A

Applied Materials

Builds equipment for chip and display factories

New Product Manufacturing Engineer

Full-TimeUpdated on 10/15/2026
No salary listed
Expert
Singapore
In PersonTravel to supplier and contract manufacturer sites as required; travel is 10%.
Manufacturing & Process EngineeringManufacturing Engineering

About the job

Requirements
  • Extensive experience in New Product Manufacturing Engineering or System Engineering roles.
  • Strong experience in Factory Interfaces/Mainframe systems with Electrical and Mechanical integration.
  • Proven experience in New Product Introduction, system integration, and manufacturing support.
  • Expertise in bill of materials management, Design for Excellence, change control, and build execution.
  • Hands-on exposure to Controls or Customer Engineering Special design/test systems.
  • Strong capability in system-level troubleshooting and integration.
  • Experience working with global teams and contract manufacturers.
  • Strong understanding of electrical schematics, interconnects, and cable assemblies.
  • Experience in value analysis of schematics, cables, components, and bills of materials.
  • Fundamental knowledge of controllers and overall control system architecture.
  • Capability to validate OMS against MLO requirements, schematics, and cable configurations.
  • Knowledge of electrical system components and their functionality.
Responsibilities
  • Lead manufacturing readiness for Factory Interfaces/Mainframe platforms, including bills of materials, OMS, and build strategies.
  • Drive Design for Excellence (Design for Manufacturability, Test, and Assembly), engage early in New Product Introduction/PLC, and use digital mockups and virtual builds to identify manufacturability risks.
  • Own the New Product Introduction-to-high-volume-manufacturing transition, focusing on quality, cycle time, and system stability.
  • Act as system integrator across Electrical and Mechanical domains.
  • Lead or support managed builds, engineering builds, and qualification activities.
  • Drive Form-Fit-Function validation and system-level integration checks.
  • Support test engineering activities, including test procedures and fixture readiness.
  • Serve as primary subject matter expert for Factory Interfaces/Mainframe manufacturing issues.
  • Provide real-time troubleshooting for line-down and system-level issues.
  • Support bills of materials, system bills of materials, and configuration issues impacting production.
  • Enable technicians on system configuration, software imaging, and validation.
  • Reduce dependency on remote teams and improve issue turnaround time.
  • Lead root cause analysis and short-term corrective action for complex system issues, and drive long-term corrective actions and systemic improvements.
  • Resolve nonconformances, deviation material requests, supplier problem solving, engineering specification waivers, engineering change orders, and new supplier requests.
  • Support rework, containment, and shortage mitigation to avoid downtime and manage excess inventory.
  • Ensure accurate bill of materials and configuration alignment across systems through change management processes, including engineering change orders, new supplier requests, engineering specification waivers, supplier problem solving, and change control board processes.
  • Support daily operations and act as the manufacturing voice in design and system decisions.
  • Collaborate with Design, Test, Manufacturing, Product Management, Suppliers, and contract manufacturers.
  • Support continuous improvement, strategic initiatives, and process automation to improve New Product Introduction organization velocity and productivity, including cycle time, quality, regional capability, and Heavy Core initiatives.
  • Support supplier builds, first article validation, and contract manufacturer readiness; engage with regional contract manufacturers to resolve issues.
  • Examine, prepare, and verify technical drawings and specifications of electrical systems to ensure installation and operations conform to standards.
  • Analyze electrical schematics and harness designs.
  • Collaborate cross-functionally with design, quality, and supply chain teams to ensure product manufacturability and compliance with specifications.

About the company

A

Applied Materials

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Applied Materials designs and builds precision machines that chipmakers and display manufacturers use to form, shape and inspect thin layers of material. Its platforms handle steps such as depositing films and removing unwanted material, helping chipmakers create transistors and wiring at atomic scale. Customers include makers of logic chips and memory, as well as manufacturers of advanced displays. The company earns money from equipment sales, replacement parts and services, and factory software that schedules production and monitors manufacturing processes. Applied Materials was founded in 1967 and is headquartered in Santa Clara, California.

