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MaxLinear

Fabless RF/analog/mixed-signal IC designer

Senior Staff Device Engineer

Hardware EngineeringConfirmed live in the last 24 hours
Full-timeIn-person

About the Job

Requirements

  • Deep understanding of semiconductor device physics, electromagnetic theory, circuit design fundamentals, and advanced process technology, including Fin/GAA-FET CMOS, SiGe BiCMOS, and HV/BCD processes.
  • Experience in semiconductor device design and characterization, device modeling for SPICE simulation, high-frequency measurements, and electromagnetic simulation.
  • A BS in Electrical Engineering or related field plus 7 years of experience, an MS plus 5 years of experience, or a Ph.D. plus 2 years of experience.
  • Strong communication, presentation, and documentation skills.

Responsibilities

  • Conduct research and development in semiconductor device engineering, especially device characterization for RF/analog and digital applications, analysis of device and interconnect variability and reliability, and development of SPICE models and PDK.
  • Design test structures for device layout and structure optimization and PDK development for advanced CMOS, SiGe BiCMOS, and HV/BCD technologies.
  • Perform electromagnetic and thermal analysis, including self-heating effect analysis, and extract SPICE model parameters for active and passive devices, metal interconnects, and substrates.
  • Collaborate with internal IC design and DEA/CAD groups to develop and improve PDK and foundation IPs.
  • Collaborate with foundry technology teams to review and analyze process technology, device characteristics, and device reliability.

About the Company

MaxLinear

Fabless RF/analog/mixed-signal IC designer

MaxLinear designs and sells RF, analog, and mixed-signal ICs for broadband, connectivity, infrastructure, and industrial markets. It offers system-on-chip solutions for cable broadband, fiber-to-the-home networks, and Wi-Fi, plus RF transceivers and high-speed interconnects for data centers, set-top boxes, automotive video systems, and mobile devices. It is a fabless company that outsources manufacturing to foundries like UMC and targets OEM, ODM, and module makers, expanding its portfolio through acquisitions such as Exar, Intel’s Home Gateway Platform Division, and NanoSemi. Its goal is to provide scalable, high-quality semiconductor solutions that enable reliable connectivity across home, mobile, automotive, and data-center applications, while growing through diversified products and strategic acquisitions.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Carlsbad, CA
Founded
2003

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