T

Texas Instruments

Makes analog and embedded chips in its own plants

Software Engineer Intern - Compiler

InternshipPosted on 10/20/2026
No salary listed
Bachelor's
Sugar Land, TX, USA+1 moreMore locations: United States
In Person
Software EngineeringSystems Software Engineering
No H1B Sponsorship

About the job

Requirements
  • Currently pursuing a bachelor's degree in Computer Engineering, Computer Science, or a related field.
  • Have a minimum cumulative GPA of 3.0 on a 4.0 scale.
Responsibilities
  • Add or improve the functionality of Texas Instruments' LLVM/Clang-based compiler infrastructure for microcontrollers.
  • Add or improve the functionality of Texas Instruments' proprietary compiler infrastructure for digital signal processors.
  • Work with application and architecture teams to improve compiler performance.
  • Work with design and architecture teams on improving architectures.
Desired Qualifications
  • Have strong C and C++ programming skills.
  • Have experience with object-oriented design, debugging, performance analysis, testing, and assembly language programming.
  • Have knowledge of computer architectures.
  • Have knowledge of software engineering processes and the full software development lifecycle.
  • Have experience with scripting languages such as Python and Perl.
  • Be able to clearly explain highly technical and complex concepts.
  • Have completed compiler design courses.
  • Be familiar with LLVM/Clang or other compiler infrastructures.
  • Have demonstrated analytical and problem-solving skills.
  • Have strong written and verbal communication skills.
  • Be able to work in teams and collaborate effectively with people in different functions.
  • Have strong time management skills that enable on-time project delivery.
  • Be able to build strong, influential relationships.
  • Be able to work effectively in a fast-paced and rapidly changing environment.
  • Be able to take initiative and drive for results.

About the company

Texas Instruments designs and makes analog and embedded processing chips, the basic parts inside cars, factory equipment, data centers, and consumer electronics, and it sells one of the broadest chip catalogs in the industry. In 1958, its engineer Jack Kilby built the first integrated circuit, the building block of modern electronics, and later won a Nobel Prize for it. Its analog chips regulate power and convert signals such as sound and heat into data, while its microcontrollers act as small built-in computers, and TI earns money selling both to device makers. It also makes the graphing calculators many students use in math class. Texas Instruments was founded in 1930 and is based in Dallas, Texas.

Company Size

10,001+

Company Stage

IPO

Headquarters

Dallas, Texas

Founded

1930

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Simplify Jobs

Simplify's Take

What believers are saying

  • Cash is flowing again: after factory spending, TI kept $6.5 billion in the year to June 2026, versus $1.8 billion.
  • New plants mean jobs: TI's Sherman, Texas chip plant opened in December 2025, on a site planned for 3,000 jobs.
  • Stock grants pay steady income: TI raised its dividend 7% in September 2026, its 23rd straight yearly increase.

What critics are saying

  • Its closest rival is growing faster: Analog Devices' sales rose 40% in its quarter ended August 2026, versus TI's 23%.
  • Expect merger cost cuts: TI's purchase of wireless chipmaker Silicon Labs, agreed February 2026, targets $450 million in yearly savings.
  • Expect to work on-site: all 835 TI job postings in October 2026 were on-site, with none remote or hybrid.

What makes Texas Instruments unique

  • It controls its own supply: TI makes most chips in its own factories and targets over 95% in-house by 2030.
  • It skips the middlemen: over 80% of TI's 2025 revenue came from direct sales, including its TI.com store, not distributors.
  • Insiders run TI: CEO Haviv Ilan joined in 1999, and CFO Julie Knecht, named June 2026, has 25-plus years there.

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Benefits

  • Hybrid Work Options

Growth & Insights and Company News

Headcount

6 month growth

4%

1 year growth

3%

2 year growth

3%
Embedded.com
Oct 13th, 2026
TI unveils 3-GSPS ADC for AI Data Centers at OCP.

