Tesla

Makes electric cars, robotaxis and grid batteries

Memory Design Engineer

Silicon & ASIC DesignConfirmed live in the last 24 hours

Full-timeAustin, TX, USANo salary listedIn-person

About the Job

Requirements

A degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent practical experience.
Extensive experience in memory module design, including LPDDR and/or 3D DRAM and/or HBM, with deep understanding of memory-cell architecture and LPDDR4x/5x/6 protocols.
Expertise in digital and analog design, including ultra-high-speed signal-integrity architecture; deep knowledge of equalization and calibration, Eye-Mask testing, and On-Die Termination tuning; skills in designing power-delivery networks for low-power design (DVFSL), Link ECC, on-die ECC, and design around the Per-Row Activation Counting protocol.
A track record of taking silicon memory designs from architecture through tape-out and silicon bring-up.
Hands-on experience working with memory or IP vendors to integrate and qualify third-party IP on a target process node.
Deep understanding of process-technology considerations affecting memory design, including timing, power, signal integrity, and yield.
Prior experience leading engineers or building a technical team, with the ability to hire top talent.
Experience working alongside SoC/ASIC architecture and design teams.

Responsibilities

Lead LPDDR and HBM memory design at Terafab, from architecture through implementation and qualification.
Partner with Tesla and SpaceX silicon-design teams to define memory requirements and specifications for current and future silicon products.
Engage directly with external memory and IP vendors to enable and optimize their designs for the Terafab process technology.
Hire, build, and lead a memory-design and development team, setting technical direction and engineering standards.
Drive trade-off decisions across performance, power, area, and cost to meet product timelines.
Establish design methodologies, flows, and best practices for memory design at Terafab.

Desired Qualifications

Experience in custom memory bit-cell design and layout.

Category	Terafab
Location	Austin, Texas
Requisition ID	277839
Type	Full-time

Job Description

We are building Terafab, a vertically integrated semiconductor factory at an unprecedented scale. The facility houses logic, memory, packaging, test, and lithography mask production under one roof, optimized for rapid iteration and maximum compute density per square foot. We are looking for a Memory Design Engineers/Lead to own LPDDR and HBM memory design at Terafab, our advanced silicon fabrication and design center. This is a rare opportunity to build a memory design discipline from the ground up, shape the memory architecture behind next-generation Tesla and SpaceX silicon, and hire the team that will execute on it. You will operate at the intersection of process technology, IP vendor ecosystems, and system-level silicon design — translating ambitious product requirements into a memory roadmap that is fast, manufacturable, and scalable across Tesla and SpaceX programs.

Job Responsibilities

Lead LPDDR and HBM memory design at Terafab, from architecture through implementation and qualification
Partner with Tesla and SpaceX silicon design teams to define memory requirements and specifications for current and future silicon products
Engage directly with external memory and IP vendors to enable and optimize their designs for the Terafab process technology
Hire, build, and lead a world-class memory design and development team, setting technical direction and engineering standards from day one
Drive trade-off decisions across performance, power, area, and cost to meet aggressive product timelines
Establish design methodologies, flows, and best practices for memory design at Terafab as the discipline scales

Job Requirements

Degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent practical experience
Extensive experience in memory module design including LPDDR and/or 3D DRAM, and/or HBM. Deep understanding of memory cell architecture and protocols (LPDDR4x/5x/6). Experience in custom memory bit-cell design and layout will be a plus
Expertise in Digital & Analog design including ultra-high speed signal integrity architecture. Deep knowledge of equalization & calibration, Eye-Mask testing, On-Die Termination (ODT) tuning. Skills in designing power delivery networks for low power design (DVFSL), Link ECC, on-die ECC, and designing around Per-Row Activation Counting (PRAC) protocol
Track record of taking silicon memory designs from architecture through tape-out and silicon bring-up
Hands-on experience working with memory or IP vendors to integrate and qualify third-party IP on a target process node
Deep understanding of process technology considerations affecting memory design (timing, power, signal integrity, yield)
Prior experience leading engineers or building a technical team, with the ability to hire top talent
Strong cross-functional collaboration skills, with experience working alongside SoC/ASIC architecture and design teams

About the Company

Tesla

Makes electric cars, robotaxis and grid batteries

Tesla makes electric cars and batteries that store power for homes and utilities, and it develops self-driving software and humanoid robots. In 2023, its Model Y became the first electric vehicle to rank as the world's best-selling car. Buyers order the Model 3 sedan, Model Y SUV, or Cybertruck pickup directly from Tesla instead of through dealers, and they charge on its Supercharger fast-charging network. It also sells Megapack and Powerwall batteries, runs a robotaxi service, and charges drivers a monthly fee for self-driving software that still needs their supervision. Tesla was founded in 2003, with Elon Musk as its lead early investor and a recognized co-founder, and it is based in Austin, Texas.

Company size: 10,001+
Company stage: IPO
Headquarters: Austin, TX
Founded: 2003

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