Full-Time
Materials engineering equipment for semiconductors
$131k - $180k/yr
Company Historically Provides H1B Sponsorship
Santa Clara, CA, USA
In Person
Relocation support is available; travel is approximately 10% of the time.
Master's, PhD
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Applied Materials provides equipment, software, and services for materials engineering used in semiconductor and display manufacturing. Their systems modify materials at atomic scale to enable etching, deposition, inspection, and process control across chip and display fabrication. It differentiates itself by offering end-to-end hardware, software, and services that support customers from process development to high-volume production in both markets, backed by long-standing relationships with major tech firms. Its goal is to help customers turn scientific possibilities into mass-produced, advanced electronic devices.
Company Size
10,001+
Company Stage
IPO
Headquarters
Santa Clara, California
Founded
1967
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Flexible Work Hours
SKC's subsidiary Absolics has decided to raise approximately 400 billion won through a rights issue to fund glass substrate commercialisation. This marks the first deployment of funds from SKC's 1.17 trillion won capital raise in May, of which 589.6 billion won was earmarked for Absolics. The funding will support customer evaluations, production process improvements, and equipment upgrades at the first-phase factory currently producing prototypes. SKC holds 70.05% of Absolics, with Applied Materials owning 29.95%. The final investment amount will be determined based on each shareholder's participation. Absolics is pursuing both embedding and non-embedding glass substrate products. Embedding samples from its Georgia facility have completed preliminary evaluations and entered reliability testing. Non-embedding products are being submitted for supplier selection processes in the second half of 2025.
AI disrupts Glass Fiber manufacturing: predictive maintenance, digital twins, and a $6 billion infrastructure deal signal a new industrial era. "Predictive maintenance, digital twins and AI-enabled process optimization are reshaping glass fiber manufacturing as major infrastructure investment expands." Boston, Aug. 21, 2026 (GLOBE NEWSWIRE) - Artificial intelligence is reshaping one of manufacturing's most energy-intensive and capital-demanding sectors. AI Impact on Glass Fiber Market - BCC Pulse Report, published by BCC Research, examines how AI-powered technologies are transforming glass fiber production across predictive maintenance, process optimization, quality control, and supply chain management - as landmark investment deals and strategic R&D partnerships signal accelerating industry-wide adoption. Key Findings - Investment momentum is building rapidly. In March 2026, Corning and Meta entered a multiyear agreement valued at up to $6 billion to accelerate U.S. AI data center infrastructure, supporting advanced glass solutions for high-speed connectivity - underscoring glass fiber's strategic role in the AI computing ecosystem. - North America and Asia-Pacific are leading AI adoption. North America has emerged as a frontrunner in deploying predictive, data-driven manufacturing systems across the glass fiber and insulation value chain. Asia-Pacific is experiencing the fastest growth in AI integration, driven by large-scale production capacity, rapid industrialization, and surging demand from construction, wind energy, and electronics sectors. - Predictive maintenance and reliability-as-a-service are redefining operational models. Owens Corning has transitioned toward a reliability-as-a-service framework powered by AI, achieving measurable improvements in equipment reliability and reductions in unplanned downtime - a critical advance in continuous production environments reliant on high-capital assets including furnaces, bushings, and fiberizing equipment. - Generative AI and digital twins are unlocking process-level optimization. Saint-Gobain has applied generative AI to optimize production parameters and advance sustainable manufacturing across glass fiber and insulation lines. Digital twin technology - replicating furnaces, fiberizing units, and curing systems using real-time data inputs - is enabling manufacturers to simulate, test, and refine production processes without disrupting live operations. - Emerging technologies are converging across the value chain. Advanced computer vision, IIoT-integrated sensor analytics, AI-enabled furnace condition monitoring, and AI-driven supply chain forecasting tools are being deployed in parallel, creating increasingly autonomous and adaptive manufacturing environments. - Key players driving transformation include Owens Corning, Saint-Gobain, Johns Manville, Knauf Insulation, China Jushi Co., Ltd., Taishan Fiberglass Inc., Nippon Electric Glass, Corning Incorporated, SABIC, Glass Futures, NVIDIA, Applied Materials, Rescale, Lumotive, Blaize, and Machina Labs. Strategic Implications The structural case for AI adoption in glass fiber manufacturing is compelling and multi-layered. Glass fiber production is inherently sensitive to variations in temperature, raw material composition, and equipment performance - conditions that make AI-driven process control not merely advantageous but operationally necessary. Energy consumption in furnace operations is both a cost imperative and a regulatory liability, with mounting carbon reduction commitments accelerating demand for AI-enabled fuel optimization. The convergence of Industry 4.0 infrastructure, government-backed smart manufacturing initiatives - particularly across Asia-Pacific - and growing end-market demand from wind energy, construction, transportation, and industrial composites is compressing the timeline for widespread AI integration. Recent funding activity reinforces this trajectory. Rescale secured $115 million from Applied Materials and NVIDIA to expand its AI-enabled engineering simulation platform. Lumotive closed a $45 million Series B to advance programmable optical semiconductors for AI data centers. Machina Labs raised $32 million to scale AI-driven manufacturing for advanced composite components. Nippon Electric Glass pursued strategic R&D in large glass substrates targeting AI chip applications - a signal that glass material innovation and semiconductor demand are increasingly intertwined. Investment Considerations For investors, the glass fiber sector's AI transformation presents exposure to a high-volume industrial market undergoing a structural productivity shift, with upside driven by cost reduction, yield improvement, and new product development aligned with AI infrastructure build-out. The Corning-Meta agreement