TI unveils 3-GSPS ADC for AI Data Centers at OCP. OCP demonstrations include TI's new 3-GSPS ADC, 800-V hot-swap controller, and BAW oscillator for AI infrastructure. Texas Instruments Inc. (TI) has claimed the industry's first analog-to-digital converter (ADC) to enable 24/7 event-based remote monitoring at nanosecond resolution for AI data centers. Introduced at the Open Compute Project (OCP) Global Summit, TI will demo the ADC34DSO75 ADC, along with the new LMI800PS hot-swap controller and LMK6B bulk acoustic wave (BAW)-based oscillator, addressing the challenges of scaling AI infrastructures. Partner Content Enabling real-time nanosecond-level telemetry, TI claims the ADC34DSO75 is the industry's highest performance 3 gigasamples per second (GSPS) ADC, detecting transient power-rail glitches thousands of times faster than current solutions, minimizing downtime in AI data centers. The ADC detects and captures transient fault events in real time thanks to the combination of the ultra-high-speed sampling with advanced on-chip digital signal processing in a flip-chip chip-scale package (FCCSP), measuring 13.8 x 13.8 mm. The ADC offers hyperscalers "unmatched remote diagnostic capabilities at a fraction of the size and cost of conventional monitoring methods," TI said. TI also introduced the LMI800PS, claiming the industry's first 800-V isolated hot-swap controller. It supports both +/-400-V and 800-V distributions to provide a scalable solution for diverse rack architectures. This highly integrated device can replace a discrete solution that requires five ICs. Delivering in-rush current and power path protection in a high-density package, the device integrates an isolated bias supply and PMBus telemetry, which reduces board area by more than 60% and simplifies high-voltage designs. Enabling safe power insertion and fast fault isolation, the LMI800PS meets safety standards with 5-kVrms reinforced isolation and more than 8-mm creepage, preventing a single load failure from disrupting the shared power bus. Also unveiled at OCP is the LMK6B BAW-based oscillator. TI developed the oscillator with best-in-class jitter performance and power-supply rejection ratio (PSRR) to improve signal integrity in AI-driven networking. TI said the margin for timing error shrinks as data center transmission rates approach 3.25 Tbits/s. The BAW oscillator provides jitter performance of 9.6 fs at 625 MHz. Demonstrations will be on display in TI's booth, No. E45, at OCP. TI will also showcase its 800-VDC power solutions as part of Nvidia's MGX AI Factory Ecosystem wall, and TI's power electronics engineer David Reusch will present "800-V Data Center DC/DC Design Considerations, Topology Comparisons and Trade-Offs," on Oct. 15 at 2:45 p.m. in room 230A. VIRTUAL events. Industry summits * | Electronica Forums 2026 * | Arrow New Space Technology Summit 2026 * | Autonomous Agriculture Technology Summit 2027 EXPERT-LED webinars. ON DEMAND or Live * | Edge-first Architectures for Building and Campus Safety - EE Times * | Lower Risk, Save Costs with Certified WiFi & BLE Modules - EE Times * | Power Distribution Systems Electrification Evolution - EE Times Featured WHITE PAPERS. Technical Resources * | Loop Compensation and Decoupling Design with "The Loop Compensator" - EE Times * | Selecting the Correct Level of DC-DC Converter for Your Application - EE Times * | The Future of Open Cable Systems: Conditional Access Migrates to DCAS - EE Times

TimesTech
Oct 13th, 2026
TI unveils ADC for nanosecond-level telemetry in AI data centers.

