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Applied Materials

Builds equipment for chip and display factories

Advanced Packaging Integration Engineer

Process EngineeringConfirmed live in the last 24 hours
Full-timeSanta Clara, CA, USAIn-person

About the Job

Requirements

  • A Ph.D. or M.S. degree in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics, or a related STEM field.
  • In-depth knowledge and hands-on experience in advanced packaging technologies, including wafer-to-wafer or die-to-wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes.
  • Proficiency in statistical data analysis and process optimization and control techniques, such as Design of Experiments, SPC, and JMP.
  • Ability to collaborate effectively across multidisciplinary teams.
  • Ability to prepare clear, compelling executive-level or customer-facing presentations.
  • Ability to work independently and in team environments with minimal supervision.

Responsibilities

  • Lead process integration for high-performance interconnects and micro-LED panels.
  • Architect robust, scalable integration flows that meet manufacturability and reliability requirements while driving differentiated technology development.
  • Collaborate with fabs, assembly houses, suppliers, and cross-functional teams across Applied Materials and external partners.
  • Work closely with design, process, integration, and metrology teams to deliver production-ready solutions.
  • Define, develop, execute, and optimize advanced packaging process integration flows, including hybrid bonding and 2.5D/3D heterogeneous integration, to achieve product performance, yield, and reliability.
  • Own, manage, and drive complex technical projects, track progress, and resolve roadblocks to ensure on-time delivery with high quality.
  • Design experiments, systematically collect and analyze data, drive root-cause analysis, and implement corrective actions.
  • Collaborate with foundries, OSATs, and internal research teams to define and implement improved integration strategies and methodologies.
  • Stay current on field advancements and apply that knowledge to drive innovation.

Desired Qualifications

  • Experience with Micro-LED or CPO.
  • Coding capability.
  • Experience with MES systems.

About the Company

Applied Materials

Builds equipment for chip and display factories

Applied Materials designs and builds precision machines that chipmakers and display manufacturers use to form, shape and inspect thin layers of material. Its platforms handle steps such as depositing films and removing unwanted material, helping chipmakers create transistors and wiring at atomic scale. Customers include makers of logic chips and memory, as well as manufacturers of advanced displays. The company earns money from equipment sales, replacement parts and services, and factory software that schedules production and monitors manufacturing processes. Applied Materials was founded in 1967 and is headquartered in Santa Clara, California.

Company size
10,001+
Company stage
IPO
Headquarters
Santa Clara, CA
Founded
1967

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