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Siemens, TSMC Expand AI-driven EDA and Advanced-node Design Enablement. Article by: Siemens Digital Industries Software. Siemens and TSMC expand AI-enabled EDA workflows, packaging support and certification across leading process technologies. Siemens Digital Industries Software and Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) are expanding their collaboration on AI-enabled semiconductor design automation, advanced packaging and process-node design enablement through the TSMC Open Innovation Platform (OIP) ecosystem. The companies have enabled an AI-powered agent for automated design rule check (DRC) fixing across digital and custom IC design flows. The workflow combines Siemens' Calibre software with Aprisa and Solido software to identify, analyse and resolve design-rule violations. The DRC workflow builds on Calibre Check Assist, which provides contextual guidance and design-rule information during debugging. Siemens and TSMC are also working on agentic custom IC design capabilities using Solido Fuse, as well as agentic place-and-route and digital implementation workflows based on Aprisa. "Our continued collaboration with TSMC exemplifies Siemens' commitment to delivering AI-driven automation and advanced semiconductor design capabilities that help customers innovate at the industry's most advanced process nodes," said Ankur Gupta, executive vice president, EDA IC Software, Siemens Digital Industries Software, in a statement. "By combining Siemens' EDA portfolio with TSMC's leading process and packaging technologies, we are helping customers achieve new levels of productivity, speed and design confidence." "AI presents a significant opportunity to drive productivity and efficiency across increasingly complex semiconductor design workflows," said Aveek Sarkar, director of the ecosystem and alliance management division at TSMC. "Our collaboration with OIP partners like Siemens focuses on delivering intelligent, trusted automation that empowers engineers to navigate rising design complexity while achieving stringent performance and energy-efficiency targets. By integrating AI into critical stages of the design process, we enable mutual customers to leverage TSMC's industry-leading processes and advanced packaging technologies to accelerate the expansion of AI innovation." The collaboration also covers Siemens' Fuse EDA AI System and Fuse EDA AI Agent, which are intended to support longer-running, self-verifying EDA workflows across multiple design tools. Siemens said the AI agent incorporates NVIDIA AI technologies for improved token efficiency and execution of extended engineering workloads. Siemens continues to support TSMC 3DFabric technologies, including TSMC-SoIC wafer-level 3D IC stacking. Calibre 3DStack Advanced now supports multi-machine processing for inter-chiplet antenna verification, while certification work is underway for CoWoS-L with local silicon interconnect. The companies are also working on 3Dblox support and chip-package co-design flows. Aprisa is being enabled for pre-simulation-driven die-to-die auto-routing, with routing configurations developed to meet signal-integrity requirements. Siemens EDA tools are being used in joint development of TSMC-COUPE silicon photonics flows. These include Innovator3D IC Integrator, Calibre 3DStack, Solido Simulation Suite, L-Edit and Calibre Interactive for design, implementation and verification. Solido Simulation Suite supports PAM4 measurements for optical transceiver interfaces associated with TSMC-COUPE. Validation of Calibre 3DThermal for the same technology is ongoing. Calibre 3DThermal has also been certified for static and transient thermal analysis of TSMC A16 and enabled for the system-on-wafer thermal reference flow. Work is continuing on the TSMC-COUPE reference flow. The companies have expanded certification across TSMC's advanced process technologies. Siemens' Calibre nmDRC, Calibre nmLVS, Calibre xACT and Calibre PERC tools are certified for TSMC A14. Solido Simulation Suite has been certified for SPICE accuracy on TSMC N3C, A16 and A14, supporting analog, RF and memory verification. Siemens' custom-design technologies also address IC aging, real-time self-heating and safe-operating-area checks, alongside variation-aware verification and automated cell optimization through Solido Design Environment. mPower is certified for transistor-level IR/EM analysis on TSMC N2P digital and analog designs and N3C analog designs. Siemens and TSMC are continuing work on N2 and N3 electromigration and IR-drop custom-design reference flows. Certification of Aprisa and mPower analog software for A14 is also underway. The collaboration extends to training through Siemens Xcelerator Academy, which now provides EDA learning resources to TSMC Design Center Alliance partners as well as mutual customers. A recently released tutorial covers an end-to-end digital implementation flow based on TSMC 5nm process technology.