Company Size

10,001+

Company Stage

IPO

Headquarters

Santa Clara, California

Founded

1967

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Simplify Jobs

Simplify's Take

What believers are saying

  • Installed equipment brings repeat business: Applied Global Services sells long-term service agreements, replacement parts and equipment upgrades.
  • Sales are expanding: Applied's August 2026 report showed fiscal Q3 revenue of $9.12 billion, up 25% yearly.
  • Employees join profitable operations: Applied reported $3.08 billion of operating profit for fiscal Q3 in August 2026.

What critics are saying

  • Singapore manufacturing hires face late shifts: Applied's live engineering posting specifies 4 p.m. to 1:30 a.m. schedules.
  • Export compliance has real costs: Applied and its Korea subsidiary settled a $252 million penalty in February 2026.
  • Sales depend on China access: Applied's December 2025 filing attributed 30% of fiscal 2025 revenue to customers there.

What makes Applied Materials unique

  • Applied combines manufacturing steps under vacuum: its Endura copper platform integrates seven processes to protect delicate material interfaces.
  • Factory software reaches beyond chips: Applied SmartFactory serves battery and pharmaceutical manufacturers alongside semiconductor plants.
  • Research targets future chip generations: Applied's EPIC partners work on technology three to four generations ahead of production.

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Benefits

  • Health Insurance
  • Dental Insurance
  • Vision Insurance
  • Life Insurance
  • Disability Insurance
  • Relocation Assistance
  • Performance Bonus
  • Stock Options
  • Flexible Work Hours

Growth & Insights and Company News

Headcount

6 month growth

0%

1 year growth

-1%

2 year growth

-1%
Chief in Tech
Oct 16th, 2026
China's chip sector accelerates amid U.S. Export controls, redefining global tech dynamics.