TI unveils ADC for nanosecond-level telemetry in AI data centers. October 13, 2026 At the Open Compute Project (OCP) Global Summit, Texas Instruments debuted the first analog-to-digital converter (ADC) to enable 24/7, low-power, event-based remote monitoring at nanosecond resolution. As AI workloads rapidly increase, data center operators face significant challenges around power instability, inadequate real-time monitoring and signal degradation, all of which can lead to costly downtime. TI is addressing these challenges through its new ADC device and other analog solutions designed to tackle the challenges of scaling artificial intelligence (AI) infrastructures. Demonstrations on display in TI's booth, No. E45, at OCP include: * Real-time nanosecond-level telemetry: TI's ADC34DSO75 is the industry's highest performance 3 gigasamples per second (GSPS) ADC, enabling 24/7, low-power, event-based remote monitoring at nanosecond resolution - thousands of times faster than what current solutions offer. Existing monitoring solutions often fail to detect the nanosecond-level power-rail glitches that cause costly, unplanned downtime in data centers. By combining ultra-high-speed sampling with advanced on-chip digital signal processing in a small form factor, the ADC34DSO75 detects and captures transient fault events in real time. As the industry's first solution to offer fully remote, event-based telemetry, the device eliminates the need for on-site debugging and oscilloscopes. By providing continuous, high-resolution monitoring of low-voltage, high-current power rails, the ADC34DSO75 helps data centers minimize downtime - which can cost operators hundreds of thousands of dollars an hour - while optimizing grid power efficiency. This compact, efficient solution offers hyperscalers unmatched remote diagnostic capabilities at a fraction of the size and cost of conventional monitoring methods. * Reliable high-voltage power delivery: The LMI800PS is the industry's first 800V isolated hot-swap controller, replacing a complex discrete solution requiring five integrated circuits with a single high-density package that delivers in-rush current and power path protection. The integration of an isolated bias supply and PMBus telemetry reduces board area by more than 60% and simplifies high-voltage designs. The LMI800PS enables safe power insertion and fast fault isolation, meeting safety standards with 5kVrms reinforced isolation and more than 8mm creepage. This prevents a single load failure from disrupting the shared power bus and maximizes data center stability. Supporting both +/-400V and 800V distributions, the device provides a scalable solution for diverse rack architectures, accelerating the deployment of high-efficiency power systems required for next-generation AI infrastructures. * Ultra-low jitter signal integrity: The LMK6B is a bulk acoustic wave (BAW)-based oscillator that delivers best-in-class jitter performance and power-supply rejection ratio (PSRR). As data center transmission rates approach 3.2Tbps, the margin for timing error shrinks significantly, and even minute jitter can increase bit error rates and cause system instability. The LMK6B provides industry-leading jitter performance of 9.6fs at 625MHz, ensuring reliable performance and preserving signal integrity for next-generation, AI-driven networking infrastructures. "As AI workloads drive massive scale, the need for real-time visibility and architectural stability has never been greater," said Karthik Vasanth, vice president and general manager for TI's Data, Converters and Clocks business unit. "By delivering industry-leading solutions for high-speed telemetry, advanced power protection and precision timing, TI is enabling hyperscalers and operators to design the next generation of AI data centers with optimized performance and minimal downtime."

Power Electronics News
Oct 12th, 2026
TI unveils high-speed ADC for AI data center monitoring.

