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VLN stock jumps 8% premarket: onsemi deal targets high-volume auto cameras. Published: Sep 22 2026, 06:05 PM IST * FB * TW * Linkdin * Whatsapp * GNFollow Us Valens is extending its MIPI A-PHY technology toward mainstream automotive cameras through an onsemi collaboration aimed at lowering component count and simplifying vehicle camera designs. * Valens and onsemi plan a cost-optimized integrated sensor for high-volume 3MP automotive cameras. * The 3MP offering targets a broad market, with Valens saying most automotive image sensors sit in the 1MP-3MP range. * The collaboration supports Valens' broader effort to drive commercial adoption of MIPI A-PHY. Valens Semiconductor (VLN) shares jumped about 8% in premarket trading Monday after the company announced a collaboration with onsemi (ON) to develop a cost-optimized integrated sensor based on the MIPI A-PHY standard for high-volume 3-megapixel automotive camera applications. Under the agreement, Valens will work with onsemi on an A-PHY-based solution, a technology used to carry high-speed data from vehicle cameras and sensors, that can be built directly into onsemi's image sensors. This could reduce the number of separate components needed and make it easier for automakers and their major component suppliers, known as Tier-1 suppliers, to adopt the technology. At the time of this writing, VLN stock was up around 8% in premarket trade and ON stock was trading marginally in the green. Valens targets mainstream auto cameras. The collaboration aims to simplify automotive camera designs. Onsemi said integrating the technology could create a more streamlined camera architecture by reducing component count while supporting an industry-standard connectivity interface. That matters because Valens is not targeting only high-end camera systems with the new offering. The company said a majority of automotive image sensors currently target the 1MP-3MP range. A 3MP solution therefore addresses both an established high-volume market and automakers upgrading toward higher-resolution cameras. Valens CEO Yoram Salinger called the agreement a "major milestone" for the company and the MIPI A-PHY ecosystem, saying the cost-optimized product could extend A-PHY into a wider range of applications. He also highlighted the addition of onsemi, itself an A-PHY silicon supplier, as a way of giving automakers greater supplier choice around the industry standard. Valens' automotive business heads toward 2027 ramp. The latest collaboration adds to Valens' broader effort to build commercial adoption around MIPI A-PHY, the automotive industry's first standardized solution for high-speed sensor connectivity. Valens says it was the first company to bring compliant chipsets to market and has already secured design wins with multiple automakers. In its fiscal second-quarter (Q2) results, Valens said all four of its automotive design-win programs were progressing toward production, with revenue expected to begin ramping in 2027. Automotive revenue reached $5.0 million in the quarter, up from $4.3 million a year earlier, though below $5.9 million in the prior quarter. Overall Q2 revenue rose to $18.1 million from $17.1 million a year earlier, exceeding the company's guidance. Valens subsequently raised its full-year 2026 revenue forecast to between $78 million and $81 million. Retail sentiment around VLN stock. Retail sentiment around Valens turned 'bullish' on Stocktwits. So far this year, VLN stock has risen more than 13%. In comparison, Cathie Wood's Ark Israel Innovative Technology ETF (IZRL), which holds the stock, has fallen more than 3% over the same period. For updates and corrections, email newsroom[at]stocktwits[dot]com.< Stay updated with all the latest Business News, including market trends, Share Market News, stock updates, taxation, IPOs, banking, finance, real estate, savings, and investments. Track daily Gold Price changes, updates on DA Hike, and the latest developments on the 8th Pay Commission. Get in-depth analysis, expert opinions, and real-time updates to make informed financial decisions. Download the Asianet News Official App from the Android Play Store and iPhone App Store to stay ahead in business. 0 Comments / 0 New

Valens Semiconductor to Collaborate with onsemi on a Cost-Optimized Integrated Sensor Based on the MIPI A-PHY Standard. Sep 22, 2026, 06:30 ET Collaboration agreement to support the development of MIPI A-PHY solutions targeting high-volume 3MP automotive camera applications HOD HASHARON, Israel, Sept. 22, 2026 /PRNewswire/ - Valens Semiconductor (NYSE: VLN), a leading provider of high-performance connectivity chipsets, today announced a collaboration with onsemi on a cost-optimized integrated sensor for high-volume 3-megapixel automotive camera applications. Through this collaboration the parties intend to give OEMs and Tier 1s a faster path to A-PHY. Under the agreement, Valens will work with onsemi on the cost-optimized A-PHY offering that can be integrated into onsemi's image sensors. The collaboration strengthens the A-PHY ecosystem by bringing together complementary expertise in connectivity and automotive imaging technologies. "This is a major milestone for Valens, MIPI A-PHY and for the automotive ecosystem as a whole," said Yoram Salinger, CEO at Valens Semiconductor. "The integrated, cost-optimized 3MP offering complements Valens' existing