Technical Program Manager - Image Sensor & Process Integration

Summary

Imagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Here at Apple we don’t just create products — we create the kind of wonder that’s revolutionized entire industries. It’s the diversity of our people and their ideas that inspires the innovation that runs through everything we do, from amazing technology to industry-leading environmental efforts. Join Product Operations at Apple, and help us leave the world better than we found it.

Minimum Qualifications

7 + years technical understanding of semiconductor devices, involving problem solving and issue root cause analysis / data analysis in a pressured environment MS / PhD in Electrical Engineering, semiconductor devices, or allied technical subject

Preferred Qualifications

Interpersonal skills of leadership, communication, teamwork, project management, and influencing. Flexibility: Evening and weekends work will be required. The job also requires international travel. Good working knowledge of semiconductor devices and associated module components is preferred (e.g. silicon processing or III-V, etc.). Understanding of semiconductor processes (etch, litho, etc.) wafer test, yield, wafer fab process integration, wafer packaging, back-end issues. Familiarity with quality systems and quality control.

Description

You will take the lead in driving continuous improvement activities for semiconductor device processes during product development, ramp up and throughout the product lifetime. You will work with Apple’s internal engineering team, our semiconductor device vendors and downstream with module and system integrators. The scope covers image sensor devices used in all modules and all systems. And, the right candidate will work across multiple locations in various continents with on-site visits with our vendors.

Responsibilities

Set a vision for constant product quality and operational improvements year over year. Set aggressive yield targets and drive plans to achieve. Drive yield improvements through careful data analysis and process development. Be involved at product concept to ensure products are designed for manufacturing (DFM). Build in constant design improvement for product quality, factory efficiency and product cost. Influence vendor selection for new products. Approve vendor process flow, process quality control plan(tests, methods, sample sizes, pass /fail criteria), equipment list and qualification plan, and Cosmetic specs (Ensure cosmetic standards are aligned with Module integrators). Manage new process introduction and special projects. Approve device manufacturers for Mass production readiness. Ensure device vendors are conforming to Apple specs and requirements. Ensure timely test correlation activities and close test gaps between device, module, and system. Contribute to mass production release reviews and verify that all we are ready to ramp.  In mass production, lead resolution of device related quality issues in wafer fab, back-end processing, transit, and module integrator. Monitor and report yield, manufacturing metrics (CpK, FMEA etc.). Drive improvement programs as appropriate. Drive FACA for sensor related returns from integrators, field returns, and EFFA issues. Track, report and close out issues in a timely manner. Ensure 8D reports and PCNs are maintained accurately Raise and balance formal company-wide Quality Alerts Organize three-way meetings with device vendors and module integrators to get feedback on downstream issues and to ensure smooth co-working. Assist and arbitrate as needed. Manage the quality relationship with image sensor vendors. This involves regular face to face reviews, efficient vendor reporting systems and audits. Ensure qualification and reliability activities at vendors are in line with requirements. Regularly provide status reporting updates to executives and escalation when needed.