Advanced R&D Internship
Kandou AI
Advanced R&D Internship
Kandou AI
Provides chip-to-chip AI connectivity solutions
Kandou is redefining AI infrastructure through innovative interconnect technologies that significantly reduce power consumption while maintaining high bandwidth and ultra-low latency. Our mission is to make AI systems more scalable, efficient, and accessible.
Today we have one internship position available for max 6 months, in our Advanced R&D, for MSc students in the following area :
Digital Design Engineer Internship
Please note: This internship is intended for students who are currently enrolled at a university or higher education institution in Switzerland and already based in Switzerland.
Digital circuit design: the students will help with the design of control circuitry for very high speed serial links. Knowledge of standard tools from Cadence or Synopsys is a must.
The intern will actively contribute to meaningful projects and work closely with a mentor and with senior leadership on design of high-speed digital VLSI systems.
Duties and Responsibilities
Support the Advanced R&D Team of the company with design of high-performance digital VLSI systems and architectures,
Organize and maintain research findings in the company’s document management system,
Lend support to other areas of the business in need of digital design.
Requirements
Electrical Engineering or Computer Engineering major.
Minimum Grade Point Average of 5.0,
Familiar with Synopsys and/or Cadence design flow,
Strong verbal and written communication skills,
Excellent analytical and verbal problem-solving skills,
Ability to work well in teams, and:
strong ethic and attention to detail.
Benefits
Gain hands-on experience in an industrial research lab,
Shadowing knowledgeable professionals,
Opportunity to see the inner workings of a startup,
Compensation available.
Access to very advanced process nodes
If you recognize yourself in the description above, and love to be part of a growing Company, are a good team player with an upbeat approach to life, we would love to hear from you. Together We Kandou It!
Kandou AI designs and sells semiconductor connectivity hardware for AI workloads. It provides a memory fabric and CXL controllers that link processors to memory, enabling scalable, energy-efficient AI inference and training clusters built from affordable hardware. Using Copper MIMO interconnect, it reduces energy per bit and supports features like offloading AI training collectives, switchless memory for in-memory databases, and field-repairable co-packaged optics for better cooling. By targeting the data-movement bottleneck between processors and memory and offering chiplet-based fabrics and IP licensing, Kandou AI aims to make scalable AI infrastructure more accessible to hyperscalers, data centers, and system integrators.
Explore more opportunities at Kandou AI