solutions, bringing A-PHY to a much broader range of use cases. Just as importantly, by collaborating with, onsemi, another major supplier of A-PHY silicon, we are strengthening the ecosystem and giving automakers the supplier choice they expect from an industry standard." "The level of interest we're seeing from OEM customers and partners makes clear that MIPI A-PHY represents a significant business opportunity," said Ahmed Salem, Vice President & General Manager of the Intelligent Sensing Group at onsemi. "As automotive imaging systems continue to grow in scale and sophistication, customers are looking for solutions that simplify design without compromising performance. Through our collaboration with Valens, we're helping enable a more streamlined camera architecture that reduces component count, supports industry standards, and ultimately makes advanced vision systems easier to deploy." The majority of automotive image sensors target the 1-3MP range. As OEMs continue to migrate toward higher resolutions, a 3MP offering addresses both a large established market and a growing upgrade opportunity, making it a highly relevant entry point for bringing A-PHY into mainstream, high-volume vehicles. MIPI A-PHY is the first standard in the automotive industry for high-speed sensor connectivity. Valens is a leader in MIPI A-PHY, offering the first chipsets on the market to comply with the standard and the first to achieve design wins with multiple OEMs. About Valens Semiconductor Valens Semiconductor (NYSE:VLN) is a leader in high-performance connectivity, enabling customers to transform the digital experiences of people worldwide. Valens' chipsets are integrated into countless devices from leading customers, powering state-of-the-art audio-video installations, next-generation videoconferencing, and enabling the evolution of ADAS and autonomous driving. Pushing the boundaries of connectivity, Valens sets the standard everywhere it operates, and its technology forms the basis for the leading industry standards such as HDBaseT(R) and MIPI A-PHY. For more information, visit https://www.valens.com/. Forward-Looking Statements This press release includes "forward-looking statements" within the meaning of the "safe harbor" provisions of the United States Private Securities Litigation Reform Act of 1995. Forward-looking statements may be identified by the use of words such as "estimate," "plan," "project," "forecast," "intend," "will," "expect," "anticipate," "believe," "seek," "target" or other similar expressions that predict or indicate future events or trends or that are not statements of historical matters. These forward-looking statements are subject to a number of risks and uncertainties, including the cyclicality of the semiconductor industry; the effect of inflation and a rising interest rate environment on our customers and industry; the ability of our customers to absorb inventory; competition in the semiconductor industry, and the failure to introduce new technologies and products in a timely manner to compete successfully against competitors; if Valens fails to adjust its supply chain volume due to changing market conditions or fails to estimate its customers' demand; disruptions in relationships with any one of Valens' key customers or suppliers; any difficulty selling Valens' products if customers do not design its products into their product offerings; our ability to effectively manage, invest in, grow, and retain our sales force, research and development capabilities, marketing team and other key personnel; our ability to timely adjust product prices to customers following price increase by the supply chain; our ability to adjust our inventory level due to reduction in demand due to inventory buffers accrued by customers; our expectations regarding the outcome of any future litigation in which we are named as a party; our ability to adequately protect and defend our intellectual property and other proprietary rights; risks related to our use of AI technologies; our ability to successfully integrate or otherwise achieve anticipated benefits from acquired businesses; the market price and trading volume of the Valens ordinary shares may be volatile and could decline significantly; further deterioration of macroeconomic conditions due to ongoing global political and economic uncertainty; political, economic, governmental and tax consequences, as well as geopolitical tensions, associated with our incorporation and location in Israel; and those factors discussed in Valens' Form 20-F filed with the SEC on February 25, 2026 under the heading "Risk Factors," and other documents of Valens filed, or to be filed, with the SEC. Except as required by law, we undertake no obligations to make any revisions to the forward-looking statements contained in this press release or to update them to reflect events or circumstances occurring after the date of this press release, whether as a result of new information, future developments or otherwise. Press Contacts Yoni Dayan Head of Communications Valens Semiconductor Ltd. [email protected] Investor Contacts Michal Ben Ari Investor Relations Manager Valens Semiconductor Ltd. [email protected] SOURCE Valens Semiconductor