WH Council of Economic Advisers Chair Christopher Phelan, presidential adviser Peter Navarro, FERC Chair Laura Swett, sens. Rounds and Gallego, Southern Company CEO Chris Womack, reps. Adrian Smith, beth Van Duyne, april Delaney, Bill Foster, and janelle Bynum, exim's John Jovanovic and more to headline American Growth Summit tomorrow, Tuesday, September 29 in Washington, D.C. Sep 28, 2026, 17:45 ET WASHINGTON, Sept. 28, 2026 /PRNewswire/ - A powerhouse lineup of leaders from the administration, US Congress, and American business and civil society will speak at a day-long convening on the evolving topography of America's economic interests hosted by Widehall in partnership with Citi, Coinbase, NVIDIA, and Siemens as well as Statt and Tychos. For more info on timing and other speakers see here. Register to attend here. What: American Growth Summit When: Tuesday, September 29, 2026 Where: The Willard InterContinental Grand Ballroom Address: 1401 Pennsylvania Ave, NW, Washington, DC 20004 Program Timing: 8:15 am - 5:00 pm; followed by a reception until 7:00 pm The second annual American Growth Summit will convene leaders from government, business, finance, and technology to explore the policies and innovations shaping America's economic future. FEATURED SPEAKERS: * Christopher Phelan, Chairman, White House Council of Economic Advisers * Peter Navarro, White House Senior Counselor for Trade and Manufacturing * Laura Swett, Chairman, Federal Energy Regulatory Commission * Jarrod Agen, Executive Director, White House National Energy Dominance Council * Nick Andersen, Acting Director, Cybersecurity and Infrastructure Security Agency (CISA) * Evan Wildstein, Vice Chairman, Office of Strategic Capital, U.S. Department of War * John Jovanovic, President and Chairman, Export-Import Bank of the United States * Sen. Mike Rounds (R-SD), Chairman, Senate Armed Services Subcommittee on Cybersecurity * Sen. Ruben Gallego (D-AZ), Member, Senate Banking Subcommittee on Housing, Transportation, and Community Development * Rep. Adrian Smith (R-NE), Chairman, House Ways and Means Subcommittee on Trade * Rep. Beth Van Duyne (R-TX), Chair, House Small Business Subcommittee on Economic Growth, Tax, and Capital Access * Rep. April McClain Delaney (D-MD), Member, House Committee on Science, Space, and Technology * Rep. Bill Foster (D-IL), Member, House Financial Services Subcommittee on Digital Assets, Financial Technology, and Artificial Intelligence * Rep. Janelle Bynum (D-OR), Member, House Financial Services Committee * Bill Guidera, Deputy Under Secretary for Innovation and Engagement, International Trade Administration, U.S. Department of Commerce * Carlos Gutierrez, Former U.S. Secretary of Commerce; Author, "Sheer Will: Learning to Lead When There Is No Path" * Bruce Andrews, Chief External Affairs Officer, NVIDIA; Former Deputy Secretary of Commerce * Steve Case, Chairman & CEO, Revolution; Co-Founder, AOL * Chris Womack, Chairman, President & CEO, Southern Company * Shawn Whitman, Principal Deputy Under Secretary for Science, U.S. Department of Energy * Matt Calkins, CEO, Co-Founder and Chairman of the Board, Appian * Edward Skyler, Head of Enterprise Services & Public Affairs, Citi * Michael R. Strain, Director of Economic Policy Studies, American Enterprise Institute * Kara Calvert, Vice President, US Policy, Coinbase * Marian Salzman, SVP Corporate Development & Sr. Advisor to US CEO, Philip Morris International US. * Brie Sachse, Chief External Affairs Officer, Siemens USA * Alissa Kratsios, Head of Global Policy, Ramp * Kevin McAleenan, Chief Executive Officer, BigBear.ai * Kristi Rogers, Co-Founder & President, PRISM * Steve Glickman, Co-Founder & CEO, Statt * Dr. Noel Goddard, CEO, Qunnect * Richard Vague, Economic Commentator; Former Secretary of Banking and Securities, State of Pennsylvania; Author, "The Banker Who Made America" * Carolyn Lee, President and Executive Director, Manufacturing Institute * Seth Levey, Head of US Corporate Affairs, Glencore SOURCE Widehall, LLC

Cooperation between "Abu Dhabi Chamber" and "Siemens" to accelerate industrial digital transformation * Summary * A+ Abu Dhabi, September 28 / WAM / The Abu Dhabi Chamber of Commerce and Industry signed a cooperation agreement with Siemens, aiming to enhance prospects for joint cooperation in the fields of industrial digital transformation, advanced technologies, innovation, sustainability, and capacity development, in a way that supports the competitiveness of private sector companies in the Emirate of Abu Dhabi and raises their digital readiness. The agreement was signed by His Excellency Ali Mohamed Al Marzooqi, Director General of the Abu Dhabi Chamber of Commerce and Industry, and Helmut von Struve, CEO of Siemens in the Middle East, on the sidelines of the UAE Investment Forum in Munich, organized by the Ministry of Foreign Trade, in which the Abu Dhabi Chamber of Commerce and Industry participated, as part of its efforts to expand its network of international partnerships, connect the emirate's business community with global companies, expertise, and technologies, and explore new opportunities for economic and