, product engineering, yield engineering, or process integration is preferred.

Category	Supply Chain
Location	PALO ALTO, California
Requisition ID	281954
Type	Full-time

Job Description

<p>As a Device Engineer, SI at Tesla, you will own silicon device performance, yield, reliability, and productization for critical custom and semi-custom ICs used across vehicle electronics, energy products, and autonomy compute. You will bridge device physics, process technology, design, test, and high-volume manufacturing—turning wafer and package data into actionable product decisions at Tesla pace. </p><p>You will set device and product engineering standards, lead yield and reliability ramp for new silicon nodes and packages, resolve complex fab and field issues, and guide foundry/OSAT partners with technical authority. This is a hands-on, high-ownership role for engineers who can move fluidly from TCAD and SPICE to probe data, burn-in Pareto charts, and executive-ready recommendations. </p>

Job Responsibilities

Own device and product engineering for assigned silicon products: electrical specs, binning strategy, guard bands, datasheet/parametric limits, and production test correlation (wafer sort, final test, SLT)

Drive new product introduction (NPI) from tape-out through process qualification, package qualification, yield ramp, and high-volume manufacturing release

Analyze wafer fab, assembly, and test data to identify yield limiters; lead DOE and process/device experiments with foundry partners to improve parametric yield, defect density impact, and cost per good die

Define and execute reliability qualification plans (HTOL, HBM/CDM ESD, latch-up, EM/SM, TDDB, NBTI/PBTI, HCI, package stress); model lifetime and set use conditions aligned to automotive and Tesla mission profiles

Partner with Design and DFT on design-for-yield/reliability, corner validation, silicon debug, and failure isolation (scan, memory BIST, analog diagnostics, photon emission, FIB edit as needed)

Own technical interface with foundries and OSATs: process change review (PCN), excursion management, SPC limits, baseline recipes, and continuous improvement roadmaps

Characterize device behavior across PVT corners; refine SPICE/model-hardware correlation and feedback device targets to process and design teams

Lead root-cause investigations for fab, package, and field failures; convert FA findings into permanent corrective actions in process, test coverage, or design

Establish product engineering dashboards, excursion playbooks, and release criteria; mentor Device, Product, and Test engineers on rigorous data-driven methods

Advise architecture and technology selection (node, process variant, packaging—including advanced packaging/SiP) based on performance, power, reliability, and supply risk

Job Requirements

Degree in Electrical Engineering, Applied Physics, Materials Science, or related field, or equivalent practical experience. M.S. or Ph.D. strongly preferred for Senior Staff, especially with device physics focus

8+ years (10+ years preferred) in silicon device engineering, product engineering, yield engineering, or process integration at a semiconductor company, IDM, foundry, or fabless product organization

Strong foundation in CMOS (and relevant specialty) device physics: short-channel effects, variability, leakage, reliability mechanisms, and process–device interactions

Hands-on experience taking products from first silicon to high-volume production, including ATE program correlation, binning, outlier detection (e.g., PAT/SBL), and yield entitlement analysis

Proficiency with semiconductor data analysis stacks (e.g., JMP, Python/R, yield management systems) and comfort with large parametric and defect datasets

Experience with automotive or high-reliability qualification frameworks (AEC-Q100, ISO 26262 collaboration with safety teams, JEDEC JESD47/JESD22 families) preferred

Working knowledge of backend/test and packaging (wirebond, flip-chip, WLCSP, advanced packaging) and how package stress couples into device reliability

Demonstrated ability to lead cross-company technical programs with foundries/OSATs; crisp technical writing for specs, quals, and executive summaries

Set product engineering strategy across multiple tape-outs or product lines, resolve systemic yield/reliability issues, and raise the technical standard of the team

Thrives in a fast-paced environment; bias to first-principles debug, rapid experimentation, and ownership through production

About the Company

Tesla

Makes electric cars, robotaxis and grid batteries

Tesla makes electric cars and batteries that store power for homes and utilities, and it develops self-driving software and humanoid robots. In 2023, its Model Y became the first electric vehicle to rank as the world's best-selling car. Buyers order the Model 3 sedan, Model Y SUV, or Cybertruck pickup directly from Tesla instead of through dealers, and they charge on its Supercharger fast-charging network. It also sells Megapack and Powerwall batteries, runs a robotaxi service, and charges drivers a monthly fee for self-driving software that still needs their supervision. Tesla was founded in 2003, with Elon Musk as its lead early investor and a recognized co-founder, and it is based in Austin, Texas.

Company size: 10,001+
Company stage: IPO
Headquarters: Austin, TX
Founded: 2003

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