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Kandou AI

Provides chip-to-chip AI connectivity solutions

Semiconductor Engineering Intern

Hardware EngineeringConfirmed live in the last 24 hours
InternshipDortmund, GermanyNo salary listed

About the Job

Requirements

  • Currently enrolled in a Master's degree program in Electrical Engineering, Microelectronics, Telecommunications Engineering, Information Technology, Computer Engineering, or a related field, and have completed a Bachelor's degree.
  • Have basic knowledge in at least one of digital design and RTL, digital verification, physical design, or analog/mixed-signal design.
  • Use a structured, analytical, and detail-oriented working style and document work clearly.

Responsibilities

  • Support RTL design of digital circuits using SystemVerilog or VHDL.
  • Contribute to the development, analysis, and optimization of digital logic.
  • Support synthesis flows and evaluate synthesis results.
  • Develop and maintain verification environments using SystemVerilog and UVM.
  • Create and execute functional tests.
  • Support implementation of SystemVerilog Assertions.
  • Support floorplanning, place-and-route, and design implementation activities.
  • Contribute to Static Timing Analysis tasks.
  • Develop automation and data-analysis scripts.
  • Support development and analysis of analog and mixed-signal circuits.
  • Contribute to SPICE-based circuit simulations.
  • Support high-speed SerDes, PLL, or related connectivity design activities.

Desired Qualifications

  • For digital assignments, SystemVerilog, VHDL, UVM, SystemVerilog Assertions, or formal verification experience is a plus.
  • For physical design assignments, Static Timing Analysis, CDC analysis, floorplanning and place-and-route, Cadence Innovus, or Synopsys ICC2 experience is a plus.
  • For analog assignments, SPICE simulation, Cadence Virtuoso, high-speed SerDes, or PLL design experience is a plus.
  • Python, Tcl, or Perl scripting, version-control systems, or automated development flows are a plus.

About the Company

Kandou AI

Provides chip-to-chip AI connectivity solutions

Kandou AI designs and sells semiconductor connectivity hardware for AI workloads. It provides a memory fabric and CXL controllers that link processors to memory, enabling scalable, energy-efficient AI inference and training clusters built from affordable hardware. Using Copper MIMO interconnect, it reduces energy per bit and supports features like offloading AI training collectives, switchless memory for in-memory databases, and field-repairable co-packaged optics for better cooling. By targeting the data-movement bottleneck between processors and memory and offering chiplet-based fabrics and IP licensing, Kandou AI aims to make scalable AI infrastructure more accessible to hyperscalers, data centers, and system integrators.

Company size
201-500
Company stage
Late Stage VC
Total funding
$504.7M
Headquarters
Lausanne, Switzerland
Founded
2011

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