industrial cooperation. The agreement establishes an organizational framework for cooperation between the Abu Dhabi Chamber of Commerce and Industry and Siemens, focusing on transforming knowledge, expertise, and advanced technology into practical tools that help companies develop their digital operations, increase their productivity and operational efficiency, enhance their flexibility, and prepare for changing requirements in markets and global value chains. The agreement seeks to build programs and initiatives that support the digital transformation of the industrial sector, including the adoption of advanced digital technologies, automation, smart manufacturing solutions, and Fourth Industrial Revolution applications, as well as raising awareness of technological solutions capable of enhancing productivity, operational efficiency, flexibility, and competitiveness. His Excellency Ali Mohamed Al Marzooqi said that the competitiveness of industrial economies today is built on their ability to combine technology, knowledge, skills, and sustainability within a single system capable of producing sustainable economic value, while the agreement embodies the Abu Dhabi Chamber's approach to building quality partnerships that connect the business community with leading global expertise and support the ability of the emirate's companies and their efforts to keep pace with rapid transformations in industry, trade, and markets. He added that digital transformation has today become an integrated path to raise productivity, improve resource efficiency, enhance business flexibility, and open new opportunities for growth and expansion into markets, noting that through cooperation with Siemens, the Chamber seeks to transform expertise in global industrial digitalization into practical capabilities from which the private sector in Abu Dhabi can benefit, especially industrial establishments and companies seeking to modernize their operations and enhance their competitiveness. For his part, Helmut von Struve expressed his happiness at renewing cooperation with the Abu Dhabi Chamber of Commerce and Industry and expanding it to include new areas related to the future of industry and business, noting that digitalization and sustainability are two integrated elements in building a more productive, efficient, and flexible industrial sector, and that this agreement provides a framework for exchanging expertise and exploring solutions and initiatives that help Abu Dhabi companies benefit from the potential offered by advanced technologies. He added that the UAE possesses an ambitious vision to develop an industrial ecosystem based on innovation, technology, and sustainability, expressing Siemens Global's aspiration to employ its expertise in digital transformation, smart manufacturing, and energy and resource efficiency to support this vision, as cooperation in the field of the digital product passport provides an opportunity to enhance companies' understanding of new requirements related to transparency, traceability, and sustainability, thereby supporting their readiness to deal with global value chains and markets. The agreement attaches particular importance to exploring cooperation opportunities related to the "digital product passport" and its associated digital traceability and transparency solutions, through awareness-raising, knowledge exchange, capacity development, and studying the possibility of implementing pilot trials, as this track aims to help Abu Dhabi companies understand evolving requirements related to product traceability, sustainability, transparency, and market access, and prepare for them in accordance with applicable laws and regulations. Areas of cooperation extend to research, development, and innovation; the exchange of technical knowledge; and engagement with innovation and industry ecosystems, alongside exploring initiatives related to energy and resource efficiency, decarbonization, and technology-supported solutions that contribute to achieving sustainable industrial and economic development. The agreement also includes exploring initiatives that support the development and modernization of the technology and manufacturing sectors and other priority sectors in Abu Dhabi, along with cooperation in organizing conferences, forums, roundtable meetings, workshops, and exhibitions, which enhances direct communication between Siemens representatives and members of the Abu Dhabi Chamber, industrial companies, and relevant entities. The agreement embodies the Abu Dhabi Chamber of Commerce and Industry's commitment to building international partnerships that deliver tangible value to the business community, contribute to accelerating the adoption of advanced technology, develop human resources, and enhance the efficiency and sustainability of the industrial sector, thereby supporting Abu Dhabi's competitive position as a global hub for the economy, business, investment, and innovation. D.N. / A.M. / R.M. * Economy * United Arab Emirates (ARE) * Germany (DEU) * Abu Dhabi Chamber of Commerce and Industry * Ministry of Foreign Trade * Siemens The news is also available in the following languages: