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Kandou AI

Provides chip-to-chip AI connectivity solutions

Technical Advisor/Principal Architect - Office of the CTO

Telecommunications EngineeringConfirmed live in the last 24 hours
Full-timeSaint-Sulpice, SwitzerlandNo salary listedHybrid

About the Job

Requirements

  • An advanced degree in Electrical Engineering, Computer Engineering, Applied Mathematics, Physics, or a related field is required.
  • A strong background in digital communications and communication system fundamentals is required.
  • A deep understanding of information theory, coding, modulation, and signal processing is required.
  • Experience building mathematical models, simulations, or prototypes is required.
  • Proficiency in Python, MATLAB, C++, or similar environments is required.
  • Ability to work across abstraction levels, from theory through architecture to implementation, is required.
  • Strong analytical and problem-solving skills and comfort exploring unfamiliar domains are required.

Responsibilities

  • Partner with the CTO to develop next-generation communication and interconnect architectures.
  • Explore novel signaling, coding, equalization, and system-level techniques.
  • Build models, simulations, and prototypes to validate architectural concepts.
  • Evaluate performance, power, latency, area, and manufacturability tradeoffs.
  • Translate research into silicon-ready architectures and intellectual property.
  • Identify emerging technologies and opportunities for competitive differentiation.
  • Provide technical leadership and guidance across research, architecture, and product teams.
  • Partner closely with the CTO to explore, evaluate, and prototype next-generation communication system architectures.
  • Help translate theoretical concepts into implementable designs that can scale into real products.
  • Be hands-on when needed, conducting analysis, modeling, coding, simulation, debugging, or lab work to move critical projects forward.

Desired Qualifications

  • Experience with SerDes architecture, equalization, or wireline communications.
  • Experience with coding theory, forward error correction (FEC), or advanced modulation schemes.
  • Experience with system-level modeling such as SystemC or equivalent.
  • Experience applying machine learning to communications.
  • Experience taking concepts from theory to silicon.

About the Company

Kandou AI

Provides chip-to-chip AI connectivity solutions

Kandou AI designs and sells semiconductor connectivity hardware for AI workloads. It provides a memory fabric and CXL controllers that link processors to memory, enabling scalable, energy-efficient AI inference and training clusters built from affordable hardware. Using Copper MIMO interconnect, it reduces energy per bit and supports features like offloading AI training collectives, switchless memory for in-memory databases, and field-repairable co-packaged optics for better cooling. By targeting the data-movement bottleneck between processors and memory and offering chiplet-based fabrics and IP licensing, Kandou AI aims to make scalable AI infrastructure more accessible to hyperscalers, data centers, and system integrators.

Company size
201-500
Company stage
Late Stage VC
Total funding
$504.7M
Headquarters
Lausanne, Switzerland
Founded
2011

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