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Apple

Designs phones, computers and their operating systems

Design for Manufacturing - Printed Circuit Board Assembly, Engineer

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeBengaluru, Karnataka, IndiaNo salary listed

About the Job

Requirements

  • A Bachelor of Science or Master of Science degree in Mechanical, Electrical, Industrial, Chemical, or Manufacturing Engineering is required.
  • Five to six years of experience working in printed circuit board assembly or with surface mount technology at a contract manufacturer, or equivalent related experience, is required.
  • At least five years of experience in printed circuit assembly manufacturing processes is required.
  • Knowledge of surface mount technology processes, including stencil printing, pick and placement, reflow, hotbar, robotic or laser soldering, and anisotropic conductive film processes, is required.
  • Experience developing process quality plans, conducting supplier quality audits, driving corrective actions, and performing failure analysis is required.
  • Willingness to travel domestically and internationally to supplier sites approximately 60% of the time is required.

Responsibilities

  • Attend development builds as required under the direction of the Operations Engineering Directly Responsible Individual.
  • Provide guidance and resources to contract manufacturing partner engineers.
  • Act as project leader on a variety of complex projects.
  • Plan, develop, and implement technically complex procedures for printed circuit board assembly manufacturing, rework, and testing.
  • Recommend changes to in-circuit testing and functional testing equipment, manufacturing processes, and new testing requirements.
  • Design and develop technically complex new processes to improve quality and efficiency.
  • Provide early manufacturing involvement to ensure new products are manufacturable, including reducing costs in design and printed circuit board assembly manufacturing tooling, influencing designs for manufacturability, and reducing complexity through standard-size packaging.
  • Interface with the Apple printed circuit board assembly subcontractor and manage technical aspects of volume manufacturing builds, including rework processes, under the direction of the Operations Engineering Directly Responsible Individual.
  • Ensure Apple printed circuit board assembly subcontractors and joint-design-manufacturing partners adhere to process parameters, procedures, and approved manufacturing and test processes.
  • Ensure specified quality levels are maintained at printed circuit board assembly manufacturing sites.

Desired Qualifications

  • Working knowledge of printed circuit board assembly reliability concepts and failure analysis techniques such as energy-dispersive X-ray spectroscopy, scanning electron microscopy, and Fourier-transform infrared spectroscopy.
  • Experience developing and evaluating various surface mount technology processes.
  • Project management experience and a deep understanding of problem-solving tools, including design of experiments, root cause analysis, and statistical analysis tools.
  • Experience with packaging technology, chip-scale or wafer-level chip-scale packaging technology, molding processes, or system-in-package construction.
  • Ability to explain complex problems to a wide variety of technical and non-technical audiences.
  • Ability to work with multiple cross-functional teams.

About the Company

Apple

Designs phones, computers and their operating systems

Apple designs and sells consumer electronics, from iPhone smartphones and Mac computers to tablets and wearable devices. Its operating systems manage apps and built-in functions for communication and work, while iCloud stores files and synchronizes data across devices. Customers buy additional digital services through subscriptions such as Apple Music and Apple TV, and developers distribute software through the App Store. Apple earns money from hardware sales, subscriptions and digital transactions, selling directly to customers and through retailers and mobile carriers around the world. It was founded in 1976 and has its headquarters in Cupertino, California.

Company size
10,001+
Company stage
IPO
Headquarters
Cupertino, CA
Founded
1976

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