onsemi

Semiconductors for intelligent power and sensing

External Manufacturing NPI Engineer

Manufacturing EngineeringConfirmed live in the last 24 hours

Full-timeNo salary listedIn-person

About the Job

Requirements

Bachelor's degree in Engineering or Materials Science, or equivalent technical background.
More than 10 years of experience in a backend semiconductor integrated circuit manufacturing environment, with in-depth assembly process expertise and shop-floor experience.
Strong leadership and demonstrated project management skills across multi-stakeholder and cross-functional settings.
Prior experience in new product introduction, product/process integration, and familiarity with the Chip-to-Package Interaction effect.
Good overall understanding of outsourced semiconductor assembly and test business landscape and operations.
Strong engineering fundamentals, including design of experiments characterization, statistical process control, failure analysis, and problem-solving skills.
Proficiency in statistical analysis methods and familiarity with data analytics.
Good communication skills and proficiency in written and spoken English.

Responsibilities

Own backend external manufacturing new product introduction from conceptualization and development through qualification and production launch.
Provide functional leadership for new product introduction to deliver product lifecycle management requirements for new product commercialization and work with internal and external cross-functional stakeholders to achieve on-time market release.
Interface with and steer cross-functional team engagements across business units, central engineering, operations, quality, supply chain, and procurement to meet department objectives.
Drive design for manufacturability, technology, and manufacturability readiness for new packages and complex derivative platforms for effective process-of-record freeze and new product industrialization.
Partner with outsourced semiconductor assembly and test providers to deliver assembly readiness for new product qualification, including process flow and bill-of-materials setup, risk analysis and mitigation, process characterization, lookahead assessment, qualification, customer advisory board preparation, and first-part release.
Manage production ramp by leading production safe launch, providing technical support to resolve ramp issues, developing continuous improvement plans, and setting production baselines for transition into high-volume manufacturing.
Collaborate with internal and external partners on technology pathfinding, package roadmaps, and design rule and guideline development.
Adopt data analytics and a data-driven approach to problem-solving and decision-making.
Establish best known methods and best-in-class practices for new package platforms and disseminate them to production.
Participate in quality and process-readiness audits to achieve production-site readiness.
Work with operations to drive continuous yield improvement for evolving challenges.
Serve as the subject matter expert addressing package and assembly challenges.

Desired Qualifications

Hands-on assembly process experience in leading wafer technologies such as silicon carbide, gallium nitride, and CMOS image sensors.
Experience in integrated circuit package design, computer-aided design, simulation, or characterization.
Spoken proficiency in Mandarin.
Experienced candidates may be considered for a technical lead role managing a team of 5–6 people, including team performance, overall delivery, tactical and resource planning, and execution.

External Manufacturing NPI Lead

Bachelor's Degree in Engineering/ Materials Science or equivalent technical background
More than 10 years of experience in backend semiconductor IC manufacturing environment, with in-depth assembly process expertise and shop floor experience
Strong leadership with demonstrated project management skills across multi-stakeholder and cross-functional settings
Hands-on assembly process experience in leading wafer technology such as SiC, GaN and CIS Imaging is highly desirable
Prior experience in NPI, product/ process integration and familiar with Chip-to-Package Interaction (CPI) effect
Experience in IC package design/ CAD/ simulation/ characterization will be advantageous
Good overall understanding of OSAT business landscape and operations
Adept at cross-functional collaboration, Adaptable to matrix organization, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem-solving skills
Strong project management skills and multi-stakeholder management
Proficient in statistical analysis methods and familiar with data analytics
Good communication skills and proficient in written & spoken English. Spoken proficiency in Mandarin will be advantageous

Own backend external manufacturing NPI from conceptualization, development, qualification to production launch
Functional Leadership for NPI to deliver PLM requirements for new product commercialization and to co-work with cross functional team (comprising both internal and external stakeholders) to achieve on-time market release
Interface & steer cross-functional team engagements across Business Units, Central Engineering, Operations, Quality, Supply Chain and Procurement to meet department objectives
Drive DFM, technology & manufacturability readiness for new package & complex derivative platforms for effective POR freeze to new product industrialization
Partner with OSATs to deliver assembly readiness for new product qualification. Key activities include process flow & BOM setup, risk analysis & mitigation, process characterization, lookahead assessment, qualification and CAB preparation leading to first part release
Manage production ramp: lead production safe launch, provide technical support to resolve ramp issues, develop CIP, set production baseline for transition into HVM
Collaborate with internal & external partners for technology pathfinding, package roadmap as well as design rules/ guideline development
Adoption of data analytics and data-driven approach to problem solving and decision making
Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform and fan-out to production
Participate in quality and process readiness audit to achieve production site readiness
Co-work with operations to drive continuous yield improvement for evolving challenges
Subject Matter Expert to address arising package and assembly challenges
Experienced candidate(s) will be considered for technical lead role to manage team (5-6 person) team’s performance including overall delivery, tactical, resource planning & execution

About the Company

onsemi

Semiconductors for intelligent power and sensing

onsemi designs and manufactures semiconductors with a focus on intelligent power and sensing technologies for automotive and industrial markets. Its products include power management ICs and sensors that regulate energy, monitor conditions, and provide control signals for EVs, ADAS, factory automation, robotics, and energy infrastructure. The company differentiates itself by its specialized emphasis on intelligent power and sensing across both sectors and through its direct OEM relationships and global distributor network. Its goal is to improve energy efficiency and enable smarter, more capable systems for electrification, autonomy, and sustainable energy solutions.

Company size: 10,001+
Company stage: IPO
Headquarters: Scottsdale, AZ
Founded: 1999

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