P

Powerlattice

Integrated power-delivery chiplet for compute

Senior or Staff Hardware Design Engineer

Board & Electronics Design +1Confirmed live in the last 24 hours
Full-timeChandler, AZ, USA

About the Job

Requirements

  • A Master of Science or Ph.D. in Electrical Engineering or a related field.
  • At least 5 years of hands-on hardware system design experience.
  • Proven experience as a technical lead or system lead.
  • Experience working with supply chain vendors.
  • Demonstrated leadership and mentorship capabilities.

Responsibilities

  • Define and drive overall hardware system architecture and top-level specifications.
  • Lead hardware system design and system integration.
  • Perform high-level feasibility analysis and risk assessment.
  • Review and approve hardware designs to ensure architectural alignment.
  • Drive system bring-up strategy and debug execution.
  • Perform hardware system design.
  • Conduct schematic design, simulation, analysis, and optimization to meet performance targets.
  • Provide PCB layout guidance and collaborate closely with PCB layout engineers to ensure design intent is met.
  • Collaborate with PI/SI engineers to ensure proper PDN performance.
  • Participate in design reviews and contribute to design documentation.
  • Participate in silicon bring-up, characterization, and debugging.
  • Follow best practices for hardware system design, verification, and signoff.

Desired Qualifications

  • Experience in server motherboard design.
  • Familiarity with power delivery design and component selection for high-performance server systems.

About the Company

Powerlattice

Integrated power-delivery chiplet for compute

PowerLattice develops power delivery chiplets that sit in the processor package to provide voltage regulation directly at the compute die. The chiplet packages miniaturized on-die inductors, voltage control circuits, a vertical packaging design, and a programmable software layer on a single silicon die to move power delivery closer to the compute core. This near-die integration differs from typical power management by delivering regulatory functions inside the chiplet itself, enabling substantial energy savings and easier scaling across AI accelerators, GPUs, and data-center CPUs. The goal is to improve efficiency and performance for next-generation compute by offering modular, near-die power regulation to hyperscalers, OEMs, and system integrators, with early sampling and trials planned for 2026.

Company size
11-50
Company stage
Late Stage VC
Total funding
$111M
Headquarters
Vancouver, WA
Founded
2023

Recently Posted Jobs

Explore more opportunities at Powerlattice

See more jobs