Senior Principal Packaging Engineer

As a member of the Advanced Packaging team, you will manage various aspects of image sensor packaging technology development, process improvement, and new product introduction including CSP, BGA, LGA and related packages for sensing systems utilized in Automotive, Industrial and Consumer applications.  You will directly support and contribute to the corporate product and technology development.

You will interact directly with the corporate business units, design engineering, product engineering, reliability teams, operations, external material suppliers, and external subcontract assembly packaging service providers.  In addition to packaging development and new product introduction, you will be responsible for developing analytical techniques for evaluating new package designs and technologies through quantitative and qualitative approaches including statistical analysis, and design of experiments.

• Master’s degree or above in Engineering, Physics, Chemistry or Materials.
• Preferred year experiences: Master>10 years or PhD>6 years, in semiconductor assembly packaging development, process engineering, materials development, and new product introduction.
• Experience with imager packaging and related sensor packaging preferred, including process and design related items. 
• Experience in wafer level CSP assembly and TSV-related processes is highly desirable. Experience with die attach, wire bonding and molding for BGA related packaging is a plus. 
• Possess a solid understanding of packaging materials and properties.
• Proven experience utilizing statistical analysis techniques such as DOE.
• Understanding of package reliability requirements for consumer, industrial, and automotive applications.
• Strong project management and problem-solving skills are needed.
• Bilingual in English and Mandarin Chinese
• Candidate should have basic to intermediate proficiency in AI tools relevant to productivity and decision-making.
• Familiarity with tools such as ChatGPT, Microsoft Copilot, or similar platforms for drafting reports and SOPs, generating training materials & supporting decision-making with quick data insights.

• Master’s degree or above in Engineering, Physics, Chemistry or Materials.
• Preferred year experiences: Master>10 years or PhD>6 years, in semiconductor assembly packaging development, process engineering, materials development, and new product introduction.
• Experience with imager packaging and related sensor packaging preferred, including process and design related items. 
• Experience in wafer level CSP assembly and TSV-related processes is highly desirable. Experience with die attach, wire bonding and molding for BGA related packaging is a plus. 
• Possess a solid understanding of packaging materials and properties.
• Proven experience utilizing statistical analysis techniques such as DOE.
• Understanding of package reliability requirements for consumer, industrial, and automotive applications.
• Strong project management and problem-solving skills are needed.
• Bilingual in English and Mandarin Chinese
• Candidate should have basic to intermediate proficiency in AI tools relevant to productivity and decision-making.
• Familiarity with tools such as ChatGPT, Microsoft Copilot, or similar platforms for drafting reports and SOPs, generating training materials & supporting decision-making with quick data insights.