TI unveils high-speed ADC for AI data center monitoring. The new portfolio combines transient fault detection, high-voltage power protection and precision clocking for AI infrastructure. Texas Instruments has introduced the ADC34DSO75, a 3-gigasamples-per-second (GSPS) analog-to-digital converter (ADC) designed to detect transient power events in AI data centers. The device enables continuous, low-power, event-based remote monitoring at nanosecond resolution, helping operators identify power disturbances that conventional monitoring systems may fail to capture. TI presented the ADC alongside new high-voltage power management and clocking solutions at the 2026 Open Compute Project (OCP) Global Summit. As AI workloads grow in scale and complexity, data centers face increasing demands for power delivery, real-time monitoring, and high-speed signal integrity. Brief power-rail glitches can cause system instability and unplanned downtime, while high-voltage distribution architectures require effective fault protection and isolation. The ADC34DSO75 combines high-speed sampling with on-chip digital signal processing to detect and capture transient events on low-voltage, high-current power rails. Its event-based monitoring approach supports continuous operation while reducing the need for on-site debugging and conventional oscilloscope-based measurements. The device is intended to improve remote diagnostics and help operators identify faults before they cause extended service interruptions. For high-voltage power distribution, TI introduced the LMI800PS, an 800V isolated hot-swap controller that integrates functions previously implemented using five separate integrated circuits. The device combines an isolated bias supply and PMBus telemetry in a single package, reducing board area by more than 60%. It provides inrush-current management and power-path protection, enabling controlled power insertion and rapid fault isolation. Supporting both +/-400V and 800V distribution architectures, the LMI800PS features 5kVrms reinforced isolation and more than 8mm of creepage distance. These features help prevent individual load failures from disrupting a shared power bus. Partner Content TI also highlighted the LMK6B bulk acoustic wave (BAW)-based oscillator, designed for low jitter and high power-supply rejection ratio (PSRR). It delivers 9.6fs jitter at 625MHz, supporting timing accuracy and signal integrity in high-speed networking systems as data transmission rates increase toward 3.2Tbps. In addition, TI will demonstrate 800V DC power solutions for NVIDIA's MGX AI Factory Ecosystem, including hot-swap protection and 800V-to-12V and 800V-to-6V DC/DC conversion. The latter incorporates gallium nitride (GaN) power stages for high-density power conversion. The company also scheduled a technical presentation on 800V data center DC/DC design considerations, topology comparisons, and trade-offs for October 15, 2026, at the OCP Global Summit in San Jose, California. Events & summits. Industry Conferences * | Electronica Forums 2026 * | Arrow New Space Technology Summit 2026 * | Autonomous Agriculture Technology Summit 2027 Technical webinars. insights from experts * | Edge-first Architectures for Building and Campus Safety - EE Times * | Lower Risk, Save Costs with Certified WiFi & BLE Modules - EE Times * | Power Distribution Systems Electrification Evolution - EE Times Featured white papers. Technical Resources * | Loop Compensation and Decoupling Design with "The Loop Compensator" - EE Times * | Selecting the Correct Level of DC-DC Converter for Your Application - EE Times * | The Future of Open Cable Systems: Conditional Access Migrates to DCAS - EE Times Power electronics is playing an increasingly important role in various markets such as Automotive, Industrial, and Consumer. It is also an enabling technology for a wide range of new and improved functions that enhance automotive and smart grid performance, safety, and functionality. The challenging electric and thermal requests strongly influence the design of power electronic systems. Power Electronics News would be focused on main topics such as Power Converter, Motion Control, Semiconductor and Thermal Management. Power Electronics News eBook is an interactive approach to informing about the latest technologies, trends, and product innovations in specific markets.

PR Newswire
Oct 12th, 2026
TI unveils 3GSPS ADC for nanosecond AI data centre monitoring and an 800V hot-swap controller

Texas Instruments (TI) unveiled a new analog-to-digital converter (ADC) at the Open Compute Project Global Summit on October 12, 2026. The ADC34DSO75 enables 24/7, low-power remote monitoring at nanosecond resolution, which TI says is thousands of times faster than current solutions. Power-rail glitches that go undetected can cause unplanned downtime, which can cost data center operators hundreds of thousands of dollars an hour. The 3 gigasamples per second chip captures transient faults in real time, removing the need for on-site debugging and oscilloscopes. TI also introduced the LMI800PS, an 800V isolated hot-swap controller. It replaces a five-chip discrete design with one package and cuts board area by more than 60%. The LMK6B oscillator delivers 9.6fs jitter at 625MHz.

VMblog
Oct 12th, 2026
TI unveils new ADC to enable nanosecond-level telemetry and minimize downtime in AI data centers.