China's chip sector accelerates amid U.S. Export controls, redefining global tech dynamics. 10/16/2026 Your morning in 30 seconds. * China's semiconductor industry surges ahead, fueled by U.S. export controls (Fortune). * Applied Materials and Intel announce a new partnership to accelerate AI-focused chipmaking (DQIndia). * ASML's hybrid bonder patent signals the next wave of advanced chip packaging (DigiTimes). * U.S. chipmakers' overseas production dependence exceeds 95%, SIA reveals (DigiTimes). * Asia startup funding tops $353M this week, led by Tessolve in semiconductors (Techloy). The lead. China's chip sector advances amid export controls. * China's domestic semiconductor sector is making rapid breakthroughs, with export controls from the U.S. acting as a catalyst for increased innovation and self-sufficiency (Fortune). * Recent advancements include new chip manufacturing capabilities and increased market share for Chinese suppliers. * The sector's progress is shifting the geopolitical balance in global technology supply chains. * U.S. restrictions, intended to slow China's progress, have instead accelerated domestic R&D and investment in Chinese chip firms. * The development raises questions about future supply chain resilience and the potential need for supplier diversification. * Source: Fortune * Why it matters: Executives must reassess supply chain strategies and risk exposure as geopolitical forces drive rapid realignment in global chip manufacturing. What changed. Applied Materials and Intel partner on AI chipmaking. * Applied Materials and Intel have formed a strategic collaboration to develop next-generation semiconductor fabrication processes tailored for AI workloads (DQIndia). * The partnership will focus on overcoming scaling challenges and boosting chip performance for advanced computing. * This move is designed to maintain a competitive edge in the race for AI hardware innovation. * Source: DQIndia * Implication: Tech leaders should watch for new fabrication technologies that could influence AI infrastructure roadmaps. ASML's hybrid bonder patent drives packaging innovation. * ASML has patented a hybrid bonder, a key enabler for advanced chip packaging as traditional scaling approaches hit physical limits (DigiTimes). * The technology is expected to improve efficiency and performance in semiconductor manufacturing. * This move reflects growing industry focus on packaging as a differentiator for next-gen chips. * Source: DigiTimes * Implication: Executives should evaluate how packaging advances may alter chip design, procurement, and partnerships. SIA finds U.S. Chipmakers rely heavily on overseas production. * The Semiconductor Industry Association (SIA) reports that U.S. chipmakers source 95% of their manufacturing equipment and materials from foreign suppliers (DigiTimes). * The finding contradicts previous assumptions about domestic self-sufficiency. * Heightened geopolitical risks highlight the need for robust supply chain strategies. * Source: DigiTimes * Implication: Supply chain diversification and contingency planning should be board-level priorities. Asia startup funding surges, led by Tessolve. * Asia's tech startups raised $353.73 million in the past week, with major investments in semiconductors, robotics, and electric mobility (Techloy). * Tessolve, a semiconductor firm, tops the funding list, reinforcing the region's growing influence in deep tech. * The funding landscape signals opportunities for new partnerships and expansion in Asia. * Source: Techloy * Implication: Executives exploring global growth should prioritize engagement with Asia's dynamic startup ecosystem. Cybersecurity job postings hit four-year low. * Cybersecurity job postings have dropped to the lowest level since 2022, according to Help Net Security. * Compliance roles are increasingly sought after, while CISO hiring remains volatile. * The trend suggests an industry-wide reevaluation of cybersecurity needs and workforce planning. * Source: Help Net Security * Implication: Rethink talent acquisition and upskilling strategies to align with evolving security priorities. Signals. * Iberdrola, BBVA, and Santander complete a €150M syndicated loan entirely on blockchain, advancing financial transparency (The Paypers). * Flipkart alumni advocate for ESOP buyouts, spotlighting ongoing debates over employee equity (Economic Times). * BTQ partners with MoonPay Korea to bolster stablecoin security, reinforcing the importance of digital asset protection (The Paypers). * Mastercard and BVNK launch a global money platform integrating fiat and stablecoin payments, aiming for real-time, cross-border efficiency (The Paypers). Chief in Tech Perspective: This week's deeptech surge is a call to action for women leaders in technology: proactive board engagement on supply chain, innovation, and cybersecurity is critical as global dynamics shift. Championing diverse leadership at the intersection of semiconductors, AI, and fintech will be essential for navigating risk and seizing new opportunities.

Tech in Asia
Oct 15th, 2026
Applied Materials opens $5B AI chip research hub with TSMC, Intel, Samsung, Micron and SK hynix

Applied Materials has unveiled an AI chip research hub that brings together chipmakers, equipment suppliers, and university researchers to develop chipmaking technologies for AI. The centre spans 600,000 square feet and includes nearly four acres of cleanroom space for semiconductor process technology and equipment research. Founding partners are TSMC, Intel, Samsung, Micron, and SK hynix. Research partners include Arizona State University, Stanford University, the University of California, Berkeley, the UCLA Samueli School of Engineering, and Rensselaer Polytechnic Institute. Applied Materials expects capital spending to reach about $5 billion over time as customer projects begin.

DIGITIMES
Oct 15th, 2026
Applied Materials targets US$5 billion advanced packaging revenue.

Applied Materials targets US$5 billion advanced packaging revenue. , San Francisco Oct 15, 2026, 10:23 0 Credit: DIGITIMES Applied Materials sees advanced packaging as a key growth lever as AI chips move to multi-die designs, with the company projecting more than US$5 billion in related revenue in the coming years... Picks for you

Yahoo Finance
Oct 14th, 2026
Applied Materials vs Intel: why the $9.1B-quarter equipment maker beats the foundry turnaround

A Motley Fool comparison of chip equipment maker Applied Materials and chipmaker Intel favours Applied Materials as the better 2026 buy, though the author suggests buying shares gradually. Applied Materials' revenue rose 25% to $9.1 billion in the quarter ended July 26, 2026, and net income rose 43% to $2.5 billion. Risks include cyclical demand and China, which made up 28% of revenue. In February 2026 it agreed to pay $252.5 million to settle US export allegations. Intel's second-quarter revenue also rose 25%, to $16.1 billion. It posted an $11.0 billion net loss, driven by a $12.5 billion noncash charge tied to its US government deal. Its foundry unit lost $2.1 billion, and an August share sale raising about $23 billion diluted existing owners. On valuation, Applied trades at 42.2x forward earnings against Intel's 77.7x.

