NXP Semiconductors

Automotive semiconductors and secure embedded solutions

Mold PM Technician

Equipment MaintenanceConfirmed live in the last 24 hours

Full-timeKuala Lumpur, Federal Territory of Kuala Lumpur, MalaysiaNo salary listedIn-person

About the Job

Requirements

A Diploma or Certificate in Mechanical, Mechatronics, or a related field is required.
Experience in mold tooling, equipment maintenance, or manufacturing operations is required.
Strong troubleshooting and mechanical maintenance skills are required.
Ability to work independently and support shift operations is required.

Responsibilities

Perform preventive maintenance, troubleshooting, repair, and setup of mold tooling systems.
Disassemble and reassemble molds.
Inspect equipment and prevent defects.
Qualify tools.
Support continuous improvement activities to achieve high equipment uptime and manufacturing efficiency.

Desired Qualifications

Semiconductor manufacturing experience is an advantage.

We are seeking a hands-on technician to perform preventive maintenance, troubleshooting, repair, and setup of mold tooling systems. The role involves mold disassembly/reassembly, equipment inspection, defect prevention, tool qualification, and supporting continuous improvement activities to achieve high equipment uptime and manufacturing efficiency.

Requirements:

Diploma/Certificate in Mechanical, Mechatronics, or related field.
Experience in mold tooling, equipment maintenance, or manufacturing operations.
Strong troubleshooting and mechanical maintenance skills.
Able to work independently and support shift operations.
Semiconductor manufacturing experience is an advantage.

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About the Company

NXP Semiconductors

Automotive semiconductors and secure embedded solutions

NXP Semiconductors designs and sells semiconductor chips for vehicles and other devices. Its products include automotive-grade microcontrollers and other ICs used in engines, infotainment, safety systems, and networked car architectures. These chips process data, run software, and enable features such as advanced driver assistance and vehicle connectivity, often with strong security and real-time performance. Unlike some peers, NXP became an independent company after Philips spun off its semiconductor unit in 2006 and later merged with Freescale in 2015, building a focused strength in automotive semiconductors and microcontrollers. This gives it a clear niche in the market and the goal of growing as a standalone leader in smarter, connected vehicles and related technologies.

Company size: 10,001+
Company stage: IPO
Headquarters: Eindhoven, Netherlands
Founded: 2004

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