Internship Project for Automotive RF Substrates
NXP Semiconductors
Internship Project for Automotive RF Substrates
NXP Semiconductors
Automotive semiconductors and secure embedded solutions
•Title:
•Electrical and material characterization of DS7409KNF new low loss core material for radar applications
•
•Goal:
•Link material RF properties measured in RF lab to substrates (RF) structures.
•
•Scope:
•Work on DC electrical test vehicles setup development by Davey. Check substrate MFG for MSAP en tenting in 6L Doosan stack
•Work with Fabry Perot setup in RF lab to characterize Doosan and today MGC material
•Translate material RF characterization in RF lab to 6L substrate stack performance
•If time left, run reliability experiments using our 6L ETV structures. (content to align with Romuald)
#LI-3623Automotive semiconductors and secure embedded solutions
NXP Semiconductors designs and sells semiconductor chips for vehicles and other devices. Its products include automotive-grade microcontrollers and other ICs used in engines, infotainment, safety systems, and networked car architectures. These chips process data, run software, and enable features such as advanced driver assistance and vehicle connectivity, often with strong security and real-time performance. Unlike some peers, NXP became an independent company after Philips spun off its semiconductor unit in 2006 and later merged with Freescale in 2015, building a focused strength in automotive semiconductors and microcontrollers. This gives it a clear niche in the market and the goal of growing as a standalone leader in smarter, connected vehicles and related technologies.
Explore more opportunities at NXP Semiconductors