TI unveils new ADC to enable nanosecond-level telemetry and minimize downtime in AI data centers. At the Open Compute Project (OCP) Global Summit, Texas Instruments (TI) debuted the first analog-to-digital converter (ADC) to enable 24/7, low-power, event-based remote monitoring at nanosecond resolution. As AI workloads rapidly increase, data center operators face significant challenges around power instability, inadequate real-time monitoring and signal degradation, all of which can lead to costly downtime. TI is addressing these challenges through its new ADC device and other analog solutions designed to tackle the challenges of scaling artificial intelligence (AI) infrastructures. Demonstrations on display in TI's booth, No. E45, at OCP include: * Real-time nanosecond-level telemetry: TI's ADC34DSO75 is the industry's highest performance 3 gigasamples per second (GSPS) ADC, enabling 24/7, low-power, event-based remote monitoring at nanosecond resolution - thousands of times faster than what current solutions offer. Existing monitoring solutions often fail to detect the nanosecond-level power-rail glitches that cause costly, unplanned downtime in data centers. By combining ultra-high-speed sampling with advanced on-chip digital signal processing in a small form factor, the ADC34DSO75 detects and captures transient fault events in real time. As the industry's first solution to offer fully remote, event-based telemetry, the device eliminates the need for on-site debugging and oscilloscopes. By providing continuous, high-resolution monitoring of low-voltage, high-current power rails, the ADC34DSO75 helps data centers minimize downtime - which can cost operators hundreds of thousands of dollars an hour - while optimizing grid power efficiency. This compact, efficient solution offers hyperscalers unmatched remote diagnostic capabilities at a fraction of the size and cost of conventional monitoring methods. * Reliable high-voltage power delivery: The LMI800PS is the industry's first 800V isolated hot-swap controller, replacing a complex discrete solution requiring five integrated circuits with a single high-density package that delivers in-rush current and power path protection. The integration of an isolated bias supply and PMBus telemetry reduces board area by more than 60% and simplifies high-voltage designs. The LMI800PS enables safe power insertion and fast fault isolation, meeting safety standards with 5kVrms reinforced isolation and more than 8mm creepage. This prevents a single load failure from disrupting the shared power bus and maximizes data center stability. Supporting both +/-400V and 800V distributions, the device provides a scalable solution for diverse rack architectures, accelerating the deployment of high-efficiency power systems required for next-generation AI infrastructures. * Ultra-low jitter signal integrity: The LMK6B is a bulk acoustic wave (BAW)-based oscillator that delivers best-in-class jitter performance and power-supply rejection ratio (PSRR). As data center transmission rates approach 3.2Tbps, the margin for timing error shrinks significantly, and even minute jitter can increase bit error rates and cause system instability. The LMK6B provides industry-leading jitter performance of 9.6fs at 625MHz, ensuring reliable performance and preserving signal integrity for next-generation, AI-driven networking infrastructures. "As AI workloads drive massive scale, the need for real-time visibility and architectural stability has never been greater," said Karthik Vasanth, vice president and general manager for TI's Data, Converters and Clocks business unit. "By delivering industry-leading solutions for high-speed telemetry, advanced power protection and precision timing, TI is enabling hyperscalers and operators to design the next generation of AI data centers with optimized performance and minimal downtime." Topics: AI David Marshall is the founder of VMblog.com, one of the industry's longest-running independent publications covering modern data center technologies. What began as a focus on virtualization and cloud computing has expanded to cover the full spectrum of enterprise IT, including AI, security, and DevOps, making VMblog a trusted destination for vendor news, technology analysis, and industry commentary.Beyond publishing, David has spent his career at the intersection of technology and business, inventing, marketing, and launching a number of successful software companies and products, and building a reputation as a skilled marketing executive in the enterprise IT space.David is also a published author, having written two well-regarded books on virtualization and served as technical editor for two "For Dummies" titles covering virtualization and cloud computing. He co-founded CloudCow.com, a publication focused on cloud computing, and has been named a VMware vExpert every year since 2009, one of the longest continuous honoree streaks in the program's history.Connect with David on LinkedIn: https://www.linkedin.com/in/davidmarshall/