工商時報
Oct 14th, 2026
Tech: Applied Materials bullish on AI equipment opportunities, operations expected to outperform market

Tech: Applied Materials bullish on AI equipment opportunities, operations expected to outperform market 2026.10.14 14:58 China Times Information [China Times reporter Lin Tzu-chieh in Taipei] Semiconductor equipment supplier Applied Materials is optimistic that continued expansion of AI infrastructure will drive demand for advanced foundry and logic, DRAM, and advanced packaging equipment. It expects that through 2030, wafer fab equipment (WFE) spending growth will be faster than over the past decade, and Applied Materials' operations are expected to continue outperforming the market in the coming years. At the SEMICON West 2026 North America International Semiconductor Exhibition investor breakfast, Applied Materials unveiled its long-term growth outlook. It aims to increase market share by more than 2 percentage points from 2025 to 2030, and by 2030 to raise non-GAAP gross margin and operating margin to approximately 54% and 40%, respectively. Applied Materials President and CEO Gary Dickerson said that the accelerating expansion of AI infrastructure is bringing a new wave of growth to the wafer fab equipment market. Applied Materials has established a leading position in areas that are growing rapidly and are critical to AI computing performance, energy efficiency, and cost, and with advanced service solutions helps customers improve yield and output. Applied Materials noted that competing for leadership in AI computing requires significantly accelerating technological innovation and capacity expansion to support the continued expansion of infrastructure, driving continued growth in wafer fab equipment investment on a scale surpassing any previous industry growth driver. From generative AI and agentic AI to physical AI, applications continue to grow and become increasingly diverse, and demand for semiconductors is rising accordingly. Applied Materials expects that from 2025 to 2030, advanced foundry and logic, DRAM, and advanced packaging will contribute about 75% of wafer fab equipment growth. The company ranks first in the process equipment market in all three of these areas and aims to increase its wafer fab equipment market share by more than 2 percentage points between 2025 and 2030. To support industry capacity expansion, Applied Materials uses its unique eBeam technology and advanced service solutions to help chipmakers accelerate the ramp of new process nodes into mass production and optimize yield, output, and cost efficiency in high-volume manufacturing environments. Applied Materials' eBeam equipment portfolio is expected to generate $2 billion in revenue in 2026. The services business is also a key focus for Applied Materials' medium- and long-term operational growth. As advanced process equipment becomes more complex, demand for related services is expected to continue increasing. Service business revenue is estimated to grow by more than 20% in 2026, with a target of exceeding $12 billion by 2030, representing a compound annual growth rate (CAGR) of 14%-16% (mid-teens). Applied Materials Senior Vice President and CFO Brice Hill said the company has continued to make strategic investments over the past decade to build a comprehensive portfolio of AI computing products and technologies. Facing AI-driven growth in the equipment market, Applied Materials will continue to focus on improving profitability and operating leverage while investing in R&D programs to drive future performance that continues to outperform the market. Given expectations for semiconductor industry growth, Applied Materials plans to more than double its R&D laboratories and manufacturing capacity from current levels by 2030. The company's recently inaugurated Equipment and Process Innovation and Commercialization (EPIC) Center in Silicon Valley has announced partnerships with 15 chipmakers, systems companies, equipment partners, and universities. At the same time, Applied Materials recently expanded its manufacturing infrastructure in Austin, Texas, Singapore, and Treviso, Italy, strengthening R&D and production capabilities. Financially, the company targets non-GAAP gross margin of about 54% and operating margin of about 40% by 2030, and is committed to returning 80%-100% of free cash flow to shareholders over the long term.