Onsemi ditches traditional PCB substrate for silicon wafer, unlocking up to 5x power density for AI chips and EVs. Onsemi's EPP (Embedded Power Platform) aims to utilize silicon wafers to enable more efficient and power-dense chips. As power demands grow, Onsemi is working on its EPP solution to make semiconductors more efficient & denser. Currently, power modules within a chip are placed within the PCB (Printed Circuit Board), but as more advanced packaging solutions are being developed, Wccf Tech Inc is seeing the embedding of power systems within the package substrate. Intel's EMIB is one example where the TSVs route power to the chip around the embedded package, and EMIB-T takes it one step further by routing power through the embedded die. EPP reimagines the package from passive housing into an active contributor to system performance. By using the silicon wafer itself as the package, EPP enables the seamless integration and interconnection of silicon, silicon carbide (SiC) and gallium nitride (GaN) technologies within a highly integrated wafer-level architecture. Multiple devices, including FETs, drivers and controllers, can be embedded together in a single package and co-optimized for electrical, thermal and mechanical performance. This enables complete power-system co-design, allowing electrical, thermal and mechanical characteristics to be evaluated and optimized together from day one. The result is higher power density, improved system performance, reduced development complexity and faster time-to-market. With EPP (Embedded Power Platform), OnSemi is taking a slightly different approach where the company is planning to utilize 12-inch silicon wafers as the package substrate. The tech doesn't rely on using a conventional PCB as the substrate. EPP replaces that sequential model with a common platform that can be co-designed, co-simulated and co-optimized. This approach is designed to help customers: Electric Vehicle Applications: Electric vehicle traction inverters are often constrained by efficiency losses, thermal limitations, development complexity and system size. EPP addresses these challenges with up to 4x higher power density and 15% lower power losses compared to conventional approaches, enabling smaller, lighter and more efficient inverter designs. Its scalable architecture supports a single inverter platform spanning low-end to high-end vehicle applications, allowing automakers to reuse a common design across multiple vehicle models and power classes. This approach can reduce R&D and manufacturing costs, accelerate qualification and development cycles, improve vehicle range or lower system costs, and help bring new vehicle programs to market faster. * Achieve 3 - 5x higher power density, depending on the application * Accelerate development cycles to as little as four months * Improve thermal performance and heat dissipation * Reduce electrical losses through lower parasitic inductance * Enable greater device control and higher switching frequencies * Identify design trade-offs earlier and reduce costly late-stage changes * Scale a common architecture across power levels, device types, applications semiconductor technologies AI Infrastructure Applications: As AI rack power increases, more space and cooling capacity must be dedicated to the systems that deliver, convert and protect that power. This can limit how much compute capacity can fit within a rack. In an early EPP-based solid-state circuit-breaker design, the solution was approximately 50% smaller and 20% cooler than existing designs. By reducing packaging overhead and using the full EPP footprint to conduct heat, EPP can support more compact power systems, improve thermal management and enable greater power density in AI infrastructure. The EPP will then place various power semis within the silicon wafer. These include silicon (Si), silicon carbide (SiC), and gallium nitride (GaN). Additionally, EPP can house various drivers and controllers within the wafer. OnSemi is claiming that the EPP methodology not only makes power systems within the chip smaller and more efficient, but also adds to power density. With EPP, a chip can feature up to 3x-5x power density gain. The shorter connections required to connect the chip to the base board result in a reduction in power losses that are caused by current flow and voltage fluctuations. Heat dissipation is another area where EPP leads over traditional methods due to its better thermal characteristics from the use of a silicon wafer. As for adoption, Onsemi's EPP is said to play a key role in chips designed for AI data centers and also EVs (Electric Vehicles). In that regard, Onsemi has unveiled Subaru as one of its early partners on the EPP project. Subaru will utilize EPP for its upcoming EVs and will receive EPP engineering samples and simulation models from OnSemi. In data centers, EPP will be utilized for solid-state circuit breakers, as they can reduce product size by up to 50% and lower temperatures by 20%. Additional partners for EPP are expected this year, and wider sampling to key customers is expected later this year. About the author: A Software Engineer by training and a PC enthusiast by passion, Hassan Mujtaba serves as Wccftech's Senior Editor for hardware section. With years of experience in the industry, he specializes in deep-dive technical analysis of next-generation CPU and GPU architectures, motherboards, and cooling solutions. His work involves not only breaking news on upcoming technologies but also extensive hands-on reviews and benchmarking. Follow Wccftech on Google to get more of its news coverage in your feeds.