alone illustrates how glass fiber suppliers are becoming embedded in AI supply chains well beyond traditional end markets. Near-term risks include uneven digital infrastructure across emerging regions - particularly South America, the Middle East, and Africa - as well as integration complexity and the challenge of extracting actionable insight from large-scale sensor data environments. Companies with established digital infrastructure, Industry 4.0 frameworks, and proven AI deployment - including Owens Corning, Saint-Gobain, and Corning Incorporated - appear best positioned to capture near-term operational advantages and long-term competitive differentiation. About the Report AI Impact on Glass Fiber Market - BCC Pulse Report (AIT200A) provides a qualitative analysis of AI adoption across the glass fiber manufacturing value chain, examining key investment activity, emerging technologies, strategic partnerships, leading market participants, and adoption trends by region and application segment. About BCC Research BCC Research provides objective, unbiased measurement and assessment of market opportunities with detailed market research reports. Its experienced industry analysts assess growth trends, identify and evaluate new and changing market opportunities, and provide critical information and innovative decision support tools to help inform the strategic decision-making process. For media inquiries, email [email protected] or visit its media page for access to its market research library. Any data and analysis extracted from this press release must be accompanied by a statement identifying BCC Research LLC as the source and publisher. BCC Research LLC 50 Milk St., Ste. 16, Boston, MA 02109 [email protected] | +1 781-489-7301 www.bccresearch.com Legal Disclaimer: EIN Presswire provides this news content "as is" without warranty of any kind. Military Industry Today do not accept any responsibility or liability for the accuracy, content, images, videos, licenses, completeness, legality, or reliability of the information contained in this article. 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Manz forecasts growth alongside industry. Wed, aug 19, 2026 page9. * Manz forecasts growth alongside industry MANY MILLIMETERS: Manz' offerings in panel-level packaging continue to grow in demand in Taiwan's specialized industrial ecosystem, the company president said * By Lisa Wang / Staff Reporter * * Add TT as Preferred Source Manz Taiwan Ltd (亞智科技), which specializes in panel-level packaging equipment manufacturing, yesterday said the semiconductor ecosystem has developed rapidly in Taiwan, boosting its business outlook. The company supplies electrochemical deposition (ECD) equipment used in panel-level packaging, including chip-on-panel-on-substrate (CoPoS) and fan-out panel-level packaging (FOPLP) with square panel sizes ranging from 310x310mm and 510x510mm to 700x700mm. That places Manz as the third company in the world - after Applied Materials Inc and Lam Research Corp - capable of supplying such equipment used in panel-level packaging production. Manz Taiwan Ltd president Robert Lin speaks at a news conference in Taipei yesterday. Photo: CNA About half of the 50 ECD machines it has sold so far are for 700x700mm in panel size, but the 310x310mm equipment has been gaining popularity, the company said. "As AI [artificial intelligence] chips become larger in terms of reticle size, production and cost efficiency become increasingly vital, pushing the shift to panel-level packaging," Manz president Robert Lin (林峻生) said at a news conference in Taipei. CoPoS is considered a successor to chip-on-wafer-on-substrate technology, which is used in packaging for Nvidia Corp's AI chips produced by Taiwan Semiconductor Manufacturing Co (台積電), as a larger square panel offers better cost efficiency versus a 12-inch circular wafer. A 310x310mm rectangular panel can boost production by 50 percent compared with a 12-inch circular one in advanced packaging, Lin said. The CoPoS technology is mainly used to produce AI chips, while FOPLP is for the production of power management chips, radio frequency chips, microcontrollers or chips used in low orbit satellites, Manz said. As localization is a growing trend for Taiwan's advanced packaging industry, half of the company's customers are from Taiwan, Lin said. The company also exported equipment to the US, Japan, China and Malaysia, he said. Manz, which previously focused on plastic circuit board and flat panel equipment manufacturing, entered the semiconductor industry 12 years ago by collaborating with chip packager and tester Siliconware Precision Industries Co (矽品精密). The company aims to debut on the Taipei Exchange's Emerging Stock Board in June next year and list its shares on the Taiwan Stock Exchange in 2028. Employees hold a 30 percent stake in the company after it signed an agreement with German parent company Manz AG and became an independent entity through management buyout last year. * Most Popular * 1 McDonald's halts shrimp burger sales over banned antibiotic * 2 China wants to block drone bill: source * 3 'Economist' warns of democracy dangers in Taiwan * 4 German writer tells of Chinese spy in Taiwan * 5 Lai announces NT$10,000 cash handout
Bank of America has cut Applied Materials' price target to $650 from $720 while maintaining a Buy rating. The adjustment follows the semiconductor equipment maker's record fiscal third quarter, which saw revenue rise 25% year-over-year to $9.12 billion and non-GAAP EPS jump 41% to $3.50. BofA reduced its valuation multiple to 27 times estimated 2028 earnings from 36 times previously, citing slower sequential growth relative to competitor Lam Research and flat margin guidance. Applied's quarterly guidance implies roughly 13% sequential growth versus about 20% for Lam. Despite the lower target, BofA raised its EPS estimates for 2026, 2027, and 2028 by 8%, 15%, and 22%, respectively. The bank highlighted strong AI-driven demand in DRAM and advanced packaging as key growth drivers.
Applied Materials reported record third-quarter revenue of $9.12 billion, up 25% year over year, exceeding analyst expectations of $8.995 billion. Non-GAAP diluted earnings reached $3.50 per share, beating the $3.40 consensus. Despite the strong results, shares fell in premarket trading. Semiconductor Systems revenue rose to $7.04 billion from $5.56 billion a year earlier. Non-GAAP gross margin hit 50.4%, marking the 13th consecutive quarter of year-over-year expansion. Geographically, China's revenue share dropped to 28% from 35%, whilst US revenue doubled to 15% from 9%. The company forecasts fourth-quarter revenue of $10.25 billion, plus or minus $500 million, with non-GAAP earnings per share of $4.02, plus or minus $0.20.