PowerLattice designs power delivery chiplets that attach to the processor package and regulate voltage directly at the compute die. The monolithic chiplet combines on-die magnetic inductors, voltage control circuits, vertical packaging, and a programmable software layer on a single silicon die, bringing power delivery closer to the cores. This approach reduces total compute power by over 50% and can double performance while easing cooling, and it is scalable for AI accelerators, GPUs, and data-center processors. The company sells these chiplets to hyperscalers, OEMs, and system integrators, with early trials planned for 2026, aiming to improve energy efficiency and compute performance through near-die, integrated power regulation.
Company Size
11-50
Company Stage
Series A
Total Funding
$25M
Headquarters
Vancouver, Washington
Founded
2023
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PowerLattice raised $25M led by Playground Global and Celesta. The company’s chiplet cuts compute power needs by >50%, breaking the "AI power wall."