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Kandou AI

Provides chip-to-chip AI connectivity solutions

Characterization Engineer

Hardware Validation & TestingConfirmed live in the last 24 hours
Full-timeSaint-Sulpice, SwitzerlandNo salary listed

About the Job

Requirements

  • Proven experience characterizing silicon devices over process, voltage, and temperature (PVT).
  • Proven experience using lab equipment such as high-speed oscilloscopes, vector network analyzers (VNAs), and spectrum analyzers.
  • Experience defining test plans and test procedures.
  • Experience with Python or another object-oriented programming language for test automation, data analysis, and report generation.
  • At least 5 years of relevant work experience.
  • Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or equivalent work experience.
  • Self-motivated, with a strong sense of ownership and responsibility.
  • Good communication skills and experience working in cross-functional teams.
  • Strong interest in characterizing high-speed analog circuits.
  • Solid understanding of, or ability to learn, signal integrity (SI) concepts, modulation schemes, and transmitter and receiver fundamentals.
  • Ability to multitask in a high-energy environment.

Responsibilities

  • Lead end-to-end characterization of high-speed Serializer/Deserializer (SerDes) operating at symbol rates above 20 Gbaud.
  • Perform jitter, eye-diagram, bit-error-rate (BER), and margin measurements across process, voltage, and temperature (PVT).
  • Characterize full transmitter and receiver electrical parameters.
  • Perform S-parameter, time-domain reflectometry (TDR), and insertion-loss measurements.
  • Collaborate with IP architects and digital and analog design teams.
  • Document test results and procedures.
  • Write and architect test scripts for automation in Python.

Desired Qualifications

  • Experience with pulse-amplitude modulation (PAM) or multi-tonal modulation schemes.
  • Experience in SerDes characterization.
  • Schematic entry or printed circuit board (PCB) design.

About the Company

Kandou AI

Provides chip-to-chip AI connectivity solutions

Kandou AI designs and sells semiconductor connectivity hardware for AI workloads. It provides a memory fabric and CXL controllers that link processors to memory, enabling scalable, energy-efficient AI inference and training clusters built from affordable hardware. Using Copper MIMO interconnect, it reduces energy per bit and supports features like offloading AI training collectives, switchless memory for in-memory databases, and field-repairable co-packaged optics for better cooling. By targeting the data-movement bottleneck between processors and memory and offering chiplet-based fabrics and IP licensing, Kandou AI aims to make scalable AI infrastructure more accessible to hyperscalers, data centers, and system integrators.

Company size
201-500
Company stage
Late Stage VC
Total funding
$504.7M
Headquarters
Lausanne, Switzerland
Founded
2011

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