O

onsemi

Semiconductors for intelligent power and sensing

New Product Introduction

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeVietnamNo salary listedIn-person

About the Job

Requirements

  • A Bachelor of Science or Master of Science degree in Electrical Engineering, Mechanical Engineering, Materials Engineering, Science and Technology, Chemistry, Physics, or equivalent.
  • A minimum of 5 years of experience in semiconductor packaging and manufacturing.
  • Experience in assembly processes including plasma cleaning, coating, molding, plating chemistry, chemical deflash, trim, and form.
  • Knowledge of thermosetting plastics such as epoxy molding compound, plating chemistry, chemical deflash, lead frame, substrate, and direct bond copper ceramic.
  • Proficiency in engineering tools including AutoCAD, 8D, statistical process control (SPC), design failure mode and effects analysis (DFMEA), and design of experiments (DOE).
  • Ability to lead projects across the organization and culture in a fast-paced environment.
  • Ability to work as part of a team and independently.

Responsibilities

  • Introduce and maintain assembly processes and activities to meet manufacturing and quality requirements, working cross-functionally with central engineering, process, and other manufacturing teams to transfer, qualify, and ramp up new products, packages, and technologies.
  • Provide engineering support for all activities in the product development process.
  • Transfer new products, packages, and technologies; set up production and validate production runs in the factory; and ramp up to production.
  • Drive integrations and cross-functional work with other manufacturing departments, and ramp up volume, yield, cost, stability, and quality of new technologies into production.
  • Define risk assessments and risk mitigation plans, select bills of material (BOM), and define process flows.
  • Perform technical gap analysis and consider design for manufacturability and cost competitiveness.
  • Troubleshoot and investigate qualification failures and method issues, and perform root cause analysis.
  • Select materials, equipment, and manufacturing peripherals to meet quality, reliability, cost, yield, and production targets.
  • Drive improvement projects and work with unit process teams to improve stability, yield, cost, and quality.
  • Implement and fan out new products from engineering builds to manufacturable environments using tools such as factorial DOE, SIPOC, and Lean Six Sigma.
  • Perform other duties as assigned.

Desired Qualifications

  • Experience with power module packaging, reliability, and chip package (CPI).
  • Semiconductor or silicon/silicon carbide wafer processing experience is a plus.
  • Experience in data analysis using JMP, Minitab, or Power BI.

About the Company

onsemi

Semiconductors for intelligent power and sensing

onsemi designs and manufactures semiconductors with a focus on intelligent power and sensing technologies for automotive and industrial markets. Its products include power management ICs and sensors that regulate energy, monitor conditions, and provide control signals for EVs, ADAS, factory automation, robotics, and energy infrastructure. The company differentiates itself by its specialized emphasis on intelligent power and sensing across both sectors and through its direct OEM relationships and global distributor network. Its goal is to improve energy efficiency and enable smarter, more capable systems for electrification, autonomy, and sustainable energy solutions.

Company size
10,001+
Company stage
IPO
Headquarters
Scottsdale, AZ
Founded
1999

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