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NXP Semiconductors

Automotive semiconductors and secure embedded solutions

Next Generation SoC Integration Solution Lead

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeNoida, Uttar Pradesh, IndiaNo salary listedIn-person

About the Job

Requirements

  • Experience with the IP-XACT (IEEE 1685) standard and metadata-driven design methodologies.
  • Expertise in Magillem and/or Defacto-based SoC assembly flows.
  • Experience with register generation tools such as CSRCompiler, RgGen, SystemRDL-based flows, or equivalent.
  • Familiarity with FPGA prototyping, emulation environments, and virtual platforms.
  • Understanding of SoC bring-up, validation, and post-silicon integration requirements.
  • Exposure to AI/ML-assisted design automation and methodology development is a plus.

Responsibilities

  • Work closely with architecture, design, verification, software, emulation, and physical design teams to enable successful subsystem and SoC integration.
  • Drive and own SoC assembly and integration activities, including IP onboarding, subsystem construction, top-level SoC generation, and integration validation.
  • Develop, maintain, and enhance IP-XACT-based methodologies using tools such as Magillem, Defacto SoC Compiler, Socrates, and other SoC integration platforms.
  • Define and manage SoC memory maps, address allocation, clocking architecture, reset architecture, power domains, and security integration.
  • Develop and maintain reusable automation frameworks and integration flows to improve productivity and ensure consistency across projects.
  • Manage IP packaging, configuration, version control, and integration compliance according to organizational standards and best practices.
  • Generate and maintain integration deliverables including RTL, IP-XACT descriptions, register specifications, software artifacts, documentation, and design databases.
  • Collaborate with IP providers and subsystem owners to resolve integration issues and ensure compatibility with SoC integration standards.
  • Debug and resolve connectivity mismatches, protocol violations, clock/reset issues, address conflicts, integration-flow failures, and configuration-related problems.
  • Drive integration quality by supporting lint, CDC, RDC, structural validation, and design signoff activities.
  • Participate in the definition and deployment of next-generation SoC integration methodologies and infrastructure.
  • Work with software and firmware teams to ensure smooth handoff of register maps, memory maps, and hardware configuration data.
  • Take ownership of specific integration domains while aligning deliverables with global methodology and project requirements.
  • Mentor junior engineers and provide technical leadership in SoC integration methodologies, IP-XACT adoption, and automation development.
  • Contribute to methodology roadmap initiatives focused on improving design reuse, automation, scalability, and integration quality across multiple SoC programs.

About the Company

NXP Semiconductors

Automotive semiconductors and secure embedded solutions

NXP Semiconductors designs and sells semiconductor chips for vehicles and other devices. Its products include automotive-grade microcontrollers and other ICs used in engines, infotainment, safety systems, and networked car architectures. These chips process data, run software, and enable features such as advanced driver assistance and vehicle connectivity, often with strong security and real-time performance. Unlike some peers, NXP became an independent company after Philips spun off its semiconductor unit in 2006 and later merged with Freescale in 2015, building a focused strength in automotive semiconductors and microcontrollers. This gives it a clear niche in the market and the goal of growing as a standalone leader in smarter, connected vehicles and related technologies.

Company size
10,001+
Company stage
IPO
Headquarters
Eindhoven, Netherlands
Founded
2004

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