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Kandou AI

Provides chip-to-chip AI connectivity solutions

AI Engineer Intern

AI Application EngineeringConfirmed live in the last 24 hours
InternshipSaint-Sulpice, SwitzerlandNo salary listed

About the Job

Requirements

  • The candidate must be currently enrolled at a university or higher education institution in Switzerland and already based in Switzerland.
  • The candidate should have a strong background in artificial intelligence and large language models.
  • The candidate must be proficient in software programming and in delivering high-quality code using AI coding agents.
  • The candidate should have experience with large language model systems, including tool-calling, agents, skills, structured output generation, and Model Context Protocol.
  • The candidate must be able to research independently.
  • A basic understanding of semiconductor or electronic design concepts or hardware description languages is a strong plus, but is not strictly required.

Responsibilities

  • Architect and build agentic systems and robust workflows that extract knowledge, execute complex reasoning, and generate design artifacts, while enforcing design rules and best practices derived from prior engineering projects and historical codebases.
  • Work closely with engineers across teams to identify engineering bottlenecks, gather feedback, and integrate solutions into their workflows.
  • Embed agentic tools directly into engineers’ environments and pipelines.
  • Design evaluation pipelines and refine systems based on evaluations and developer feedback.
  • Deliver modular, well-tested, and maintainable software.

Desired Qualifications

  • A basic understanding of semiconductor or electronic design concepts or hardware description languages.

About the Company

Kandou AI

Provides chip-to-chip AI connectivity solutions

Kandou AI designs and sells semiconductor connectivity hardware for AI workloads. It provides a memory fabric and CXL controllers that link processors to memory, enabling scalable, energy-efficient AI inference and training clusters built from affordable hardware. Using Copper MIMO interconnect, it reduces energy per bit and supports features like offloading AI training collectives, switchless memory for in-memory databases, and field-repairable co-packaged optics for better cooling. By targeting the data-movement bottleneck between processors and memory and offering chiplet-based fabrics and IP licensing, Kandou AI aims to make scalable AI infrastructure more accessible to hyperscalers, data centers, and system integrators.

Company size
201-500
Company stage
Late Stage VC
Total funding
$504.7M
Headquarters
Lausanne, Switzerland
Founded
2011

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