Q

Qualcomm

Designs mobile chips and licenses wireless patents

Signal and Power Integrity Engineer – Senior to Staff Level - Packaging Engineering

RF & Microwave EngineeringConfirmed live in the last 24 hours
Full-timeHsinchu, North District, Hsinchu City, TaiwanNo salary listedIn-person

About the Job

Requirements

  • At least 3 years of experience in DDR/SerDes, package, PCB, or system design related to compute, automotive, and/or server products.
  • A strong background in electromagnetics, transmission line theory, and crosstalk analysis.
  • Experience with field solvers such as HFSS, Q3D, Sentinel-PSI, and Clarity.
  • Experience with simulation tools such as ADS and HSPICE.
  • Working knowledge of Cadence Allegro/APD/SIP or Mentor Xpedition.
  • A Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field and at least 4 years of System/Package Design/Technology Engineering or related work experience; or a Master's degree in one of these fields and at least 3 years of related experience; or a PhD in one of these fields and at least 2 years of related experience.

Responsibilities

  • Perform package and PCB extraction for time-domain and frequency-domain analysis.
  • Conduct system-level analysis for DDR, SerDes, and Power Delivery Network (PDN).
  • Develop design guidelines for package and PCB design.
  • Create technical documentation and presentations.
  • Collaborate with cross-functional teams to optimize signal and power integrity performance across the system.
  • Partner with substrate designers to ensure system-level constraints are met before package tape-out.
  • Collaborate with PHY owners to understand requirements for IPs such as LPDDR6, PCIe, and 224G interfaces.
  • Work with PCB designers to assess the impact of ball assignment on system-level performance.

Desired Qualifications

  • Experience utilizing AI tools to improve engineering efficiency.
  • Experience with MATLAB and/or programming languages.
  • Knowledge of design specifications such as LPDDRx, PCIe, and XLink.
  • A Master's degree or PhD in Electrical Engineering or a related field.

About the Company

Qualcomm

Designs mobile chips and licenses wireless patents

Qualcomm designs the Snapdragon processors and modems inside many Android phones, and it licenses its wireless patents to device makers around the world. It helped commercialize CDMA, the cellular technology behind 3G networks, and its patents cover core parts of the 4G and 5G standards that phones use to connect. The company does not run its own chip factories; contract foundries make its chips, which it sells to makers of phones, PCs, cars, and connected devices. Device makers also pay Qualcomm royalties for using its patented technology, which forms a second business alongside chip sales. Qualcomm was founded in 1985 and is based in San Diego, California.

Company size
10,001+
Company stage
IPO
Headquarters
San Diego, CA
Founded
1985

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