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Apple

Designs phones, computers and their operating systems

Surface-Mount Technology – Printed Circuit Board Assembly - Design for Manufacturability Engineer

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeHanoi, VietnamNo salary listed

About the Job

Requirements

  • A bachelor's or master's degree in Electrical Engineering, Mechanical Engineering, Manufacturing Engineering, Materials Science, or a closely related technical field, paired with relevant industry experience.
  • Experience in Surface-Mount Technology or a related field such as packaging assembly.
  • General understanding of printed circuit board fabrication, component packaging including general integrated circuits, system-in-package, and discrete passive components, substrate materials, and surface finishes such as OSP and ENIG, including their impacts on solderability and reliability.
  • Familiarity with process failure analysis, including its equipment, tools, and methodologies.
  • Excellent communication and presentation skills and a collaborative approach suited to working across multiple functional groups.
  • Leadership skills and the ability to act as a project leader on complex initiatives.
  • A strong quality mindset and experience navigating factory quality control systems, including IQC, IPQC, SQE, and QA/QE.
  • Proficiency with software and computer-aided design tools for running DFM analyses, such as Siemens/Mentor Graphics Valor NPI.
  • Ability to perform well under pressure and tight deadlines.
  • Willingness to travel domestically and internationally.

Responsibilities

  • Collaborate with the Cupertino Engineering team to validate product designs for manufacturability and recommend design changes that improve quality, yield, reliability, and cost-effectiveness.
  • Develop manufacturing processes and stations, including SMA and HotBar.
  • Provide guidance and resources to contract manufacturer engineers.
  • Support product builds through all developmental stages, including Proto, EVT, DVT, and PVT, and through mass-production ramps.
  • Plan, develop, and implement procedures for PCBA, SIP, and module manufacturing processes and quality control at contract manufacturer sites.
  • Partner with cross-functional teams to define requirements and establish performance metrics for new processes.
  • Lead cross-functional efforts to transition projects from engineering to mass production and to transfer projects between sites.
  • Act as the primary project leader on complex manufacturing and engineering projects.

Desired Qualifications

  • A master's degree or above in Electrical Engineering, Mechanical Engineering, Manufacturing Engineering, Materials Science, or another relevant field.
  • Additional technical expertise or a PhD in automation, data science, or mechanical design.

About the Company

Apple

Designs phones, computers and their operating systems

Apple designs and sells consumer electronics, from iPhone smartphones and Mac computers to tablets and wearable devices. Its operating systems manage apps and built-in functions for communication and work, while iCloud stores files and synchronizes data across devices. Customers buy additional digital services through subscriptions such as Apple Music and Apple TV, and developers distribute software through the App Store. Apple earns money from hardware sales, subscriptions and digital transactions, selling directly to customers and through retailers and mobile carriers around the world. It was founded in 1976 and has its headquarters in Cupertino, California.

Company size
10,001+
Company stage
IPO
Headquarters
Cupertino, CA
Founded
1976

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